Patent US5227812A successfully refreshed from Google Patents.
US5227812A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Liquid jet recording head with bump connector wiring
Assignee: Canon Inc
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Filing: 1992-10-14
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Granted: 1993-07-13
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Expires: 2012-10-14
Abstract
Abstract In the wiring portion in the wiring substrate constituting a recording head of a liquid jet type recording apparatus, two electroconductive layers are connected through a protective layer that includes at least two unit layers. One unit layer is formed with a through hole having a shape and size different from those of the through hole(s) in the remaining unit protective layer(s), thereby assuring the formation of an electric connection portion and improving durability of the electric connection portion.
Inventors
- 👤 Yasutomo Watanabe
- 👤 Hideo Tamura
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 19:35
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/005; B41J2/01; B41J2/135; B41J2/16; B41J2/1621; B41J2/164; B41J2/1646; B41J2/14; B41J2/14016; B41J2/14088; B41J2/14112; B41J2/14129; B41J2/1601; B41J2/1604; B41J2/1623; B41J2/1626; B41J2/1628; B41J2/1629; B41J2/1631; B41J2/1643; H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K1/112; B41J2202/00; B41J2202/01; B41J2202/19; H05K2201/00; H05K2201/01; H05K2201/0183; H05K2201/0195; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09436; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K3/00; H05K3/40; H05K3/4007
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
148 words
A wiring substrate for electrically connecting a recording head to a semiconductor device, said substrate comprising: an insulated substrate; a wiring portion arranged on said insulated substrate along with an electroconductive layer; and an interlayer protective layer, which includes at least two protective layers, provided on said electroconductive layer such that at least a part of said electroconductive layer is exposed, said protective layers being formed with respective through holes for connecting said electroconductive layer below said protective layers to another electroconductive layer above said protective layers, said through hole of at least one of said protective layers having a size or shape different from the size or shape of said through hole in at least one remaining protective layer, wherein only one of said protective layers is in contact with and positioned on said electroconductive layer at the vicinity of the exposed portion of said electroconductive layer.
Claim 2
Dependent Claim
148 words
A wiring substrate for electrically connecting a recording head to a semiconductor device, said substrate comprising: an insulated substrate; a wiring portion arranged on said insulated substrate along with an electroconductive layer; and an interlayer protective layer, which includes at least two protective layers, provided on said electroconductive layer such that at least a part of said electroconductive layer is exposed, said protective layers being formed with respective through holes for connecting said electroconductive layer below said protective layers to another electroconductive layer above said protective layers, said through hole of at least one of said protective layers having a size or shape different from the size or shape of said through hole in at least one remaining protective layer, wherein only one of said protective layers is in contact with and positioned on said electroconductive layer at the vicinity of the exposed portion of said electroconductive layer.
Claim 3
Dependent Claim
37 words
The wiring substrate as claimed in claim 1, wherein said another electroconductive layer above said protective layers of said wiring portion comprises a bump electrode which is connected to the semiconductor device arranged on said insulated substrate.
Claim 4
Dependent Claim
28 words
The wiring substrate as claimed in claim 1, wherein said one protective layer overlapping said electroconductive layer has a thickness smaller than that of the remaining protective layers.
Claim 5
Dependent Claim
152 words
A recording head comprising a wiring substrate for electrically connecting said recording head to a semiconductor device, said substrate having: an insulated substrate; a wiring portion arranged on said insulated substrate along with an electroconductive layer; and an interlayer protective layer, which includes at least two protective layers, provided on said electroconductive layer such that at least a part of said electroconductive layer is exposed, said protective layers being formed with respective through holes for connecting said electroconductive layer below said protective layers to another electroconductive layer above said protective layers, said through hole of at least one of said protective layers having a size or shape different from the size or shape of said through hole in at least one remaining protective layer, wherein only one of said protective layers is in contact with and positioned on said electroconductive layer at the vicinity of the exposed portion of said electroconductive layer.
Claim 6
Dependent Claim
152 words
A recording head comprising a wiring substrate for electrically connecting said recording head to a semiconductor device, said substrate having: an insulated substrate; a wiring portion arranged on said insulated substrate along with an electroconductive layer; and an interlayer protective layer, which includes at least two protective layers, provided on said electroconductive layer such that at least a part of said electroconductive layer is exposed, said protective layers being formed with respective through holes for connecting said electroconductive layer below said protective layers to another electroconductive layer above said protective layers, said through hole of at least one of said protective layers having a size or shape different from the size or shape of said through hole in at least one remaining protective layer, wherein only one of said protective layers is in contact with and positioned on said electroconductive layer at the vicinity of the exposed portion of said electroconductive layer.
Claim 7
Dependent Claim
37 words
The recording head as claimed in claim 4, wherein said another electroconductive layer above said protective layers of said wiring portion comprises a bump electrode which is connected to the semiconductor device arranged on said insulated substrate.
Claim 8
Dependent Claim
28 words
The recording head as claimed in claim 4, wherein said one protective layer overlapping said electroconductive layer has a thickness smaller than that of the remaining protective layers.
Claim 9
Dependent Claim
176 words
A recording apparatus comprising: a recording head including a wiring substrate for electrically connected said recording head to a semiconductor device, said substrate having: an insulated substrate, a wiring portion arranged on said insulated substrate along with an electroconductive layer, and an interlayer protective layer, which includes at least two protective layers, formed on said electroconductive layer such that at least a part of the electroconductive layer is exposed, said protective layers being formed with respective through holes for connecting said electroconductive layer below said protective layers to another electroconductive layer above said protective layers, said through hole of at least one of said protective layers having a size or shape different from the size or shape of said through hole in at least one remaining protective layer, wherein only one of said protective layers is in contact with and positioned on said electroconductive layer at the vicinity of the exposed portion of said electroconductive layer; and conveying means for conveying a recording medium to a recording position where recording is performed by said recording head.
Claim 10
Dependent Claim
176 words
A recording apparatus comprising: a recording head including a wiring substrate for electrically connected said recording head to a semiconductor device, said substrate having: an insulated substrate, a wiring portion arranged on said insulated substrate along with an electroconductive layer, and an interlayer protective layer, which includes at least two protective layers, formed on said electroconductive layer such that at least a part of the electroconductive layer is exposed, said protective layers being formed with respective through holes for connecting said electroconductive layer below said protective layers to another electroconductive layer above said protective layers, said through hole of at least one of said protective layers having a size or shape different from the size or shape of said through hole in at least one remaining protective layer, wherein only one of said protective layers is in contact with and positioned on said electroconductive layer at the vicinity of the exposed portion of said electroconductive layer; and conveying means for conveying a recording medium to a recording position where recording is performed by said recording head.
Claim 11
Dependent Claim
37 words
The recording apparatus as claimed in claim 7, wherein said another electroconductive layer above said protective layers of said wiring portion comprises a bump electrode which is connected to the semiconductor device arranged on said insulated substrate.
Claim 12
Dependent Claim
28 words
The recording head as claimed in claim 7, wherein said one protective layer overlapping said electroconductive layer has a thickness smaller than that of the remaining protective layers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-12 | 1997-01-11 | 1997-07-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-12 | 2001-01-11 | 2001-07-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-12 | 2005-01-11 | 2005-07-13 | $7700.00 | Window Closed / Lapsed |