Patent US2373897A successfully refreshed from Google Patents.
Patent US5171965A successfully refreshed from Google Patents.
US5171965A
Expired / Lapsed
US
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Exposure method and apparatus
Assignee: Canon Inc
•
Filing: 1991-12-23
•
Granted: 1992-12-15
•
Expires: 2011-12-23
Abstract
Abstract A method and an apparatus for exposing an object with a pulsed laser beam. The exposure of one shot (one exposure area) is achieved by a plurality of pulse exposures with laser light in a corresponding number of pulses, as the result of which any fluctuations or errors in the outputs of the pulses are substantially compensated so that correct exposure of each shot is assured. In another aspect, the amounts of exposures by the plural pulses for the one shot exposure are integrated and the integrated amount of exposure is compared with a correct or desired amount of exposure. On the basis of the result of comparison, an additional pulse exposure is effected in accordance with the degree of under exposure.
Inventors
- 👤 Akiyoshi Suzuki
- 👤 Hiroshi Echizen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 20:33
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70483; G03F7/7055; G03F7/70558; G03F7/70216; G03F7/70225
Claims Analysis
Total Claims: 92
Claim 1
Independent Claim
121 words
An apparatus for forming a circuit pattern on a wafer, said apparatus comprising: a mask bearing the circuit pattern; a pulsed laser for illuminating the mask with a plurality of pulses in a single exposure, each pulse providing an amount of light smaller than an amount of light required for correct exposure of the wafer; means for measuring the total amount of light in a first portion of the exposure and for comparing the measured amount of light with the required amount of light; and means for controlling the amount of light provided in a second portion of the exposure by controlling pulse height of the laser pulses so that the single exposure substantially provides the total required amount of light.
Claim 2
Independent Claim
121 words
An apparatus for forming a circuit pattern on a wafer, said apparatus comprising: a mask bearing the circuit pattern; a pulsed laser for illuminating the mask with a plurality of pulses in a single exposure, each pulse providing an amount of light smaller than an amount of light required for correct exposure of the wafer; means for measuring the total amount of light in a first portion of the exposure and for comparing the measured amount of light with the required amount of light; and means for controlling the amount of light provided in a second portion of the exposure by controlling pulse height of the laser pulses so that the single exposure substantially provides the total required amount of light.
Claim 3
Dependent Claim
15 words
An apparatus according to claim 1, wherein the second portion consists of a single pulse.
Claim 4
Dependent Claim
15 words
An apparatus according to claim 1, wherein the first portion comprises a plurality of pulses.
Claim 5
Dependent Claim
49 words
An apparatus according to claim 3, further comprising pulse output presetting means for variably presetting the output of each of said pulses to be generated by said laser in said first portion at a value suitable for providing an amount of light smaller than the required amount of light.
Claim 6
Dependent Claim
23 words
An apparatus according to claim 4, wherein said pulse output presetting means is adapted to preset the same light output for each pulse.
Claim 7
Dependent Claim
13 words
An apparatus according to claim 5, wherein the laser is an excimer laser.
Claim 8
Dependent Claim
16 words
An apparatus according to claim 1, wherein the second portion consists of a plurality of pulses.
Claim 9
Dependent Claim
55 words
An apparatus according to claim 7, wherein said means for controlling the amount of light in the second portion of the exposure is adapted to preset, for at least the last one of said additional pulses, an output different from the preset output of each of said pulses in the first portion of the exposure.
Claim 10
Dependent Claim
21 words
An apparatus according to claim 1, wherein the pulse height of the laser pulses is controlled by controlling said pulsed laser.
Claim 11
Dependent Claim
19 words
An apparatus according to claim 1, further comprising an optical filter for controlling pulse height of the laser pulses.
Claim 12
Independent Claim
110 words
A method of forming a circuit pattern on a wafer, said method comprising the steps of: forming on the wafer an image of a mask bearing the circuit pattern by illuminating the mask in a single exposure with a plurality of pulses from a pulsed laser, the exposure comprising a first portion and a second portion; comparing the total amount of light in the first portion with the total amount of light required for correct exposure of the wafer; and controlling the amount of light in the second portion by controlling pulse height of the laser pulses so that the single exposure substantially provides the total required amount of light.
