Patent US5210938A successfully refreshed from Google Patents.
US5210938A
Expired / Lapsed
US
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Method of assembling an electronic part device
Assignee: Rohm Co Ltd
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Filing: 1992-08-04
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Granted: 1993-05-18
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Expires: 2012-08-04
Abstract
Abstract In a method of assembling an electronic part device and a circuit board, an electrode formed on the electronic part device and a conductive pattern formed on the circuit board so as to be opposite to the electrode are positioned, and a thermosetting resin sheet including a thermally shrinkable particle and provided between the electronic part device and the circuit board is hardened and shrunk.
Inventors
- 👤 Minoru Hirai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:29
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H05K2201/00; H05K2201/01; H05K2201/0104; H05K2201/0125; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0212; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10734; H05K2203/00; H05K2203/01; H05K2203/0191; H05K3/32; H05K3/325; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/20; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
65 words
A method of assembling an electronic part device and a circuit board, wherein: an electrode formed on said electronic part device and a conductive pattern formed on said circuit board so as to be opposite to said electrode are positioned; and a thermosetting resin sheet including a thermally shrinkable particle and provided between said electronic part device and said circuit board is hardened and shrunk.
Claim 2
Independent Claim
65 words
A method of assembling an electronic part device and a circuit board, wherein: an electrode formed on said electronic part device and a conductive pattern formed on said circuit board so as to be opposite to said electrode are positioned; and a thermosetting resin sheet including a thermally shrinkable particle and provided between said electronic part device and said circuit board is hardened and shrunk.
Claim 3
Dependent Claim
36 words
A method of assembling an electronic part device and a circuit board according to claim 1, wherein a shrinkage temperature of said thermally shrinkable particle is higher than a hardening temperature of said thermosetting resin sheet.
Claim 4
Dependent Claim
25 words
A method of assembling an electronic part device and a circuit board according to claim 1, wherein said electronic part device is a semiconductor device.
Claim 5
Dependent Claim
44 words
A method of assembling an electronic part device and a circuit board according to claim 3, wherein the electrode of said semiconductor device is a bump and wherein a thickness of the thermally shrinkable sheet is substantially the same as that of the bump.
Claim 6
Dependent Claim
31 words
A method of assembling an electronic part device and a circuit board according to claim 4, wherein said thermally shrinkable sheet does not exist between said bump and said conductive pattern.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-05-17 | 1996-11-16 | 1997-05-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-05-17 | 2000-11-16 | 2001-05-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-05-17 | 2004-11-16 | 2005-05-18 | $7700.00 | Window Closed / Lapsed |