Patent US5203872A successfully refreshed from Google Patents.
Patent US5163605A successfully refreshed from Google Patents.
US5163605A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for mounting components to a circuit board
Assignee: Honeywell International Inc
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Filing: 1992-04-30
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Granted: 1992-11-17
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Expires: 2012-04-30
Abstract
Abstract A component is mounted to a circuit board by covering a section of the board's conductive pads with a nonconductive mask. It is also possible to plate additional conductive material onto the pads before applying the mask. The component's contacts are soldered to the uncovered sections of the pads or plating.
Inventors
- 👤 Michael J. Mencik
- 👤 Richard P. Lambert, Jr.
- 👤 Helmut Matheis
- 👤 Donald K. Swenson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:19
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3442; H05K3/3452; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0347; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09663; H05K2201/09736; H05K2201/09772; H05K2201/09818; H05K2201/0989; H05K2201/099; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10636; H05K3/22; H05K3/26; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
63 words
A method for mounting components having a conductive contact to a circuit board having a conductive pad, said method comprising: (a) covering a section of the conductive pad with a nonconductive material; and (b) soldering the conductive contact to the conductive pad so that said nonconductive material is positioned between a section of the conductive contact and said section of the conductive pad.
Claim 2
Independent Claim
63 words
A method for mounting components having a conductive contact to a circuit board having a conductive pad, said method comprising: (a) covering a section of the conductive pad with a nonconductive material; and (b) soldering the conductive contact to the conductive pad so that said nonconductive material is positioned between a section of the conductive contact and said section of the conductive pad.
Claim 3
Dependent Claim
30 words
The method of claim 1, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with an epoxy based nonconductive material.
Claim 4
Dependent Claim
39 words
The method of claim 1, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with a nonconductive material having a thickness between approximately 0.001 inches and approximately 0.003 inches.
Claim 5
Dependent Claim
25 words
The method of claim 1, wherein said step of covering said section of the conductive pad comprises covering a first and a second end section.
Claim 6
Dependent Claim
30 words
The method of claim 4, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with an epoxy based nonconductive material.
Claim 7
Dependent Claim
39 words
The method of claim 4, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with a nonconductive material having a thickness between approximately 0.001 inches and approximately 0.003 inches.
Claim 8
Dependent Claim
21 words
The method of claim 1, wherein said step of covering said section of the conductive pad comprises covering a center section.
Claim 9
Dependent Claim
30 words
The method of claim 7, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with an epoxy based nonconductive material.
Claim 10
Independent Claim
91 words
A method for mounting components having a conductive contact to a circuit board having a conductive pad, said method comprising: (a) increasing the height of the conductive pad by plating the conductive pad with a layer of conductive material to form a plated conductive pad; (b) covering a section of said plated conductive pad with a nonconductive material; and (c) soldering the conductive contact to said plated conductive pad so that said nonconductive material is positioned between a section of the conductive contact and said section of said plated conductive pad.
Claim 11
Independent Claim
91 words
A method for mounting components having a conductive contact to a circuit board having a conductive pad, said method comprising: (a) increasing the height of the conductive pad by plating the conductive pad with a layer of conductive material to form a plated conductive pad; (b) covering a section of said plated conductive pad with a nonconductive material; and (c) soldering the conductive contact to said plated conductive pad so that said nonconductive material is positioned between a section of the conductive contact and said section of said plated conductive pad.
Claim 12
Dependent Claim
30 words
The method of claim 9, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with an epoxy based nonconductive material.
Claim 13
Dependent Claim
39 words
The method of claim 9, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with a nonconductive material having a thickness between approximately 0.001 inches and approximately 0.003 inches.
Claim 14
Dependent Claim
24 words
The method of claim 9, wherein said step of covering said section of the conductive pad comprises covering a first and second end section.
Claim 15
Dependent Claim
30 words
The method of claim 12, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with an epoxy based nonconductive material.
Claim 16
Dependent Claim
39 words
The method of claim 12, wherein said step of covering said section of the conductive pad comprises covering said section of the conductive pad with a nonconductive material having a thickness between approximately 0.001 inches and approximately 0.003 inches.
Claim 17
Dependent Claim
21 words
The method of claim 9, wherein said step of covering said section of the conductive pad comprises covering a center section.
Claim 18
Independent Claim
114 words
A method for mounting components having a conductive contact to a circuit board having a copper conductive pad, said method comprising: (a) increasing the height of the copper conductive pad by plating the copper conductive pad with a layer of copper to form a plated conductive pad having between approximately 0.5 oz/in 2 of copper and approximately 3 oz/in 2 of copper; (b) covering a first and second end section of said plated conductive pad with an epoxy based nonconductive material; and (c) soldering the conductive contact to said plated conductive pad so that said nonconductive material is positioned between a section of the conductive contact and said section of said plated conductive pad.
Claim 19
Independent Claim
114 words
A method for mounting components having a conductive contact to a circuit board having a copper conductive pad, said method comprising: (a) increasing the height of the copper conductive pad by plating the copper conductive pad with a layer of copper to form a plated conductive pad having between approximately 0.5 oz/in 2 of copper and approximately 3 oz/in 2 of copper; (b) covering a first and second end section of said plated conductive pad with an epoxy based nonconductive material; and (c) soldering the conductive contact to said plated conductive pad so that said nonconductive material is positioned between a section of the conductive contact and said section of said plated conductive pad.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-11-17 | 1996-05-18 | 1996-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-11-17 | 2000-05-18 | 2000-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-11-17 | 2004-05-18 | 2004-11-17 | $7700.00 | Window Closed / Lapsed |