Claim 13
Independent Claim
110 words
A method of forming a circuit pattern on a wafer, said method comprising the steps of: forming on the wafer an image of a mask bearing the circuit pattern by illuminating the mask in a single exposure with a plurality of pulses from a pulsed laser, the exposure comprising a first portion and a second portion; comparing the total amount of light in the first portion with the total amount of light required for correct exposure of the wafer; and controlling the amount of light in the second portion by controlling pulse height of the laser pulses so that the single exposure substantially provides the total required amount of light.
Claim 14
Dependent Claim
15 words
A method according to claim 11, wherein the second portion consists of a single pulse.
Claim 15
Dependent Claim
16 words
A method according to claim 11, wherein the second portion consists of a plurality of pulses.
Claim 16
Dependent Claim
40 words
A method according to claim 13, wherein at least the last pulse of the second portion of the pulse exposure has a preset output different from that of each of the pulses in the first portion of the pulse exposure.
Claim 17
Dependent Claim
15 words
A method according to claim 11, wherein the first portion comprises a plurality of pulses.
Claim 18
Dependent Claim
21 words
A method according to claim 15, wherein said pulses in said first portion have preset outputs substantially equal to each other.
Claim 19
Dependent Claim
20 words
A method according to claim 16, wherein the pulsed laser beam comprises a laser beam provided by an excimer laser.
Claim 20
Dependent Claim
20 words
A method according to claim 11, further comprising controlling the pulsed laser to control pulse height of the laser pulses.
Claim 21
Dependent Claim
19 words
A method according to claim 11, further comprising controlling pulse height of the laser pulses by an optical filter.
Claim 22
Independent Claim
89 words
A method of forming a circuit pattern on a wafer by transferring the pattern from a mask to the wafer, said method comprising the steps of: illuminating the mask in a single exposure by a predetermined number of pulses from a pulsed laser, each laser pulse providing an amount of light less than that required for correct exposure of the wafer; and carrying out said exposure without controlling said exposure on the basis of monitoring the amount of light provided by the pulses from the laser during said exposure.
Claim 23
Independent Claim
89 words
A method of forming a circuit pattern on a wafer by transferring the pattern from a mask to the wafer, said method comprising the steps of: illuminating the mask in a single exposure by a predetermined number of pulses from a pulsed laser, each laser pulse providing an amount of light less than that required for correct exposure of the wafer; and carrying out said exposure without controlling said exposure on the basis of monitoring the amount of light provided by the pulses from the laser during said exposure.
Claim 24
Dependent Claim
23 words
A method according to claim 20, in which all of said laser pulses in said single exposure illuminating steps are substantially the same.
Claim 25
Dependent Claim
25 words
A method according to claim 20, wherein differing amounts of light are provided in the laser pulses in said single exposure of said illuminating step.
Claim 26
Independent Claim
28 words
A method according to claims 20, 21 or 22, wherein the pattern is projected from the mask to the wafer during said illuminating step by an optical system.
Claim 27
Independent Claim
16 words
A method according to claims 20, 21 or 22, wherein said laser is an excimer laser.
Claim 28
Dependent Claim
123 words
Apparatus for forming a circuit pattern on a mask onto a wafer, said apparatus comprising: means for transferring the circuit pattern from the mask to the wafer, said transferring means comprising a pulsed laser for illuminating the mask; and control means for causing said pulsed laser to illuminate the mask in a single exposure with a predetermined number of pulses from said laser, each said pulse providing an amount of light less than that required for correct exposure of the wafer, said control means being adjustable for varying the amount of light in the pulses and being arranged to operate without controlling said exposure on the basis of monitoring the amount of light provided by the pulses from said laser during said exposure.
Claim 29
Dependent Claim
123 words
Apparatus for forming a circuit pattern on a mask onto a wafer, said apparatus comprising: means for transferring the circuit pattern from the mask to the wafer, said transferring means comprising a pulsed laser for illuminating the mask; and control means for causing said pulsed laser to illuminate the mask in a single exposure with a predetermined number of pulses from said laser, each said pulse providing an amount of light less than that required for correct exposure of the wafer, said control means being adjustable for varying the amount of light in the pulses and being arranged to operate without controlling said exposure on the basis of monitoring the amount of light provided by the pulses from said laser during said exposure.
Claim 30
Dependent Claim
25 words
Apparatus according to claim 25, wherein said control means is operable such that all of said pulses in said single exposure are substantially the same.
