US5232962A
Expired / Lapsed
US
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Adhesive bonding composition with bond line limiting spacer system
Assignee: Henkel Loctite Corp
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Filing: 1991-10-09
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Granted: 1993-08-03
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Expires: 2011-10-09
Abstract
Abstract An adhesive bonding composition with bond line limiting spacer system includes an adhesive paste composition having a hardenable adhesive component, and a plurality of spacer elements distributed in the adhesive paste composition. The spacer elements are sized to provide a self-limiting bond line thickness between the surfaces to be bonded, the bond line thickness being maintained at a selected lower limit by the spacer elements.
Inventors
- 👤 Stephen M. Dershem
- 👤 Jose A. Osuna, Jr.
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 14:06
CPC Classifications
C; C09; C09J; C09J5/00; H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W72/00; H10W72/071; H10W72/073; H10W72/07321; H10W72/07327; H10W72/07331; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
110 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from Wood's metal.
Claim 2
Dependent Claim
110 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from Wood's metal.
Claim 3
Dependent Claim
123 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from an alloy consisting of 49% Bi, 21% In, 18% Pb, and 12% Sn, by weight.
Claim 4
Dependent Claim
123 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from an alloy consisting of 49% Bi, 21% In, 18% Pb, and 12% Sn, by weight.
Claim 5
Dependent Claim
121 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from an alloy consisting of 52% Bi, 32% Pb, and 15.5% Sn, by weight.
Claim 6
Dependent Claim
121 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from an alloy consisting of 52% Bi, 32% Pb, and 15.5% Sn, by weight.
Claim 7
Dependent Claim
107 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible plastic balls.
Claim 8
Dependent Claim
107 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible plastic balls.
Claim 9
Dependent Claim
125 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from polypropylene carbonate, said adhesive paste composition further including a compatible combination of one or more organic compounds.
Claim 10
Dependent Claim
125 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste for attaching a semiconductor die to a ceramic substrate and said spacer elements are collapsible balls made from polypropylene carbonate, said adhesive paste composition further including a compatible combination of one or more organic compounds.
Claim 11
Dependent Claim
117 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive vehicle is a silver-glass paste for attaching a semiconductor die to a ceramic substrate, said spacer elements are collapsible balls made from polypropylene carbonate, and said adhesive paste composition includes an organic solvent.
Claim 12
Dependent Claim
117 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive vehicle is a silver-glass paste for attaching a semiconductor die to a ceramic substrate, said spacer elements are collapsible balls made from polypropylene carbonate, and said adhesive paste composition includes an organic solvent.
Claim 13
Dependent Claim
126 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste, including an organic vehicle, for attaching a semiconductor die to a ceramic substrate, said spacer elements are collapsible balls made from polyisobutyl methacrylate, and said organic vehicle of said adhesive paste composition consists of siloxane fluids.
Claim 14
Dependent Claim
126 words
A semiconductor die-attach paste bonding composition for providing an adhesive bond between a pair of surfaces in a semiconductor device, said composition comprising: an adhesive paste composition having a hardenable adhesive component therein; a plurality of spacer elements distributed in said adhesive paste composition; said spacer elements being sized to provide a self-limiting bond line thickness between the surfaces to be bonded, said bond line thickness being maintained at a selected lower limit by the size of said spacer elements; and wherein said adhesive paste composition is a silver-glass paste, including an organic vehicle, for attaching a semiconductor die to a ceramic substrate, said spacer elements are collapsible balls made from polyisobutyl methacrylate, and said organic vehicle of said adhesive paste composition consists of siloxane fluids.
Claim 15
Dependent Claim
77 words
A semiconductor die-attach paste bonding composition for attaching a semiconductor die to a ceramic substrate, the bonding composition comprising: an adhesive paste composition consisting of: approximately 60 to 85 percent silver; approximately 7 to 20 percent glass frit having a softening temperature of less than about 400° C.; approximately 0 to 2 percent resin; approximately 6 to 20 percent organic solvent (or organic non-solvent); and approximately 0.1 percent collapsible spacer elements distributed in said adhesive paste composition
Claim 16
Dependent Claim
77 words
A semiconductor die-attach paste bonding composition for attaching a semiconductor die to a ceramic substrate, the bonding composition comprising: an adhesive paste composition consisting of: approximately 60 to 85 percent silver; approximately 7 to 20 percent glass frit having a softening temperature of less than about 400° C.; approximately 0 to 2 percent resin; approximately 6 to 20 percent organic solvent (or organic non-solvent); and approximately 0.1 percent collapsible spacer elements distributed in said adhesive paste composition
Claim 17
Dependent Claim
19 words
The bonding composition of claim 8 wherein said spacer elements are made from a collapsible, non-charring, depolymerizable, solvent-resistant material.
Claim 18
Dependent Claim
18 words
The bonding composition of claim 8 wherein said spacer elements are made from a low melting point alloy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-08-02 | 1997-02-01 | 1997-08-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-08-02 | 2001-02-01 | 2001-08-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-08-02 | 2005-02-01 | 2005-08-03 | $7700.00 | Window Closed / Lapsed |