Electrically erasable phase change memory

Claim 2

An electrically erasable phase change memory comprising: (a) at least one pore of phase change material which is capable of being reversibly electrically switched between at least two electrically detectable states, the first of said at least two detectable stages having a local atomic order which is detectably less ordered than the local atomic order of the second of said at least two detectable states; (b) electrical contact means making electrical contact with at least two portions of said pore to establish an electrical path through said pore between the points of contact with said at least two portions; and (c) means for applying electrical signals to said electrical contact means to cause reversible switching of at least a volume portion of said phase change material in said electrical path in said pore between said at least two detectable states, said first detectable state being characterized by an electrical conductivity which is lower than that of said second detectable state; (d) said phase change material being comprised of a plurality of elements which are distributed within said phase change material in said first detectable state and are converted into said second detectable state in said volume portion with substantially the same average local density of distribution of the constituent elements within said volume portion as present in said first detectable state.

Claim 3

An electrically erasable phase change memory as set forth in claim 1 in which said plurality of elements distributed within said phase change material in said first detectable state are substantially fully absorbed in one or more crystalline phases in said volume portion of second detectable state.

Claim 4

An electrically erasable phase change memory as set forth in claim 1 wherein said phase change material comprises Te, Ge and Sb as the principal elements thereof, which are distributed in the amorphous state substantially in the ratio Te a Ge b Sb 100- (a+b), where the subscripts are in atomic percentages which total 100% of the constituent elements and a is equal to or less than about 70% and b is between about 15% to about 50%.

Claim 5

An electrically erasable phase change memory as set forth in claim 3 where a is equal to or less than about 60% and b is between about 17% to about 44%.

Claim 6

An electrically erasable phase change memory as set forth in claim 1 in which the band gap of said phase change material is substantially reduced in the transition from said first detectable state to said second detectable state.

Claim 7

An electrically erasable phase change memory as set forth in claim 2 in which said one or more crystalline phases includes at least one multi-element crystalline phase.

Claim 8

An electrically erasable phase change memory as set forth in claim 2 in which said one or more crystalline phases includes a plurality of multi-element crystalline phases.

Claim 9

An electrically erasable phase change memory as set forth in claim 2 in which said one or more crystalline phases comprises a plurality of crystalline phases.

Claim 10

An electrically erasable phase change memory as set forth in claim 8 in which the crystallization temperatures of said plurality of crystalline phases are all within about 100° C. of each other.

Claim 11

An electrically erasable phase change memory as set forth in claim 2 in which the crystallites in said multi-element crystalline phases have a characteristic dimension of less than about 1,000 Angstroms.

Claim 12

An integrated circuit electrically erasable phase change memory comprising: (a) a single crystal semiconductor substrate; (b) a plurality of electrically erasable phase change memory elements formed on said substrate; (c) each of said memory elements comprising a pore of phase change material and an integrated circuit means for electrically isolating said memory element, said electrical isolating means and said pore of phase change material being electrically connected in series with each other; (d) said phase change material being comprised of a plurality of elements which are distributed within said phase change material in a first substantially amorphous state and are converted into a second substantially crystalline state in at least a volume portion of said pore with substantially the same average local density of distribution of the constituent elements within said volume portion as present in said substantially amorphous state; and (e) integrated electrical contact means extending across said substrate over the upper and lower portions respectively of said memory elements and making electrical contact on one side of each of said memory elements with said pore of phase change material and on the other side of each of said memory elements with said electrical isolating means and thereby providing means for selectively and individually electrically setting, erasing and reading said memory elements.

Claim 13

An integrated circuit electrically erasable phase change memory comprising: (a) a single crystal semiconductor substrate; (b) a plurality of electrically erasable phase change memory elements formed on said substrate; (c) each of said memory elements comprising a pore of phase change material and an integrated circuit means for electrically isolating said memory element, said electrical isolating means and said pore of phase change material being electrically connected in series with each other; (d) said phase change material being comprised of a plurality of elements which are distributed within said phase change material in a first substantially amorphous state and are converted into a second substantially crystalline state in at least a volume portion of said pore with substantially the same average local density of distribution of the constituent elements within said volume portion as present in said substantially amorphous state; and (e) integrated electrical contact means extending across said substrate over the upper and lower portions respectively of said memory elements and making electrical contact on one side of each of said memory elements with said pore of phase change material and on the other side of each of said memory elements with said electrical isolating means and thereby providing means for selectively and individually electrically setting, erasing and reading said memory elements.

Claim 14

An integrated circuit electrically erasable phase change memory as set forth in claim 11 further comprising signal generating means electrically connected to said contact means for generating and applying selectively to said memory elements set, erase and read pulses.

Claim 15

An integrated circuit electrically erasable phase change memory as set forth in claim 12 in which said signal generating means includes means for generating and applying set pulses of less than 100 nanoseconds in width.

Claim 16

An integrated circuit electrically erasable phase change memory as set forth in claim 11 in which said diode comprises a semiconductor junction.

Claim 17

An integrated circuit electrically erasable phase change memory as set forth in claim 14 wherein said semiconductor junction is formed at a surface extending substantially parallel to the surface of said substrate.

Claim 18

An integrated circuit electrically erasable phase change memory as set forth in claim 14 in which said semiconductor junction comprises a Schottky barrier.

Claim 19

An integrated circuit electrically erasable phase change memory as set forth in claim 14 in which said semiconductor junction comprises a p-n junction.

Claim 20

An integrated circuit electrically erasable phase change memory as set forth in claim 17 in which said p-n junction is formed at a surface extending substantially parallel to the surface of said substrate.

Claim 21

An integrated circuit electrically erasable phase change memory as set forth in claim 16 in which said Schottky barrier is formed at a surface extending substantially parallel to the surface of said substrate.

Claim 22

An integrated circuit electrically erasable phase change memory as set forth in claim 15 in which said one side and said other side of each of said memory elements which make electrical contact with said integrated electrical contact means are positioned in vertical relationship to each other.

Claim 23

An integrated circuit electrically erasable phase change memory as set forth in claim 20 in which said one side and said other side of each of said memory elements which make electrical contact with said integrated electrical contact means include contact surfaces which extend substantially parallel to each other and to the surface of said substrate.

Claim 24

An integrated circuit electrically erasable phase change memory as set forth in claim 11 in which said phase change material comprises Te, Ge and Sb as the principal elements thereof, which are distributed in the amorphous state substantially in the ratio Te a Ge b Sb 100- (a+b), where the subscripts are in atomic percentages which total 100% of the constituent elements and a is equal to or less than about 70% and b is between about 15% to about 50%.

Claim 25

An integrated circuit electrically erasable phase change memory as set forth in claim 22 where a is equal to or less than about 60% and b is between about 17% to about 44%.

Claim 26

An integrated circuit electrically erasable phase change memory as set forth in claim 11 further comprising a layer of encapsulating material extending over and encapsulating and sealing said memory elements against external environmental influences.

Claim 27

An integrated circuit electrically erasable phase change memory as set forth in claim 11 in which said pore of phase change material is less than one micrometer in diameter.

Claim 28

An electrically erasable phase change memory as set forth in claim 1 in which the diameter of said pore is less than one micrometer.

Claim 29

An electrically erasable phase change memory as set forth in claim 2 in which the diameter of said pore is less than one micrometer.

Claim 30

An integrated circuit electrically erasable phase change memory as set forth in claim 11 in which said electrical isolating means comprises a diode positioned vertically with respect to said pore of phase change material.