Claim 31
Dependent Claim
25 words
Apparatus according to claim 25, wherein said control means is operable such that different pulses in said single exposure may provide different amounts of light.
Claim 32
Dependent Claim
29 words
Apparatus according to claims 25, 26 or 22, wherein said transferring means includes optical means for projecting an image of the circuit pattern from the mask to the wafer.
Claim 33
Dependent Claim
15 words
Apparatus according to claims 25, 26 or 27, wherein said laser is an excimer laser.
Claim 34
Dependent Claim
176 words
Apparatus for forming a circuit pattern on a mask onto a wafer, comprising: means for transferring the pattern from the mask bearing the circuit pattern to the wafer, said transferring means including a pulsed laser; means for causing said pulsed laser to illuminate the mask with a plurality of laser pulses in a single exposure, each pulse providing an amount of light less than that required for the correct exposure of the wafer; means for measuring the amount of light in a first portion of the exposure containing at least one laser pulse; means for comparing the measured amount of light with an amount corresponding to that required for correct exposure for determining the remainder of the amount of light required; and means for providing said remainder of the amount of light in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provide substantially the correct amount of light for exposure.
Claim 35
Dependent Claim
176 words
Apparatus for forming a circuit pattern on a mask onto a wafer, comprising: means for transferring the pattern from the mask bearing the circuit pattern to the wafer, said transferring means including a pulsed laser; means for causing said pulsed laser to illuminate the mask with a plurality of laser pulses in a single exposure, each pulse providing an amount of light less than that required for the correct exposure of the wafer; means for measuring the amount of light in a first portion of the exposure containing at least one laser pulse; means for comparing the measured amount of light with an amount corresponding to that required for correct exposure for determining the remainder of the amount of light required; and means for providing said remainder of the amount of light in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provide substantially the correct amount of light for exposure.
Claim 36
Dependent Claim
13 words
Apparatus according to claim 30, wherein said pulsed laser is an excimer laser.
Claim 37
Dependent Claim
28 words
Apparatus according to claims 30 or 31, wherein said transferring means includes an optical system for projecting an image of the pattern on the mask onto the wafer,
Claim 38
Dependent Claim
28 words
Apparatus according to claims 30 or 31, wherein said remainder providing means is arranged so that the second portion of the exposure comprises a plurality of laser pulses.
Claim 39
Dependent Claim
37 words
Apparatus according to claim 33, wherein said remainder providing means is arranged so that each laser pulse in the second portion of the exposure contains less light than that of each laser pulse in the first portion.
Claim 40
Dependent Claim
33 words
Apparatus according to claim 33, wherein said remainder providing means is arranged so that the laser pulses in the second portion of the exposure contain the same amount of light as each other.
Claim 41
Dependent Claim
39 words
Apparatus according to claim 33, wherein said remainder providing means is arranged so that the last laser pulse in the second portion of the exposure contains less light than that of each other laser pulse in the second portion.
Claim 42
Independent Claim
162 words
A method of forming a circuit pattern on a mask onto a wafer, comprising: illuminating the mask bearing the circuit pattern with a plurality of pulses from a pulsed laser in a single exposure for transferring the pattern from the mask to the wafer, each laser pulse providing an amount of light less than that required for the correct exposure of the wafer; measuring the amount of light in a first portion of the exposure containing at least one laser pulse; comparing the measured amount of light with an amount of light corresponding to that required for correct exposure for determining the remainder of the amount of light required; and providing said remainder of the amount of light in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provided substantially the correct amount of light for exposure.
Claim 43
Independent Claim
162 words
A method of forming a circuit pattern on a mask onto a wafer, comprising: illuminating the mask bearing the circuit pattern with a plurality of pulses from a pulsed laser in a single exposure for transferring the pattern from the mask to the wafer, each laser pulse providing an amount of light less than that required for the correct exposure of the wafer; measuring the amount of light in a first portion of the exposure containing at least one laser pulse; comparing the measured amount of light with an amount of light corresponding to that required for correct exposure for determining the remainder of the amount of light required; and providing said remainder of the amount of light in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provided substantially the correct amount of light for exposure.
Claim 44
Dependent Claim
16 words
A method according to claim 37, wherein said laser pulses are obtained from an excimer laser.
Claim 45
Independent Claim
28 words
A method according to claims 37 or 38, wherein an image of the pattern on the mask is formed on the wafer by means of an optical system.
