Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
169 words
A module board comprising; a support plate; a plurality of slender lead pins each having a first portion arranged substantially in parallel with one another on a plane substantially coplanar with said supporting plate and a second portion extending from said first portion; a pair of electrically insulating layer members sandwiching said supporting plate and said first portion, said supporting plate, said first portion being isolated from one another with an electrically insulating material between said pair of electrically insulating layer members, said second portion protruding from said pair of electrically insulating layer members, at least one of said electrically insulating layer members being provided with a pattern of electrical conductors; and a first through hole formed through said first portion of each of said lead pins and a first through hole conductor formed on a wall of each through hole, each through hole conductor passing through said pair of electrically insulating layer members and said first portion and being in electrical connection with said pattern of electrical conductors.
Claim 2
Dependent Claim
169 words
A module board comprising; a support plate; a plurality of slender lead pins each having a first portion arranged substantially in parallel with one another on a plane substantially coplanar with said supporting plate and a second portion extending from said first portion; a pair of electrically insulating layer members sandwiching said supporting plate and said first portion, said supporting plate, said first portion being isolated from one another with an electrically insulating material between said pair of electrically insulating layer members, said second portion protruding from said pair of electrically insulating layer members, at least one of said electrically insulating layer members being provided with a pattern of electrical conductors; and a first through hole formed through said first portion of each of said lead pins and a first through hole conductor formed on a wall of each through hole, each through hole conductor passing through said pair of electrically insulating layer members and said first portion and being in electrical connection with said pattern of electrical conductors.
Claim 3
Dependent Claim
76 words
A module board according to claim 1, further comprising at least one second through hole formed through said support plate and a second through hole conductor formed on an inner wall of each of said at least one second through hole, said second through hole conductor passing through said pair of electrically insulating layer members and said supporting plate and being insulated from said supporting plate and in electrical connection with said pattern of electrical conductors.
Claim 4
Dependent Claim
69 words
A module board according to claim 1, in which each of said electrically insulating layer members includes an inner insulating layer formed contiguous with said supporting plate and said first portion, and an outer insulating layer formed contiguous with said inner insulating layer, said inner and outer insulting layers being provided with inner and outer conductor patterns electrically connected with each other to constitute said pattern of electrical conductors.
Claim 5
Dependent Claim
37 words
A module board according to claim 1, in which said supporting plate is substantially C-shaped such that said supporting plate has two opposite sections substantially parallel with said slender lead pins and a section substantially perpendicular thereto.
Claim 6
Dependent Claim
38 words
A module board according to claim 1, in which said second portion of said slender lead pins is alternately bent in two opposite directions away from a plane in which said first portion of said lead pins lie.
Claim 7
Dependent Claim
34 words
An electronic device having a module board according to claim 5 and having a plurality of packaged semiconductor devices mounted on at least one of said electrically insulating layer members of said module board.
Claim 8
Dependent Claim
19 words
An electronic device according to claim 6, in which said packaged semiconductor devices have small outline J-lead (SOJ) packages.
Claim 9
Dependent Claim
19 words
An electronic device according to claim 6, in which said packaged semiconductor devices have thin small outline (TSO) packages.
Claim 10
Dependent Claim
34 words
An electronic device having a module board according to claim 5 and having a plurality of bare semiconductor chips mounted on at least one of said electrically insulating layer members of said module board.
Claim 11
Dependent Claim
34 words
An electronic device having a module board according to claim 1 and having a plurality of packaged semiconductor devices mounted on at least one of said electrically insulating layer members of said module board.
Claim 12
Dependent Claim
16 words
A module board according to claim 1, wherein said supporting plate is an electrically conductive plate.
Claim 13
Dependent Claim
34 words
An electronic device having a module board according to claim 1 and having a plurality of bare semiconductor chips mounted on at least one of said electrically insulating layer members of said module board.