Bistable optical laser based on a heterostructure pnpn thyristor

Claim 2

A semiconductor apparatus which propagates light in a preferred direction, the apparatus comprising, in succession, a substrate, a first emitter region, a first carrier confinement region, a first internal heterojunction barrier, a first base region, a second base region, a second internal heterojunction barrier, a second carrier confinement region, and a second emitter region, wherein portions of the first emitter region and the second base region are of one conductivity type and portions of the second emitter region and the first base region are of the opposite conductivity type, wherein the first and second emitter regions, the first and second carrier confinement regions, the first and second internal heterojunction barriers and the first and second base regions together define a single optical cavity in the directions perpendicular to the preferred direction of light propagation, and means for causing electrical current to flow through the semiconductor apparatus.

Claim 3

A semiconductor apparatus as recited in claim 1 wherein one or more of the regions are either evanescent or non-evanescent depending on the value of the component of Ey(x), where Ey(x) is the electric field of the light with the lowest optical energy able to propagate through the optical cavity as a function of x and taken in a y direction (of an x-y-z coordinate system, taking positive z as the preferred direction of light propagation), with the non-evanescent regions, being defined as those regions where Ey(x)=F sin[K.sub.p x]+G cos[K.sub.p (x)x], where K p (x)is a positive real constant called the fundamental mode lateral constant and F and G are real constants, and wherein the evanescent regions are defined as those regions where Ey(x)=C exp[K.sub.d x]+D exp[-K.sub.d (x)x], wherein K d (x) is a positive real constant called the fundamental mode lateral decay constant and C and D are real constants, and further wherein the single optical cavity is defined by the first and second emitter regions and the regions between the first and second emitter regions so that the absolute value of the integral of the fundamental mode lateral decay constant across any evanescent region, or collection of abutting evanescent regions, separating two non-evanescent regions is less than 2[ln(200)], where the path of the integral is taken perpendicular to the preferred direction of light propagation and is the shortest path joining the two non-evanescent regions.

Claim 4

A semiconductor apparatus as recited in claim 1 wherein two mirrors are formed parallel to each other and with the resultant semiconductor apparatus being situated between these two mirrors.

Claim 5

A semiconductor apparatus as recited in claim 3, further comprising means for coupling light into and out of the optical cavity.

Claim 6

A semiconductor apparatus as recited in claim 1 wherein the preferred direction of light propagation is such that the light propagates along the first and second carrier confinement regions.

Claim 7

A semiconductor apparatus as recited in claim 1 wherein the preferred direction of light propagation is such that the light propagates in succession from one of the first and second carrier confinement regions, through the first and second base regions, and into the other of the first and second carrier confinement regions.

Claim 8

A semiconductor apparatus as recited in claim 1 wherein the first emitter region of one conductivity type includes a subemitter region of the one conductivity type.

Claim 9

A semiconductor apparatus as recited in claim 1 wherein the first emitter region of one conductivity type includes as optical confinement tailoring region of the one conductivity type.

Claim 10

A semiconductor apparatus as recited in claim 1 wherein the first emitter region of the one conductivity type includes a bandgap grading region of the one conductivity type.

Claim 11

A semiconductor apparatus as recited in claim 9 wherein the bandgap grading region of the one conductivity type is formed by compositional grading.

Claim 12

A semiconductor apparatus as recited in claim 9 wherein the bandgap grading region of the one conductivity type is formed by superlattice grading.

Claim 13

A semiconductor apparatus as recited in claim 1 wherein the second emitter region of opposite conductivity type includes a cap region of the opposite conductivity type.

Claim 14

A semiconductor apparatus as recited in claim 1 wherein the second emitter region of opposite conductivity type includes an optical confinement tailoring region of the opposite conductivity type.

Claim 15

A semiconductor apparatus as recited in claim 1 wherein the second emitter region of the opposite conductivity type includes a bandgap grading region of the opposite conductivity type.

Claim 16

A semiconductor apparatus as recited in claim 14 wherein the bandgap grading region of the opposite conductivity type is formed by compositional grading.

Claim 17

A semiconductor apparatus as recited in claim 14 wherein the bandgap grading region of the opposite conductivity type is formed by superlattice grading.

Claim 18

An semiconductor apparatus as recited in claim 1 wherein the first emitter region of the one conductivity type includes a dielectric quarter-wave mirror.

Claim 19

An semiconductor apparatus as recited in claim 1 wherein the second emitter region of the opposite conductivity type includes a dielectric quarter-wave mirror.

Claim 20

A semiconductor apparatus as recited in claim 1 wherein the first base region of the opposite conductivity type includes a bandgap grading region of the opposite conductivity type.

Claim 21

A semiconductor apparatus as recited in claim 19 wherein the bandgap grading region of the opposite conductivity type is formed by compositional grading.