Claim 46
Independent Claim
21 words
A method according to claims 37 or 38, wherein the second portion of the exposure comprises a plurality of laser pulses.
Claim 47
Dependent Claim
30 words
A method according to claim 40, in which laser pulse in the second portion of the exposure contains less light than that of each laser pulse in the first portion.
Claim 48
Dependent Claim
27 words
A method according to claim 40, in which the laser pulses in the second portion of the exposure contain the same amount of light as each other.
Claim 49
Dependent Claim
35 words
A method according to claim 40, in which the last of the laser pulses in the second portion of the exposure contains less light than that of each other laser pulse in the second portion.
Claim 50
Independent Claim
98 words
A method of forming a circuit pattern on a mask onto a wafer in which the pattern is transferred from a mask to the wafer, comprising the steps of: illuminating the mask in a single exposure by a number of pulses from a pulsed laser, each pulse providing an amount of light less than that required for correct exposure of the wafer, said exposure comprising a first portion containing a predetermined number of laser pulses and a second portion which is controlled so that the first and second portions together provide the required amount of light for exposure.
Claim 51
Independent Claim
98 words
A method of forming a circuit pattern on a mask onto a wafer in which the pattern is transferred from a mask to the wafer, comprising the steps of: illuminating the mask in a single exposure by a number of pulses from a pulsed laser, each pulse providing an amount of light less than that required for correct exposure of the wafer, said exposure comprising a first portion containing a predetermined number of laser pulses and a second portion which is controlled so that the first and second portions together provide the required amount of light for exposure.
Claim 52
Dependent Claim
21 words
A method according to claim 44, in which all of said laser pulses in said single exposure are substantially the same.
Claim 53
Dependent Claim
20 words
A method according to claim 44, wherein differing amounts of light are provided in laser pulses in said single exposure.
Claim 54
Independent Claim
24 words
A method according to claims 44, 45 or 46, wherein the pattern is projected from the mask to the wafer by an optical system.
Claim 55
Independent Claim
16 words
A method according to claims 44, 45 or 46, wherein said laser is an excimer laser.
Claim 56
Dependent Claim
127 words
Apparatus for forming a circuit pattern on a mask onto a wafer, said apparatus comprising: means for transferring the circuit pattern from a mask to the wafer, said transferring means comprising a pulsed laser for illuminating the mask; and control means for causing the mask to be illuminated in a single exposure with a number of laser pulses from said laser, each pulse providing an amount of light less than that required for correct exposure of the wafer, said control means being operable to control said transferring means to perform said exposure in first and second portions, said first portion containing a predetermined number of laser pulses and said second portion being controlled so that the first and second portions together provide the required amount of light.
Claim 57
Dependent Claim
127 words
Apparatus for forming a circuit pattern on a mask onto a wafer, said apparatus comprising: means for transferring the circuit pattern from a mask to the wafer, said transferring means comprising a pulsed laser for illuminating the mask; and control means for causing the mask to be illuminated in a single exposure with a number of laser pulses from said laser, each pulse providing an amount of light less than that required for correct exposure of the wafer, said control means being operable to control said transferring means to perform said exposure in first and second portions, said first portion containing a predetermined number of laser pulses and said second portion being controlled so that the first and second portions together provide the required amount of light.
Claim 58
Dependent Claim
26 words
Apparatus according to claim 49, wherein said control means is operable such that all of said laser pulses in said single exposure are substantially the same.
Claim 59
Dependent Claim
26 words
Apparatus according to claim 49, wherein said control means is operable such the different laser pulses in said single exposure may provide different amounts of light.
Claim 60
Dependent Claim
29 words
Apparatus according to claims 49, 50 or 51, wherein said transferring means includes optical means for projecting an image of the circuit pattern from the mask to the wafer.
Claim 61
Dependent Claim
15 words
Apparatus according to claims 49, 50 or 51, wherein said laser is an excimer laser.
Claim 62
Independent Claim
115 words
A method of performing exposure with intermittent light, comprising: sequentially effecting a coarse exposure of each of a plurality of areas to be exposed, each of said coarse exposures providing an amount of light smaller than the required amount for the area to be exposed; and thereafter sequentially effecting a fine exposure of each of the areas to be exposed, each of said fine exposures providing an amount of light which is smaller than that provided by said coarse exposure for the area to be exposed and which supplements said coarse exposure so that the total amount of light provided by said coarse exposure and said fine exposure is substantially equal to the required exposure.
