US5162613A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Integrated circuit interconnection technique
Assignee: Nokia Bell Labs
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Filing: 1991-07-01
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Granted: 1992-11-10
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Expires: 2011-07-01
Abstract
Abstract Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive material advantageously has a cutout (24) therein located to expose at least a portion of the substrate lying between a pair of metallized areas (16). The cutout (24) serves to confine a quantity of adhesive (26) deposited therein which serves to secure the chip to the substrate without any physical bond between the metallized areas and the bond sites on the chip while maintaining the anisotropically conductive material in compression.
Inventors
- 👤 David Schoenthaler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 11:32
CPC Classifications
H; H01; H01R; H01R13/00; H01R13/02; H01R13/22; H01R13/24; H01R13/2407; H01R13/2414; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H05; H05K; H05K13/00; H05K13/04; H05K13/046; H05K3/00; H05K3/30; H05K3/303; H05K3/305; H05K3/32; H05K3/325; H05K7/00; H05K7/14; H05K7/1422; H05K7/1424; H05K7/1425; H10W70/00; H10W70/60; H10W70/62; H10W70/66; H10W70/666; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0314; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H10W72/07231; H10W72/07236; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
130 words
A method for interconnecting each of a plurality of conductive members on a component to a corresponding one of a plurality of metallized areas on a substrate comprising the steps of: placing a non-adhering sheet of anisotropically conductive material, having at least one cutout therein, onto a substrate such that the cutout exposes a portion of the substrate lying between a pair of metallized areas; filling the cutout in the anisotropically conductive material with an adhesive; and placing a component, having at least one conductive member, onto the anisotropically conductive material such that each conductive member is in aligned registration with a corresponding metallized area and that at least a portion of the component is adhered to the substrate by the adhesive to maintain the anisotropically conductive material in compression.
Claim 2
Independent Claim
130 words
A method for interconnecting each of a plurality of conductive members on a component to a corresponding one of a plurality of metallized areas on a substrate comprising the steps of: placing a non-adhering sheet of anisotropically conductive material, having at least one cutout therein, onto a substrate such that the cutout exposes a portion of the substrate lying between a pair of metallized areas; filling the cutout in the anisotropically conductive material with an adhesive; and placing a component, having at least one conductive member, onto the anisotropically conductive material such that each conductive member is in aligned registration with a corresponding metallized area and that at least a portion of the component is adhered to the substrate by the adhesive to maintain the anisotropically conductive material in compression.
Claim 3
Dependent Claim
35 words
The method according to claim 1 wherein the anisotropically conductive material has a single cutout therein and is placed on the substrate such that the cutout is located centrally with respect to the metallized areas.
Claim 4
Dependent Claim
35 words
The method according to claim 1 wherein the component may be removed from the substrate without damage to any of the metallized areas thereon by shearing the adhesive bond between the component and the substrate.
Claim 5
Dependent Claim
114 words
An assembly fabricated by the steps of: placing a non-adhering sheet of anisotropically conductive material, having at least one cutout therein, onto a substrate such that the cutout exposes a portion of the substrate lying between a pair of metallized areas on the substrate; filling the cutout in the anisotropically conductive material with an adhesive; and placing a component having at least a pair of conductive members onto the anisotropically conductive material such that each conductive member is in aligned registration with a corresponding metallized area on the substrate and that at least a portion of the component is adhered to the substrate by the adhesive to maintain the anisotropically conductive material in compression.
Claim 6
Dependent Claim
114 words
An assembly fabricated by the steps of: placing a non-adhering sheet of anisotropically conductive material, having at least one cutout therein, onto a substrate such that the cutout exposes a portion of the substrate lying between a pair of metallized areas on the substrate; filling the cutout in the anisotropically conductive material with an adhesive; and placing a component having at least a pair of conductive members onto the anisotropically conductive material such that each conductive member is in aligned registration with a corresponding metallized area on the substrate and that at least a portion of the component is adhered to the substrate by the adhesive to maintain the anisotropically conductive material in compression.
Claim 7
Dependent Claim
35 words
The assembly according to claim 4 wherein the anisotropically conductive material has a single cutout therein and is placed on the substrate such that the cutout is located centrally with respect to the metallized areas.
Claim 8
Dependent Claim
34 words
The assembly according to claim 4 wherein the component is removable from the substrate without damage to any of the metallized areas thereon by shearing the adhesive bond between the component and the substrate.
Claim 9
Dependent Claim
152 words
An assembly comprising: a substrate having a plurality of metallized areas on a first major surface thereof arranged in a predetermined pattern; a sheet of anisotropically conductive material overlying the first major surface of the substrate, the material having at least one cutout therein for exposing a portion of the substrate lying between a pair of metallized areas on the first surface thereof; a quantity of adhesive deposited within the cutout within the anisotropically conductive material; at least one component having a plurality of conductive members, the component overlying at least a portion of the cutout in the conductive material so as to be in contact with the adhesive, and the component being positioned such that each conductive member thereof is in aligned registration with a corresponding metallized area on the substrate, the component being secured to the substrate by the adhesive so as to maintain the anisotropically conductive material in compression.
Claim 10
Dependent Claim
152 words
An assembly comprising: a substrate having a plurality of metallized areas on a first major surface thereof arranged in a predetermined pattern; a sheet of anisotropically conductive material overlying the first major surface of the substrate, the material having at least one cutout therein for exposing a portion of the substrate lying between a pair of metallized areas on the first surface thereof; a quantity of adhesive deposited within the cutout within the anisotropically conductive material; at least one component having a plurality of conductive members, the component overlying at least a portion of the cutout in the conductive material so as to be in contact with the adhesive, and the component being positioned such that each conductive member thereof is in aligned registration with a corresponding metallized area on the substrate, the component being secured to the substrate by the adhesive so as to maintain the anisotropically conductive material in compression.
Claim 11
Dependent Claim
13 words
The assembly according to claim 7 wherein the adhesive comprises a thermoset adhesive.
Claim 12
Dependent Claim
14 words
The assembly according to claim 7 wherein the component comprises an unpackaged semiconductor chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-10 | 1996-05-11 | 1996-11-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-10 | 2000-05-11 | 2000-11-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-10 | 2004-05-11 | 2004-11-10 | $7700.00 | Window Closed / Lapsed |