Claim 22

A semiconductor apparatus as recited in claim 19 wherein the bandgap grading region of the opposite conductivity type is formed by superlattice grading.

Claim 23

A semiconductor apparatus as recited in claim 1 wherein the second base region of the one conductivity type includes a bandgap grading region of the one conductivity type.

Claim 24

A semiconductor apparatus as recited in claim 22 wherein the bandgap grading region of the one conductivity type is formed by compositional grading.

Claim 25

A semiconductor apparatus as recited in claim 22 wherein the bandgap grading region of the one conductivity type is formed by superlattice grading.

Claim 26

A semiconductor apparatus as recited in claim 1 wherein the means for causing electrical current to flow through the semiconductor apparatus includes the substrate.

Claim 27

A semiconductor apparatus as recited in claim 1 wherein the first and second carrier confinement regions each have a thickness between 1 nm and 250 nm.

Claim 28

A semiconductor apparatus a recited in claim 1 wherein the first and second internal heterojunction barrier regions each have a thickness less than 100 nm.

Claim 29

A semiconductor apparatus as recited in claim 1 wherein the first and second base regions each have a thickness between 30 nm and 300 nm.

Claim 30

A semiconductor apparatus as recited in claim 1 wherein the means for causing electrical current to flow through the semiconductor substrate comprises an electrode in ohmic contact with the second emitter region and an electrode in ohmic contact with the substrate.

Claim 31

A semiconductor apparatus as recited in claim 1 wherein the means for causing electrical current to flow through the semiconductor substrate comprises an electrode in ohmic contact with the second emitter region and an electrode in ohmic contact with the first emitter region.

Claim 32

A semiconductor apparatus as recited in claim 7 wherein the means for causing electrical current to flow through the semiconductor substrate comprises an electrode in ohmic contact with the second emitter region and an electrode in ohmic contact with the subemitter region.

Claim 33

A semiconductor apparatus as recited in claim 1 wherein the substrate is n-type gallium arsenide.

Claim 34

A semiconductor apparatus as recited in claim 1 wherein the substrate is p-type gallium arsenide.

Claim 35

A semiconductor apparatus as recited in claim 1 wherein the substrate is semi-insulating gallium arsenide.

Claim 36

A semiconductor apparatus as recited in claim 1 wherein the substrate is chromium doped, semi-insulating gallium arsenide.

Claim 37

A semiconductor apparatus as recited in claim 1 wherein the substrate is semi-insulating gallium arsenide doped with EL2 defects.

Claim 38

A semiconductor apparatus as recited in claim 1 wherein the first and second carrier confinement regions are made of gallium arsenide.

Claim 39

A semiconductor apparatus as recited in claim 1 wherein the first and second carrier confinement regions are made of aluminum gallium arsenide.

Claim 40

A semiconductor apparatus as recited in claim 1 wherein the first and second carrier confinement regions are made of indium gallium arsenide.

Claim 41

A semiconductor apparatus as recited in claim 1 wherein the bandgap of the semiconductor in one of the first and second carrier confinement regions is larger than the bandgap of the semiconductor in the other of the first and second carrier confinement regions.

Claim 42

A semiconductor apparatus as recited in claim 1 wherein the substrate is indium phosphide.

Claim 43

A semiconductor apparatus as recited in claim 1 wherein a capacitor is electrically connected between the first base region and the first emitter region.

Claim 44

A semiconductor apparatus as recited in claim 1 wherein a capacitor is electrically connected between the first base region and the substrate.

Claim 45

A semiconductor apparatus as recited in claim 1 wherein a capacitor is electrically connected between the second base region and the second emitter region.

Claim 46

A semiconductor apparatus as recited in claim 4 wherein the means for coupling light into and out of the optical cavity comprise waveguides.

Claim 47

A semiconductor apparatus as recited in claim 3 wherein the two mirror facets are formed by etching.

Claim 48

A semiconductor apparatus as recited in claim 3 wherein the two mirror facets are formed by cleaving.

Claim 49

A semiconductor apparatus as recited in claim 3 wherein the two mirror facets are formed by quarter-wave reflectors.

Claim 50

A semiconductor apparatus as recited in claim 45 wherein the waveguides comprise optical output waveguides which are deposited in perpendicular alignment with the mirrors.

Claim 51

A semiconductor apparatus as recited in claim 45 wherein the waveguides comprise optical input waveguides which are deposited away from the mirrors.

Claim 52

A semiconductor apparatus as recited in claim 45 wherein the waveguides comprise optical input waveguides which are not aligned parallel with the optical cavity.

Claim 53

A semiconductor apparatus as recited in claim 45 wherein the waveguides comprise optical input waveguides which are coupled to the semiconductor apparatus, such that the optical input waveguides are not formed in perpendicular alignment to the mirrors.