Claim 63
Independent Claim
115 words
A method of performing exposure with intermittent light, comprising: sequentially effecting a coarse exposure of each of a plurality of areas to be exposed, each of said coarse exposures providing an amount of light smaller than the required amount for the area to be exposed; and thereafter sequentially effecting a fine exposure of each of the areas to be exposed, each of said fine exposures providing an amount of light which is smaller than that provided by said coarse exposure for the area to be exposed and which supplements said coarse exposure so that the total amount of light provided by said coarse exposure and said fine exposure is substantially equal to the required exposure.
Claim 64
Dependent Claim
25 words
A method according to claim 54, wherein a plurality of exposures are effected for said coarse exposure for each of the areas to be exposed.
Claim 65
Independent Claim
34 words
A method according to claims 54 or 55, wherein the order in which the fine exposures are conducted relative to the areas to be exposed is the same as that of said coarse exposures.
Claim 66
Independent Claim
33 words
A method according to claims 54 or 55, wherein the order in which the fine exposures are conducted relative to the areas to be exposed is opposite to that of said coarse exposures.
Claim 67
Independent Claim
44 words
A method according to claims 54 or 55, wherein said areas are arranged in a plurality of rectilinear rows, both the coarse exposures and the fine exposures for each row being carried out before the coarse exposures and fine exposures for the next row.
Claim 68
Independent Claim
18 words
A method according to claims 54 or 55, wherein the intermittent light is provided by an excimer laser.
Claim 69
Dependent Claim
210 words
An exposure apparatus for exposing a wafer to a pattern on a mask, comprising: means for producing intermittent light; a projection optical system for transferring the pattern on the mask onto the wafer; carriage means for carrying thereon the wafer, said carriage means being movable to transfer the pattern of the mask onto a plurality of areas on the wafer; measuring means for integratingly detecting an amount of exposure on each of said areas on the wafer; and controlling means for controlling said light producing means to effect sequentially a coarse exposure of each of said areas on the wafer and then sequentially a fine exposure of each of said areas, said control means controlling said coarse exposure so that it provides an amount of light smaller than the required correct exposure for each of said areas on the wafer, said control means also controlling said fine exposure so that it provides an amount of light smaller than that provided by said coarse exposure relative to the corresponding one of said areas on the wafer and so that the total amount of light provided by said coarse exposure and said fine exposure relative to the corresponding one of the areas on the wafer is substantially equal to the required exposure.
Claim 70
Dependent Claim
210 words
An exposure apparatus for exposing a wafer to a pattern on a mask, comprising: means for producing intermittent light; a projection optical system for transferring the pattern on the mask onto the wafer; carriage means for carrying thereon the wafer, said carriage means being movable to transfer the pattern of the mask onto a plurality of areas on the wafer; measuring means for integratingly detecting an amount of exposure on each of said areas on the wafer; and controlling means for controlling said light producing means to effect sequentially a coarse exposure of each of said areas on the wafer and then sequentially a fine exposure of each of said areas, said control means controlling said coarse exposure so that it provides an amount of light smaller than the required correct exposure for each of said areas on the wafer, said control means also controlling said fine exposure so that it provides an amount of light smaller than that provided by said coarse exposure relative to the corresponding one of said areas on the wafer and so that the total amount of light provided by said coarse exposure and said fine exposure relative to the corresponding one of the areas on the wafer is substantially equal to the required exposure.
Claim 71
Dependent Claim
17 words
An apparatus according to claim 60, wherein said means for producing intermittent light comprises an excimer laser.
Claim 72
Independent Claim
15 words
An apparatus according to claims 60 or 61, wherein said carriage means is movable continuously.
Claim 73
Independent Claim
61 words
An apparatus according to claims 60 or 61, wherein the integrated amount of light detected by said detecting means on each of the areas of the wafer provided for said coarse exposure is memorized by said control means, and said fine exposure is controlled by said controls means in accordance with the memorized amount of light provided for said coarse exposure.
Claim 74
Dependent Claim
61 words
Apparatus according to claims 60 or 61, wherein said apparatus is arranged for transferring the pattern of the mask onto a plurality of said areas arranged in a plurality of rectilinear rows, said apparatus being further arranged to perform both said coarse and said fine exposures in each said row before performing the coarse and fine exposures for the next row.
