US5190995A
Expired / Lapsed
US
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Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
Assignee: Shin-Etsu Chemical Co Ltd
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Filing: 1991-01-24
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Granted: 1993-03-02
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Expires: 2011-01-24
Abstract
Abstract Epoxy resin compositions comprising (A) an epoxy resin of formula (1), (B) a curing agent based on a novolak type phenol resin and/or a triphenolalkane resin of formula (2), and (C) an inorganic filler are suitable for encapsulating semiconductor elements because they show good flow behavior upon casting and cure into less stressed products having improved mechanical strength, Tg, and moisture resistance. ##STR1## R 1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR2## m is 0, 1 or 2, n is 1 or 2, and l is 0, 1, 2 or 3.
Inventors
- 👤 Toshio Shiobara
- 👤 Kazutoshi Tomiyoshi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 22:18
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/40; H10W74/47; C; C08; C08G; C08G59/00; C08G59/02; C08G59/04; C08G59/06; C08G59/08; C08G59/18; C08G59/20; C08G59/32; C08G59/3218; C08G59/40; C08G59/62; C08G59/621; C08K; C08K3/00; C08K3/01; C08K3/013; C08L; C08L63/00; C08L63/04; C08L83/00; C08L83/10; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/40; C08L2203/00; C08L2203/20; C08L2203/206
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
117 words
An epoxy resin composition comprising (A) an epoxy resin of the general formula: ##STR24## wherein R 1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR25## letter m is an integer of 0 to 2, n is equal to 1 or 2, and l is an integer of 0 to 3, (B) a curing agent based on a novolak phenol resin and/or a triphenolalkane compound of the general formula: ##STR26## wherein R 1 and m are as defined above, and (C) an inorganic filler, wherein 350 to 700 parts by weight of component (C) are present per 100 parts by weight of the total of components (A) and (B).
Claim 2
Dependent Claim
117 words
An epoxy resin composition comprising (A) an epoxy resin of the general formula: ##STR24## wherein R 1 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, OG is ##STR25## letter m is an integer of 0 to 2, n is equal to 1 or 2, and l is an integer of 0 to 3, (B) a curing agent based on a novolak phenol resin and/or a triphenolalkane compound of the general formula: ##STR26## wherein R 1 and m are as defined above, and (C) an inorganic filler, wherein 350 to 700 parts by weight of component (C) are present per 100 parts by weight of the total of components (A) and (B).
Claim 3
Dependent Claim
121 words
The composition of claim 1 which further comprises (D) a block copolymer obtained by addition reaction between an organic polymer of the general formula: ##STR27## wherein A is independently selected from the group consisting of an --OH group, an --OG group, and an alkenyl-containing organic group having 1 to 10 carbon atoms, and R 1 , OG, m, n and l are as defined above, and an organopolysiloxane of the general formula: R.sup.2.sub.a R.sup.3.sub.b SiO.sub.(4-a-b)/2 ( 4) wherein R 2 is a hydrogen atom or --(CH 2 ) p --NH 2 wherein p is an integer of from 0 to 5, R 3 is a monovalent organic group, and letters a and b are positive numbers satisfying 0.001≦a≦1, 1≦b<3, and 1.001≦a+b≦3.
Claim 4
Dependent Claim
40 words
The composition of claim 2 wherein 350 to 700 parts by weight of component (C) and 2 to 50 parts by weight of component (D) are present per 100 parts by weight of the total of components (A) and (B).
Claim 5
Dependent Claim
22 words
A semiconductor device encapsulated with a cured epoxy resin composition as set forth in any one of claims 1, 2 or 3.
Claim 6
Dependent Claim
28 words
The composition of claim 1, wherein 450 to 650 parts by weight component (C) is contained per 100 parts by weight of the total components (A) and (B).
Claim 7
Dependent Claim
12 words
The composition of claim 1, wherein said inorganic filler comprises quartz powder.
Claim 8
Dependent Claim
25 words
The composition of claim 6, wherein said quartz powder contains less than 0.3% by weight of particles having a diameter of greater than 75 μm.
Claim 9
Dependent Claim
39 words
The composition of claim 6, wherein said inorganic filler further comprises 5 to 20 parts by weight of a spherical silica having a mean diameter of 0.4 to 2 μm, per 100 parts by weight of said quartz powder.
Claim 10
Dependent Claim
25 words
The composition according to claim 1, wherein said composition further comprises a curing catalyst selected from the group consisting of tertiary amines and phosphorus compounds.
Claim 11
Dependent Claim
21 words
The composition according to claim 1, wherein said composition further comprises a curing catalyst comprising a mixture of 1,8-diazabicyclo(5.4.0)undecene-7 and triphenylphospine.
Claim 12
Dependent Claim
21 words
The composition according to claim 1, wherein said composition further comprises a curing catalyst selected from the group consisting of imidazoles.
Claim 13
Dependent Claim
29 words
The composition according to claim 1, wherein the mol ratio of the phenolic OH groups contained in (B) to the epoxy groups contained in (A) is 0.1:1 to 3:1.
Claim 14
Dependent Claim
29 words
The composition according to claim 12, wherein the mol ratio of the phenolic OH groups contained in (B) to the epoxy groups contained in (A) is 0.5:1 to 1.5:1.
Claim 15
Dependent Claim
29 words
The composition according to claim 2, wherein the mol ratio of the epoxy groups contained in (A) to the phenolic OH groups contained in (B) is 0.5:1 to 1.5:1.
Claim 16
Dependent Claim
49 words
The composition according to claim 1, wherein said novolak phenol resin (B) is selected from the group consisting of: ##STR28## wherein p is a positive number of from 2 to 15, and q and r are positive numbers, with the sum of q+r being equal to 2 to 15.
Claim 17
Dependent Claim
22 words
The composition according to claim 1, wherein said epoxy resin of general formula (1) is selected from the group consisting of: ##STR29##
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-03-01 | 1996-08-31 | 1997-03-02 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-03-01 | 2000-08-31 | 2001-03-02 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-03-01 | 2004-08-31 | 2005-03-02 | $7700.00 | Window Closed / Lapsed |