Self-soldering flexible circuit connector

Claim 1

The method of joining electrical conductors associated with a non-conductive board to other electrical conductors comprising the steps of aligning at least some of the electrical conductors of the board with at least some of the other electrical conductors, positioning a heat-activated, conductive bonding material between the electrical conductors of the board and the other electrical conductors which are to be joined to one another, bringing the electrical conductors to be joined into contact with said bonding material, to assemble a sandwich of conductors and bonding material, heating the sandwich with a temperature self-regulating heater, having upon energization a maximum temperature above the bonding temperature of the bonding material, but below the damage temperature of active and passive components that may be on the board preventing the bonding material associated with a conductor from contacting adjacent members.

Claim 2

The method of joining electrical conductors associated with a non-conductive board to other electrical conductors comprising the steps of aligning at least some of the electrical conductors of the board with at least some of the other electrical conductors, positioning a heat-activated, conductive bonding material between the electrical conductors of the board and the other electrical conductors which are to be joined to one another, bringing the electrical conductors to be joined into contact with said bonding material, to assemble a sandwich of conductors and bonding material, heating the sandwich with a temperature self-regulating heater, having upon energization a maximum temperature above the bonding temperature of the bonding material, but below the damage temperature of active and passive components that may be on the board preventing the bonding material associated with a conductor from contacting adjacent members.

Claim 3

The method of connecting at least some of the conductors of a circuit board having a plurality of conductors to further electrical conductors comprising the steps of bringing lengths of a predetermined array of conductors into contact with more than one of a second array of conductors, positioning solder between the surfaces of contact between the arrays, applying heat to the surface of the board immediately adjacent the array of exposed conductors with an incrementally variable temperature self-regulating electric heater having a maximum temperature below the damage temperature of the circuit board and elements thereon, so that each connection associated with said array receives only that amount of heat energy necessary to melt the solder and bond the conductors to one another, and accurately aligning conductors of an array to prevent a conductor of one array from contacting two conductors of the other array.

Claim 4

The method of connecting at least some of the conductors of a circuit board having a plurality of conductors to further electrical conductors comprising the steps of bringing lengths of a predetermined array of conductors into contact with more than one of a second array of conductors, positioning solder between the surfaces of contact between the arrays, applying heat to the surface of the board immediately adjacent the array of exposed conductors with an incrementally variable temperature self-regulating electric heater having a maximum temperature below the damage temperature of the circuit board and elements thereon, so that each connection associated with said array receives only that amount of heat energy necessary to melt the solder and bond the conductors to one another, and accurately aligning conductors of an array to prevent a conductor of one array from contacting two conductors of the other array.