US5240813A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Polysilphenylenesiloxane, production process thereof, and resist material and semiconductor device formed thereof
Assignee: Fujitsu Ltd
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Filing: 1990-11-15
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Granted: 1993-08-31
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Expires: 2010-11-15
Abstract
Abstract Novel polysilphenylenesiloxanes having a three-dimensional mesh structure of silphenylenesiloxane core surrounded by triorganosilyl groups, which have a good sensitivity to ionizing radiations such as deep ultraviolet rays, electron beams and X-rays, a high softening point of 400° C. or more, and a good resistance to O 2 -plasma etching, and exhibit a high contrast and low swelling. These polysiphenylenesiloxanes are useful as a resist material, especially a top layer resist of the bi-level resist system and an interlevel dielectric or heat-resisting protective layer. The resist material has a high resolution because of a high contrast, low swelling and high thermal resistance thereof.
Inventors
- 👤 Keiji Watanabe
- 👤 Akira Oikawa
- 👤 Shun-ichi Fukuyama
- 👤 Masaaki Yamagami
- 👤 Takahisa Namiki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 13:16
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/075; G03F7/0757; C; C08; C08G; C08G77/00; C08G77/48; C08G77/50; C08G77/52; Y; Y10; Y10S; Y10S430/00; Y10S430/143; Y10S430/167; Y10S430/168; Y10S438/00; Y10S438/942; Y10S438/948
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
62 words
A polysilphenylenesiloxane represented by the following structural formula (I): ##STR9## in which R may be the same or different, and each represents a hydrogen atom or a monovalent hydrocarbon group, and m and n each represents a positive integer; the polysilphenylenesiloxane having a three-dimensional mesh structure of silphenylsenesiloxane core surrounded by triorganosilkyl groups, and a weight-average molecular weight of 1,000 to 5,000,000.
Claim 2
Dependent Claim
62 words
A polysilphenylenesiloxane represented by the following structural formula (I): ##STR9## in which R may be the same or different, and each represents a hydrogen atom or a monovalent hydrocarbon group, and m and n each represents a positive integer; the polysilphenylenesiloxane having a three-dimensional mesh structure of silphenylsenesiloxane core surrounded by triorganosilkyl groups, and a weight-average molecular weight of 1,000 to 5,000,000.
Claim 3
Dependent Claim
39 words
A polysilphenylenesiloxane according to claim 1, in which the monovalent hydrocarbon group of R is selected from the group consisting of methyl, ethyl, hexyl, 1-chloromethyl, 1-chloroethyl, 2-phenylethyl, 2-phenylpropyl, methoxy, ethoxy, vinyl, allyl, epoxy, aryl group, and halogenated aryl group.
Claim 4
Dependent Claim
16 words
A polysilphenylenesiloxane according to claim 1, and having a softening point of 400° C. or more.
Claim 5
Dependent Claim
66 words
A resist material which comprises polysilphenylenesiloxane represented by the following structural formula (I): ##STR10## in which R may be the same or different, and each represents a hydrogen atom or a monovalent hydrocarbon group, and m and n each represents a positive integer; the polysilphenylenesiloxane having a three-dimensional mesh structure of silphenylenesiloxane core surrounded by triorganosilyl groups, and a weight-average molecular weight of 1,000 to 5,000,000.
Claim 6
Dependent Claim
66 words
A resist material which comprises polysilphenylenesiloxane represented by the following structural formula (I): ##STR10## in which R may be the same or different, and each represents a hydrogen atom or a monovalent hydrocarbon group, and m and n each represents a positive integer; the polysilphenylenesiloxane having a three-dimensional mesh structure of silphenylenesiloxane core surrounded by triorganosilyl groups, and a weight-average molecular weight of 1,000 to 5,000,000.
Claim 7
Dependent Claim
40 words
A resist material according to claim 4, in which the monovalent hydrocarbon group of R is selected from the group consisting of methyl, ethyl, hexyl, 1-chloro-methyl, 1-chloroethyl, 2-phenylethyl, 2-phenylpropyl, methoxy, ethoxy, vinyl, allyl, epoxy, aryl group and halogenated aryl group.
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