Wire bonding device

Abstract

Abstract PURPOSE:To prevent a contact with the edge of a semiconductor pellet of a wire by using even a distance on a pellet surface from a first position to the edge together with distances in the X Y and Z directions between first and second positions for a control section as parameters. CONSTITUTION:Regarding the control of the locus of a bonding tool by a control section 19, a distance l1 on the XY plane from a first position S to a second position T, using at least the stretching vertical cross section of a wire loop as a reference, the quantity of displacement l3 in the Z direction from the first position S to the second position T, and a distance l2 on a pellet surface from the first position S to the edge E of a semiconductor pellet 6 are determined as parameters. Accordingly, since the information of the distance l2 on the pellet surface is transmitted over the control section 19, employing even the distance l2 as the parameter, a contact with the edge E of the semiconductor pellet 6 of a wire 8 by the positions of bonding can be prevented, thus acquiring a semiconductor device having electrically high reliability.

Inventors

• 👤 Yoshio Oshima
• 👤 Yasushi Sato

Bibliographic Details