US5225891A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire bonding external appearance inspecting apparatus
Assignee: Toshiba Corp
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Filing: 1991-10-09
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Granted: 1993-07-06
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Expires: 2011-10-09
Abstract
Abstract A wire bonding external appearance inspecting apparatus for inspecting wires bonded to a semiconductor chip and the vicinity thereof, comprises a plurality of illuminating units of different illumination directions, for illuminating the semiconductor chip and the vicinity thereof, and a controller for selecting and operating any one of the plural illuminating units according to the inspection places thereof. Since an optimum illumination can be obtained according to inspection items, a camera can take plural different images according to objects to be inspected, so that the inspection reliability can be improved.
Inventors
- 👤 Masayuki Choumei
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 06:35
CPC Classifications
G; G01; G01B; G01B11/00; G01N; G01N21/00; G01N21/84; G01N21/88; G01N21/8806; H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07531; H10W72/50; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
159 words
A wire bonding external appearance inspecting apparatus for inspecting external appearances of an assembly having a lead frame including a first reference mark, a semiconductor chip having a second reference mark and being disposed on the lead frame, and wires extending from the semiconductor chip, the apparatus comprising: a first illuminator disposed above the assembly which illuminates the assembly from above; a second illuminator disposed below the assembly which illuminates the assembly from below; a third illuminator disposed lateral to the assembly which illuminates the assembly from its side; and control means for selecting and illuminating a single one of the first, second and third illuminators such that the first illuminator is illuminated when the second reference mark is being inspected, the second illuminator is illuminated when at least one of the first reference mark and a shape of the lead frame is being inspected, and the third illuminator is illuminated when shapes of the wires are being inspected.
Claim 2
Dependent Claim
159 words
A wire bonding external appearance inspecting apparatus for inspecting external appearances of an assembly having a lead frame including a first reference mark, a semiconductor chip having a second reference mark and being disposed on the lead frame, and wires extending from the semiconductor chip, the apparatus comprising: a first illuminator disposed above the assembly which illuminates the assembly from above; a second illuminator disposed below the assembly which illuminates the assembly from below; a third illuminator disposed lateral to the assembly which illuminates the assembly from its side; and control means for selecting and illuminating a single one of the first, second and third illuminators such that the first illuminator is illuminated when the second reference mark is being inspected, the second illuminator is illuminated when at least one of the first reference mark and a shape of the lead frame is being inspected, and the third illuminator is illuminated when shapes of the wires are being inspected.
Claim 3
Dependent Claim
58 words
An apparatus as recited in claim 1, further comprising first, second and third power sources connected to the first, second and third illuminators respectively, and wherein the control means selects and illuminates a single one of the first, second and third illuminators by controlling an on-off operation of each of the first, second and third power sources, respectively.
Claim 4
Independent Claim
149 words
A method for inspecting comprising the steps of: a) providing an assembly including a semiconductor chip having a first reference mark thereon, a lead frame upon which the semiconductor chip is disposed, and wires extending from the semiconductor chip, the lead frame having a second reference mark thereon; b) only illuminating the assembly from above when inspecting the first reference mark; c) only illuminating the assembly from below when inspecting at least one of the second reference mark and a shape of the lead frame; d) only illuminating the assembly from the side when inspecting shapes of the wires, e) creating an image of the first reference mark during step b); f) creating an image of the at least one of the second reference mark and the shape of the lead frame during step c); and g) creating an image of the shape of the wires during step d).
Claim 5
Independent Claim
149 words
A method for inspecting comprising the steps of: a) providing an assembly including a semiconductor chip having a first reference mark thereon, a lead frame upon which the semiconductor chip is disposed, and wires extending from the semiconductor chip, the lead frame having a second reference mark thereon; b) only illuminating the assembly from above when inspecting the first reference mark; c) only illuminating the assembly from below when inspecting at least one of the second reference mark and a shape of the lead frame; d) only illuminating the assembly from the side when inspecting shapes of the wires, e) creating an image of the first reference mark during step b); f) creating an image of the at least one of the second reference mark and the shape of the lead frame during step c); and g) creating an image of the shape of the wires during step d).
Claim 6
Dependent Claim
60 words
A method as recited in claim 2, further comprising identifying which of the first reference mark, the at least one of the second reference mark and the shape of the lead frame, and the shapes of the wires is to be inspected, and selecting which of steps b), c) and d) is to be performed based on the identifying step.
References Cited (Backward Citations)
JPS56155802A
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JPS608705A
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JPS63307309A
Cited
JPS6440606A
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JPH0276004A
Cited
US5030008A
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WO1991012489A1
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-07-05 | 1997-01-04 | 1997-07-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-07-05 | 2001-01-04 | 2001-07-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-07-05 | 2005-01-04 | 2005-07-06 | $7700.00 | Window Closed / Lapsed |