US5012969A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of connecting electrodes
Assignee: Panasonic Holdings Corp
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Filing: 1990-05-17
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Granted: 1991-05-07
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Expires: 2010-05-17
Abstract
Abstract A face-down connecting an electrode formed on a semiconductor device surface and an electrode on a circuit substrate using an insulating resin, is arranged such that after positioning the electrode of the circuit substrate and the electrode of the semiconductor device, they are pressed from the side of semiconductor device or circuit substrate, and, in this state, a light-stiffening insulating resin is applied to the side surface of the semiconductor device, and then the light-stiffening insulating resin is stiffened. Since the light-stiffening insulating resin is applied and injected between the semiconductor device and circuit substrate with the electrodes of the semiconductor device and circuit substrate pressed together, the light-stiffening insulating resin intervenes between the two electrodes, and the problems of failure of the electrical contact between the two electrodes or a high electrical connection resistance will be avoided. Besides, since the electrodes of the semiconductor device and circuit substrate are positioned before injecting the resin, it is possible to identify the electrodes more easily than when positioning after applying the resin, so that positioning of a higher precision may be effected in a shorter time as compared with prior art methods.
Inventors
- 👤 Kenzo Hatada
- 👤 Hiroaki Fujimoto
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 22:12
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10P; H10P72/00; H10P72/04; H10P72/0446; H10P72/0448; H10W72/00; H10W72/30; H10W74/012; H10W74/10; H10W74/15; H10W74/40; H10W74/47; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/073; H10W72/07331; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
173 words
A method of connecting electrodes comprising: a first step of positioning an electrode formed on a first substrate and an electrode formed on a second substrate, at least one of the first and second substrates including an electrical component; a step of pressing both of the electrodes together; a step of testing the electrical component to determine if it has predetermined characteristics and if so: a step of then injecting an insulating resin from the side of the first substrate so as to fill an area surrounding an interface between the two electrodes; a step of stiffening the insulating resin while continuing to press both of the electrodes together; and a step of relieving of pressure after the resin is stiffened, whereby the electrodes are electrically connected together and the first and second substrates are affixed together; and replacing the substrate including an electrical component if the step of testing the electrical component determines that the electrical component does not have the predetermined characteristics and then repeating the method from the first step.
Claim 2
Independent Claim
173 words
A method of connecting electrodes comprising: a first step of positioning an electrode formed on a first substrate and an electrode formed on a second substrate, at least one of the first and second substrates including an electrical component; a step of pressing both of the electrodes together; a step of testing the electrical component to determine if it has predetermined characteristics and if so: a step of then injecting an insulating resin from the side of the first substrate so as to fill an area surrounding an interface between the two electrodes; a step of stiffening the insulating resin while continuing to press both of the electrodes together; and a step of relieving of pressure after the resin is stiffened, whereby the electrodes are electrically connected together and the first and second substrates are affixed together; and replacing the substrate including an electrical component if the step of testing the electrical component determines that the electrical component does not have the predetermined characteristics and then repeating the method from the first step.
Claim 3
Dependent Claim
25 words
A method of connecting electrodes according to claim 1 wherein the first substrate is a semiconductor chip and the second substrate is a wiring board.
Claim 4
Dependent Claim
25 words
A method of connecting electrodes according to claim 1 wherein a metal bump is formed on the electrode of the first substrate or second substrate.
Claim 5
Dependent Claim
22 words
A method of connecting electrodes according to claim 1 wherein the insulating resin is stiffened by the application of light or heat.
Claim 6
Independent Claim
188 words
A method of connecting electrodes comprising: a first step of positioning a bump electrode of a semiconductor chip and an electrode of a wiring board; a first step of pressing the bump electrode of the semiconductor chip and the electrode of the wiring board together so as to form an interface therebetween; a step of testing the semiconductor chip to determine if it has predetermined electrical characteristics and if so: a step of then injecting an insulating resin from the side of the semiconductor chip so as to fill the area surrounding the interface between the bump electrode and the electrode of the wiring board at least with the insulating resin; a step of stiffening the insulating resin while continuing to press both the electrodes together; and a step of relieving of pressure after the resin is stiffened, whereby the electrodes are electrically connected together and the semiconductor chip is affixed to the wiring board; and replacing the semiconductor chip if the step of testing the semiconductor chip determines that the semiconductor chip does not have the predetermined characteristics and then repeating the method from the first step.
Claim 7
Independent Claim
188 words
A method of connecting electrodes comprising: a first step of positioning a bump electrode of a semiconductor chip and an electrode of a wiring board; a first step of pressing the bump electrode of the semiconductor chip and the electrode of the wiring board together so as to form an interface therebetween; a step of testing the semiconductor chip to determine if it has predetermined electrical characteristics and if so: a step of then injecting an insulating resin from the side of the semiconductor chip so as to fill the area surrounding the interface between the bump electrode and the electrode of the wiring board at least with the insulating resin; a step of stiffening the insulating resin while continuing to press both the electrodes together; and a step of relieving of pressure after the resin is stiffened, whereby the electrodes are electrically connected together and the semiconductor chip is affixed to the wiring board; and replacing the semiconductor chip if the step of testing the semiconductor chip determines that the semiconductor chip does not have the predetermined characteristics and then repeating the method from the first step.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1994-05-06 | 1994-11-05 | 1995-05-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1998-05-06 | 1998-11-05 | 1999-05-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2002-05-06 | 2002-11-05 | 2003-05-07 | $7700.00 | Window Closed / Lapsed |