Claim 75
Dependent Claim
203 words
Apparatus for forming a circuit pattern on a mask onto a wafer, comprising: means for transferring the pattern from the mask bearing the circuit pattern to the wafer, said transferring means including a pulsed laser; means for causing the mask to be illuminated with a plurality of pulses from the laser in a single exposure, each laser pulse providing an amount of light in a first portion of the exposure containing at least one laser pulse; means for measuring the amount of light in a first portion of the exposure containing at least one laser pulse; means for comparing the measured amount of light with an amount of light corresponding to that required for correct exposure for determining the remainder of the amount of light required; and means for providing said remainder of the amount of light required in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provide substantially the correct amount of light, said second portion comprising a laser pulse providing an amount of light less than that of each laser pulse in the first portion.
Claim 76
Dependent Claim
203 words
Apparatus for forming a circuit pattern on a mask onto a wafer, comprising: means for transferring the pattern from the mask bearing the circuit pattern to the wafer, said transferring means including a pulsed laser; means for causing the mask to be illuminated with a plurality of pulses from the laser in a single exposure, each laser pulse providing an amount of light in a first portion of the exposure containing at least one laser pulse; means for measuring the amount of light in a first portion of the exposure containing at least one laser pulse; means for comparing the measured amount of light with an amount of light corresponding to that required for correct exposure for determining the remainder of the amount of light required; and means for providing said remainder of the amount of light required in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provide substantially the correct amount of light, said second portion comprising a laser pulse providing an amount of light less than that of each laser pulse in the first portion.
Claim 77
Dependent Claim
12 words
Apparatus to claim 65, wherein said pulsed laser is an excimer laser.
Claim 78
Dependent Claim
28 words
Apparatus according to claims 65 or 66, wherein said transferring means includes an optical system for projection an image of the pattern on the mask onto the wafer.
Claim 79
Dependent Claim
29 words
Apparatus according to claims 65 or 66, wherein said remainder providing means is arranged so that the second portion of the exposure consists of a single said laser pulse.
Claim 80
Independent Claim
187 words
A method of forming a circuit pattern on a mask onto a wafer, comprising the steps of: illuminating the mask bearing the circuit pattern with a plurality of pulses from a pulsed laser in a single exposure for transferring the pattern from the mask to the wafer, each laser pulse providing an amount of light less than that required for the correct exposure of the wafer; measuring the amount of light in a first portion of the exposure containing at least one laser pulse; comparing the measured amount of light with an amount of light corresponding to that required for correct exposure for determining the remainder of the amount of light required; and providing said remainder of the amount of light required in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provide substantially the correct amount of light, said second portion comprising a laser pulse providing an amount of light less than that of each laser pulse in the first portion.
Claim 81
Independent Claim
187 words
A method of forming a circuit pattern on a mask onto a wafer, comprising the steps of: illuminating the mask bearing the circuit pattern with a plurality of pulses from a pulsed laser in a single exposure for transferring the pattern from the mask to the wafer, each laser pulse providing an amount of light less than that required for the correct exposure of the wafer; measuring the amount of light in a first portion of the exposure containing at least one laser pulse; comparing the measured amount of light with an amount of light corresponding to that required for correct exposure for determining the remainder of the amount of light required; and providing said remainder of the amount of light required in a second portion of the exposure without performing any further comparing operation for the control of said second portion of said exposure, so that the first and second portions of the single exposure together provide substantially the correct amount of light, said second portion comprising a laser pulse providing an amount of light less than that of each laser pulse in the first portion.
Claim 82
Dependent Claim
15 words
A method according to claim 69, wherein said pulses are obtained from an excimer laser.
Claim 83
Independent Claim
28 words
A method according to claims 69 or 70, wherein an image of the pattern on the mask is formed on the wafer by means of an optical system.
Claim 84
Independent Claim
23 words
A method according to claims 67 or 70, in which the second portion of the exposure consists of a single said laser pulse.
