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US5224184A
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Optical multi-chip interconnect
Assignee: Verizon Laboratories Inc
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Filing: 1991-05-21
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Granted: 1993-06-29
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Expires: 2011-05-21
Abstract
Abstract An opto-electronic interconnect is disclosed that provides for optical communication between chip devices. Optical signals, transmitted from one of the edges of a first chip device, are directed by a lens focusing apparatus to the edge of a second chip device, whereupon the signal is detected. The optical ports for transmission or reception of the optical signals are grouped into an optical segment, which may have either a semi-circular or planar geometry.
Inventors
- 👤 Robert A. Boudreau
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 05:40
CPC Classifications
H; H04; H04B; H04B10/00; H04B10/80; H04B10/801; G; G02; G02B; G02B3/00; G02B6/00; G02B6/24; G02B6/26; G02B6/32; G02B6/42; G02B6/43; G02B7/00; G02B7/02; G02B7/027
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
71 words
An opto-electronic interconnect comprising: a first semiconductor chip device having a first optical segment including a plurality of optical ports for transmitting or receiving optical signals; a second semiconductor chip device having a second optical segment including a plurality of optical ports for transmitting or receiving optical signals; a single lens for coupling an optical port of the first optical segment to a unique optical port of the second optical segment.
Claim 2
Dependent Claim
71 words
An opto-electronic interconnect comprising: a first semiconductor chip device having a first optical segment including a plurality of optical ports for transmitting or receiving optical signals; a second semiconductor chip device having a second optical segment including a plurality of optical ports for transmitting or receiving optical signals; a single lens for coupling an optical port of the first optical segment to a unique optical port of the second optical segment.
Claim 3
Dependent Claim
20 words
The opto-electronic interconnect of claim 1 wherein: said first optical segment and said second optical segment have a semi-circular geometry.
Claim 4
Dependent Claim
20 words
The opto-electronic interconnect of claim 1 wherein: said first optical segment and said second optical segment have a planar geometry.
Claim 5
Dependent Claim
13 words
The opto-electronic interconnect of claim 1 wherein: said lens is a ball lens.
Claim 6
Dependent Claim
13 words
The opto-electronic interconnect of claim 2 wherein: said lens is a ball lens.
Claim 7
Dependent Claim
13 words
The opto-electronic interconnect of claim 3 wherein: said lens is a ball lens.
Claim 8
Dependent Claim
28 words
The opto-electronic interconnect of claim 4 further comprising: a support, having a lens relief cavity, wherein said lens is fixedly received by said support within said relief cavity.
Claim 9
Dependent Claim
28 words
The opto-electronic interconnect to claim 5 further comprising: a support, having a lens relief cavity, wherein said lens is fixedly received by said support within said relief cavity.
Claim 10
Dependent Claim
28 words
The opto-electronic interconnect of claim 6 further comprising: a support, having a lens relief cavity, wherein said lens is fixedly received by said support within said relief cavity.
Claim 11
Dependent Claim
19 words
The opto-electronic interconnect of claim 7 wherein: said lens has a handle for aligning the focus of the lens.
Claim 12
Dependent Claim
19 words
The opto-electronic interconnect of claim 8 wherein: said lens has a handle for aligning the focus of the lens.
Claim 13
Dependent Claim
19 words
The opto-electronic interconnect of claim 9 wherein: said lens has a handle for aligning the focus of the lens.
Claim 14
Independent Claim
101 words
A method of communicating an optical signal between a first semiconductor chip device, having a plurality of optical ports for transmitting or receiving optical signals, and a second semiconductor chip device having a plurality of optical ports for transmitting or receiving optical signals, through a single lens, the method comprising the steps of: transmitting optical signals from a plurality of optical ports of the first chip device; lens coupling each said transmitted optical signal to a unique optical port of the second chip device; and receiving the lens coupled optical signals at the said optical ports of the second chip device.
Claim 15
Independent Claim
101 words
A method of communicating an optical signal between a first semiconductor chip device, having a plurality of optical ports for transmitting or receiving optical signals, and a second semiconductor chip device having a plurality of optical ports for transmitting or receiving optical signals, through a single lens, the method comprising the steps of: transmitting optical signals from a plurality of optical ports of the first chip device; lens coupling each said transmitted optical signal to a unique optical port of the second chip device; and receiving the lens coupled optical signals at the said optical ports of the second chip device.
Claim 16
Independent Claim
84 words
A method of fixedly attaching a ball lens having a handle coupled thereto, to a support with a lens relief cavity, the method comprising the steps of: coating the lower hemisphere of the ball lens with a metal; vacuum depositing a solder film on the walls of the lens relief; gripping said handle and suspending said ball lens with the lens relief; heating the walls of the lens relief; accumulating said solder film at the base of the lens relief; cooling said solder film.
Claim 17
Independent Claim
84 words
A method of fixedly attaching a ball lens having a handle coupled thereto, to a support with a lens relief cavity, the method comprising the steps of: coating the lower hemisphere of the ball lens with a metal; vacuum depositing a solder film on the walls of the lens relief; gripping said handle and suspending said ball lens with the lens relief; heating the walls of the lens relief; accumulating said solder film at the base of the lens relief; cooling said solder film.
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1996-06-28 | 1996-12-28 | 1997-06-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-06-28 | 2000-12-28 | 2001-06-29 | $3760.00 | Window Closed / Lapsed |
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