Patent US5168624A successfully refreshed from Google Patents.
US5168624A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing printed wiring board
Assignee: Nippon CMK Corp
•
Filing: 1991-03-15
•
Granted: 1992-12-08
•
Expires: 2011-03-15
Abstract
Abstract A method of manufacturing a printed wiring board on a cubically molded substrate enables formation of high-precision printed circuits fully compatible with the complex configuration of the cubic substrate. The manufacturing method includes initially forming a conductive layer on the surface of a cubic substrate followed by etching the conductive layer. The method includes the steps of forming electrodeposited resist on the conductive layer, exposing the electrodeposited resist to parallel light beams through a planar photomask, and etching the conductive layer to complete the formation of the printed circuit.
Inventors
- 👤 Junzaburo Shirai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-26 23:13
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/02; H05K3/0073; H05K3/0082; H05K3/06; H05K3/061; H05K3/064; H05K1/00; H05K1/02; H05K1/0284; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09036; H05K2203/00; H05K2203/05; H05K2203/0548; H05K2203/056; H05K2203/13; H05K2203/1333; H05K2203/135; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49165
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
114 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a substrate having an exterior surface, at least one portion of the surface having a higher elevation than another portion of the surface; forming a conductive layer on the surface at portions thereof that are at different elevations; forming an electrolytically deposited resist on the conductive layer; selectively exposing the resist to parallel light beams through a photomask to form a circuit pattern of nonexposed resist; removing the exposed resist to expose areas of the conductive layer not covered by the non-exposed resist; and etching the exposed areas of the conductive layer to form the conductive layer having the circuit pattern.
Claim 2
Independent Claim
114 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a substrate having an exterior surface, at least one portion of the surface having a higher elevation than another portion of the surface; forming a conductive layer on the surface at portions thereof that are at different elevations; forming an electrolytically deposited resist on the conductive layer; selectively exposing the resist to parallel light beams through a photomask to form a circuit pattern of nonexposed resist; removing the exposed resist to expose areas of the conductive layer not covered by the non-exposed resist; and etching the exposed areas of the conductive layer to form the conductive layer having the circuit pattern.
Claim 3
Dependent Claim
19 words
A method of manufacturing a printed circuit board according to claim 1; wherein the photomask comprises a planar photomask.
Claim 4
Dependent Claim
28 words
A method of manufacturing a printed circuit board according to claim 2; further comprising the step of roughing the surface of the substrate before forming the conductive layer.
Claim 5
Dependent Claim
35 words
A method of manufacturing a printed circuit board according to claim 3; wherein the step of roughing includes applying at least one of an organic solvent and chromic acid to the surface of the substrate.
Claim 6
Dependent Claim
30 words
A method of manufacturing a printed circuit board according to claim 1; further comprising the step of forming at least one through-hole in the substrate before forming the conductive layer.
Claim 7
Dependent Claim
52 words
A method of manufacturing a printed circuit board according to claim 1; wherein the surface includes a top surface and a bottom surface of the substrate, and at least one of the top surface and the bottom surface has at least one portion thereof having a higher elevation than another portion thereof.
Claim 8
Dependent Claim
28 words
A method of manufacturing a printed circuit board according to claim 1; further comprising the step of removing the resist covering the conductive layer forming the circuit pattern.
Claim 9
Dependent Claim
21 words
A method of manufacturing a printed circuit board according to claim 1; wherein the resist is a positive-type electrolytically deposited resist.
Claim 10
Independent Claim
135 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a substrate having an exterior surface, at least one portion of the surface having a higher elevation than another portion of the surface; forming a conductive layer on the surface at portions thereof that are at different elevations; forming an electrolytically deposited resist on the conductive layer; selectively exposing the resist to parallel light beams through a planar photomask to form a circuit pattern, wherein the planar photomask at most contacts only a portion of the resist covering the portion of the surface having the highest elevation; removing portions of the resist not forming the circuit pattern to expose areas of the conductive layer; and etching the exposed areas of the conductive layer to form the conductive layer having the circuit pattern.
Claim 11
Independent Claim
135 words
A method of manufacturing a printed circuit board, comprising the steps of: forming a substrate having an exterior surface, at least one portion of the surface having a higher elevation than another portion of the surface; forming a conductive layer on the surface at portions thereof that are at different elevations; forming an electrolytically deposited resist on the conductive layer; selectively exposing the resist to parallel light beams through a planar photomask to form a circuit pattern, wherein the planar photomask at most contacts only a portion of the resist covering the portion of the surface having the highest elevation; removing portions of the resist not forming the circuit pattern to expose areas of the conductive layer; and etching the exposed areas of the conductive layer to form the conductive layer having the circuit pattern.
Claim 12
Dependent Claim
28 words
A method of manufacturing a printed circuit board according to claim 9; further comprising the step of roughing the surface of the substrate before forming the conductive layer.
Claim 13
Dependent Claim
35 words
A method of manufacturing a printed circuit board according to claim 10; wherein the step of roughing includes applying at least one of an organic solvent and chromic acid to the surface of the substrate.
Claim 14
Dependent Claim
30 words
A method of manufacturing a printed circuit board according to claim 9; further comprising the step of forming at least one through-hole in the substrate before forming the conductive layer.
Claim 15
Dependent Claim
52 words
A method of manufacturing a printed circuit board according to claim 9; wherein the surface includes a top surface and a bottom surface of the substrate, and at least one of the top surface and the bottom surface has at least one portion thereof having a higher elevation than another portion thereof.
Claim 16
Dependent Claim
28 words
A method of manufacturing a printed circuit board according to claim 9; further comprising the step of removing the resist covering the conductive layer forming the circuit pattern.
Claim 17
Dependent Claim
21 words
A method of manufacturing a printed circuit board according to claim 9; wherein the resist is a positive-type electrolytically deposited resist.
References Cited (Backward Citations)
US4673458A
Cited
USRE33108E
Cited
US4671854A
Cited
US4712297A
Cited
US4705592A
Cited
US4830880A
Cited
US4755551A
Cited
US4983252A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-12-08 | 1996-06-08 | 1996-12-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-12-08 | 2000-06-08 | 2000-12-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-12-08 | 2004-06-08 | 2004-12-08 | $7700.00 | Window Closed / Lapsed |