Claim 85
Dependent Claim
161 words
A semiconductor device manufacturing exposure method comprising the steps of: exposing a predetermined zone of a wafer to a pattern of a mask with pulses of an excimer laser passed through an illumination optical system, for transferring the mask to the wafer, wherein each pulse has a light quantity smaller than a quantity of correct exposure for the predetermined zone, and wherein the exposure zone includes a first portion containing at least one pulse and a second portion containing at least one pulse; discriminating the relationship between the total quantity of exposure in the first portion and the quantity of correct exposure for the predetermined zone; and controlling pulse height of the at least one pulse in the second portion of the exposure zone to control the total quantity of exposure in the second portion, so that the predetermined zone is exposed in the first and second portions with a quantity of exposure substantially equal to the quantity of correct exposure.
Claim 86
Dependent Claim
161 words
A semiconductor device manufacturing exposure method comprising the steps of: exposing a predetermined zone of a wafer to a pattern of a mask with pulses of an excimer laser passed through an illumination optical system, for transferring the mask to the wafer, wherein each pulse has a light quantity smaller than a quantity of correct exposure for the predetermined zone, and wherein the exposure zone includes a first portion containing at least one pulse and a second portion containing at least one pulse; discriminating the relationship between the total quantity of exposure in the first portion and the quantity of correct exposure for the predetermined zone; and controlling pulse height of the at least one pulse in the second portion of the exposure zone to control the total quantity of exposure in the second portion, so that the predetermined zone is exposed in the first and second portions with a quantity of exposure substantially equal to the quantity of correct exposure.
Claim 87
Dependent Claim
35 words
A method according to claim 73, wherein the last pulse in the second portion of the exposure zone has a height different from that of each pulse in the first portion of the exposure zone.
Claim 88
Dependent Claim
103 words
In a semiconductor device manufacturing exposure method for exposing a predetermined zone of a wafer to a pattern of a mask with pulses of an excimer laser passed through an illuminating optical system, for transferring the mask pattern to the wafer, wherein each pulse has a light quantity smaller than a quantity of correct exposure for the predetermined zone, the improvement comprising: exposing the predetermined zone of the wafer with a fixed number of pulses from the excimer laser, for the correct exposure; and effecting the exposure of the predetermined zone free from monitoring a light quantity during the exposure with the pulses.
Claim 89
Dependent Claim
103 words
In a semiconductor device manufacturing exposure method for exposing a predetermined zone of a wafer to a pattern of a mask with pulses of an excimer laser passed through an illuminating optical system, for transferring the mask pattern to the wafer, wherein each pulse has a light quantity smaller than a quantity of correct exposure for the predetermined zone, the improvement comprising: exposing the predetermined zone of the wafer with a fixed number of pulses from the excimer laser, for the correct exposure; and effecting the exposure of the predetermined zone free from monitoring a light quantity during the exposure with the pulses.
Claim 90
Dependent Claim
138 words
A semiconductor device manufacturing exposure method comprising the steps of: exposing a predetermined zone of a wafer to a pattern of a mask with pulses of an excimer laser passed through an illumination optical system, for transferring the mask pattern to the wafer, wherein each pulse has a light quantity smaller than a quantity of correct exposure for the predetermined zone, and wherein the exposure zone includes a first portion containing at least two pulses and a second portion containing at least one pulse; controlling pulse height of the at least one pulse in the second portion of the exposure zone to control the total quantity of exposure in the second portion, so that the predetermined zone is exposed in the first and second portions with a quantity of exposure substantially equal to the quantity of correct exposure.
Claim 91
Dependent Claim
138 words
A semiconductor device manufacturing exposure method comprising the steps of: exposing a predetermined zone of a wafer to a pattern of a mask with pulses of an excimer laser passed through an illumination optical system, for transferring the mask pattern to the wafer, wherein each pulse has a light quantity smaller than a quantity of correct exposure for the predetermined zone, and wherein the exposure zone includes a first portion containing at least two pulses and a second portion containing at least one pulse; controlling pulse height of the at least one pulse in the second portion of the exposure zone to control the total quantity of exposure in the second portion, so that the predetermined zone is exposed in the first and second portions with a quantity of exposure substantially equal to the quantity of correct exposure.
Claim 92
Dependent Claim
35 words
A method according to claim 76, wherein the last pulse in the second portion of the exposure zone has a height different from that of each pulse in the first portion of the exposure zone.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-15 | 1996-06-15 | 1996-12-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-15 | 2000-06-15 | 2000-12-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-15 | 2004-06-15 | 2004-12-15 | $7700.00 | Window Closed / Lapsed |