Patent US5215940A successfully refreshed from Google Patents.
US5215940A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Wire looping method during wire bonding
Assignee: Texas Instruments Inc
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Filing: 1990-02-05
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Granted: 1993-06-01
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Expires: 2010-02-05
Abstract
Abstract A method for looping the bond wires used to connected a semiconductor bond pad to a lead frame finger during bonding to improve the clearance between adjacent bond wires.
Inventors
- 👤 John W. Orcutt
- 👤 Randy O. Burrows
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 14:15
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; B23K2101/00; B23K2101/36; B23K2101/40; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07551; H10W72/07552; H10W72/07553; H10W72/50; H10W72/521; H10W72/527; H10W72/531; H10W72/536; H10W72/5363; H10W72/537; H10W72/541; H10W72/5449; H10W72/90; H10W72/931; H10W72/932; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
113 words
A method of wire looping with a wire bond head, during wire bonding of semiconductor devices to lead frames, to improve clearance between adjacent bond sites, including the steps of: identifying at least one specific bond wire, the direction of which is to be altered; moving the bond head in a direction to alter the path of the at least one specific bond wire to the lead frame, to move the identified at least one specific bond wire away from an adjacent bond wire prior to looping the identified at least one specific bond wire to the lead frame; and bonding the identified at least one specific bond wire to the lead frame.
Claim 2
Independent Claim
113 words
A method of wire looping with a wire bond head, during wire bonding of semiconductor devices to lead frames, to improve clearance between adjacent bond sites, including the steps of: identifying at least one specific bond wire, the direction of which is to be altered; moving the bond head in a direction to alter the path of the at least one specific bond wire to the lead frame, to move the identified at least one specific bond wire away from an adjacent bond wire prior to looping the identified at least one specific bond wire to the lead frame; and bonding the identified at least one specific bond wire to the lead frame.
Claim 3
Dependent Claim
28 words
The method according to claim 1, including the step of visually inspecting a semiconductor device and lead frame to determine which bond wire paths are to be altered.
Claim 4
Dependent Claim
27 words
The method according to claim 1, including the step of mapping the semiconductor device and lead frame to determine which bond wire paths are to be altered.
Claim 5
Dependent Claim
45 words
The method according to claim 3, including determining the altered paths of identified bond wires, based on the mapping of the semiconductor device and lead frame, and moving the bonder bond head in a direction to place the identified bond wires in the altered path.
Claim 6
Dependent Claim
34 words
The method according to claim 4, wherein the bond head is moved in a direction at an angle to the normal direction of the bond head to alter the path of the bond wire.
Claim 7
Independent Claim
123 words
A method of wire looping with a wire bonder bond head, during wire bonding of semiconductor devices to lead frames, to improve clearance between adjacent bond wire, including the steps of: identifying at least one specific bond wire, the direction of which is to be altered; moving the bond head at an angle to the normal direction of the bond head to alter the path of the identified at least one specific bond wire to the lead frame, to move the identified at least one specific bond wire away from an adjacent bond wire prior to looping the identified at least one specific bond wire to the lead frame; and bonding the identified at least one specific bond wire to the lead frame.
Claim 8
Independent Claim
123 words
A method of wire looping with a wire bonder bond head, during wire bonding of semiconductor devices to lead frames, to improve clearance between adjacent bond wire, including the steps of: identifying at least one specific bond wire, the direction of which is to be altered; moving the bond head at an angle to the normal direction of the bond head to alter the path of the identified at least one specific bond wire to the lead frame, to move the identified at least one specific bond wire away from an adjacent bond wire prior to looping the identified at least one specific bond wire to the lead frame; and bonding the identified at least one specific bond wire to the lead frame.
Claim 9
Dependent Claim
28 words
The method according to claim 6, including the step of visually inspecting a semiconductor device and lead frame to determine which bond wire paths are to be altered.
Claim 10
Dependent Claim
27 words
The method according to claim 6, including the step of mapping the semiconductor device and lead frame to determine which bond wire paths are to be altered.
Claim 11
Dependent Claim
45 words
The method according to claim 8, including determining the altered paths of identified bond wires, based on the mapping of the semiconductor device and lead frame, and moving the bonder bond head in a direction to place the identified bond wires in the altered path.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-31 | 1996-11-30 | 1997-06-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-31 | 2000-11-30 | 2001-06-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-31 | 2004-11-30 | 2005-06-01 | $7700.00 | Window Closed / Lapsed |