Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
97 words
An optoelectronic coupling element comprising: a light wave guide; a first carrier chip including a semiconductor light transducer; a microlens for optically coupling the light wave guide and the semiconductor light transducer, wherein the microlens is a spherical lens; a second silicon carrier chip defining a truncated pyramid-shaped lens receptacle, wherein the first carrier chip is fixed to the second carrier chip such that the semiconductor light transducer is adjacent to the microlens, and the lens receptacle is anisotropically etched into the second carrier chip; and glass solder means for fixing the microlens in the lens receptacle.
Claim 2
Dependent Claim
97 words
An optoelectronic coupling element comprising: a light wave guide; a first carrier chip including a semiconductor light transducer; a microlens for optically coupling the light wave guide and the semiconductor light transducer, wherein the microlens is a spherical lens; a second silicon carrier chip defining a truncated pyramid-shaped lens receptacle, wherein the first carrier chip is fixed to the second carrier chip such that the semiconductor light transducer is adjacent to the microlens, and the lens receptacle is anisotropically etched into the second carrier chip; and glass solder means for fixing the microlens in the lens receptacle.
Claim 3
Dependent Claim
12 words
The optoelectronic coupling element of claim 1 wherein the microlens is glass.
Claim 4
Dependent Claim
12 words
The optoelectronic coupling element of claim 1 wherein the microlens is sapphire.
Claim 5
Dependent Claim
21 words
The optoelectronic coupling element of claim 1 wherein the underside of the second carrier chip is provided with a metallic area.
Claim 6
Dependent Claim
98 words
An optoelectronic coupling element comprising: a light wave guide; a first carrier chip including a semiconductor light transducer; a microlens for optically coupling the light wave guide and the semiconductor light transducer, wherein the microlens is a spinal spherical lens; a second silicon carrier chip defining a truncated pyramid-shaped lens receptacle, wherein the first carrier chip is fixed to the second carrier chip such that the semiconductor light transducer is adjacent to the microlens, and the lens receptacle is anisotropically etched into the second carrier chip; and glass solder means for fixing the microlens in the lens receptacle.
Claim 7
Dependent Claim
98 words
An optoelectronic coupling element comprising: a light wave guide; a first carrier chip including a semiconductor light transducer; a microlens for optically coupling the light wave guide and the semiconductor light transducer, wherein the microlens is a spinal spherical lens; a second silicon carrier chip defining a truncated pyramid-shaped lens receptacle, wherein the first carrier chip is fixed to the second carrier chip such that the semiconductor light transducer is adjacent to the microlens, and the lens receptacle is anisotropically etched into the second carrier chip; and glass solder means for fixing the microlens in the lens receptacle.
Claim 8
Dependent Claim
99 words
An optoelectronic coupling element comprising: a light wave guide; a first carrier chip including a semiconductor light transducer; a microlens for optically coupling the light wave guide and the semiconductor light transducer, wherein the microlens is a optically tempered spherical lens; a second silicon carrier chip defining a truncated pyramid-shaped lens receptacle, wherein the first carrier chip is fixed to the second carrier chip such that the semiconductor light transducer is adjacent to the microlens, and the lens receptacle is anisotropically etched into the second carrier chip; and glass solder means for fixing the microlens in the lens receptacle.
Claim 9
Dependent Claim
99 words
An optoelectronic coupling element comprising: a light wave guide; a first carrier chip including a semiconductor light transducer; a microlens for optically coupling the light wave guide and the semiconductor light transducer, wherein the microlens is a optically tempered spherical lens; a second silicon carrier chip defining a truncated pyramid-shaped lens receptacle, wherein the first carrier chip is fixed to the second carrier chip such that the semiconductor light transducer is adjacent to the microlens, and the lens receptacle is anisotropically etched into the second carrier chip; and glass solder means for fixing the microlens in the lens receptacle.