Patent US5197271A successfully refreshed from Google Patents.
US5197271A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for back side damage of silicon wafers
Assignee: Texas Instruments Inc
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Filing: 1981-03-22
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Granted: 1993-03-30
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Expires: 2001-03-22
Abstract
Abstract A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.
Inventors
- 👤 John Robbins
- 👤 Ricky L. Boston
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:22
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/12; H10P90/124; H10P36/00; H10P36/03
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
77 words
A fixture for holding semiconductor wafers during backside damaging of the wafers, comprising; two side pieces, three dowel supports, and a handle, the three dowel supports connected to the two side pieces and rigidly supporting the semiconductors wafers between the three dowel supports, such that the wafers are rigidly secured between the dowel supports when the dowel supports are in place between the two side pieces, and the handle is pivotally connected to the two side pieces.
Claim 2
Dependent Claim
77 words
A fixture for holding semiconductor wafers during backside damaging of the wafers, comprising; two side pieces, three dowel supports, and a handle, the three dowel supports connected to the two side pieces and rigidly supporting the semiconductors wafers between the three dowel supports, such that the wafers are rigidly secured between the dowel supports when the dowel supports are in place between the two side pieces, and the handle is pivotally connected to the two side pieces.
Claim 3
Dependent Claim
37 words
The fixture according to claim 1, wherein the three dowel supports are connected to the side pieces such that each dowel support contacts a semiconductor wafer on its circumference to hold the wafer in place during processing.
Claim 4
Dependent Claim
21 words
The fixture according to claim 1, wherein at least one dowel support is removable to permit mounting of the semiconductor wafers.
Claim 5
Dependent Claim
16 words
The fixture according to claim 1 wherein the handle is rotatably mounted to the side pieces.
Claim 6
Dependent Claim
92 words
A fixture for holding semiconductor wafers during backside damaging of the wafers, comprising; two side pieces, each side pieces having three legs extending from a center point, the legs being located equidistant around an imaginary circle having the center point as its center, three dowel supports extending between the legs of the side pieces, and a handle rotatably mounted to the side pieces, the three dowel supports connected to the two side pieces and supporting the semiconductors wafers between the three dowel supports and the handle connected to the two side pieces.
Claim 7
Dependent Claim
92 words
A fixture for holding semiconductor wafers during backside damaging of the wafers, comprising; two side pieces, each side pieces having three legs extending from a center point, the legs being located equidistant around an imaginary circle having the center point as its center, three dowel supports extending between the legs of the side pieces, and a handle rotatably mounted to the side pieces, the three dowel supports connected to the two side pieces and supporting the semiconductors wafers between the three dowel supports and the handle connected to the two side pieces.
Claim 8
Dependent Claim
37 words
The fixture according to claim 5, wherein the three dowel supports are connected to the side pieces such that each dowel support contacts a semiconductor wafer on its circumference to hold the wafer in place during processing.
Claim 9
Dependent Claim
21 words
The fixture according to claim 6, wherein at least one dowel support is removable to permit mounting of the semiconductor wafers.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-03-29 | 1996-09-28 | 1997-03-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-03-29 | 2000-09-28 | 2001-03-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-03-29 | 2004-09-28 | 2005-03-30 | $7700.00 | Window Closed / Lapsed |