Method of making an electrical interconnection having angular lead design

Claim 1

A method of downsetting an integrated circuit chip/electrical interconnection combination so as to reduce the stress applied to the electrical interconnection during downsetting comprising the steps of: providing an integrated circuit chip; providing an electrical interconnection comprising a plurality of individual tape leads for electrically connecting a plurality of bonding sites onto a rectangular shaped integrated circuit chip to a plurality of external electrical connections wherein each of said individual leads is constructed and arranged in non-perpendicular position with respect to an associated side of the rectangular shaped integrated circuit and so that each of said individual leads have the same degree of non-perpendicularity, and so that all of said leads are angled clockwise, or all of the leads are angled counterclockwise, around the integrated circuit; wherein said lead comprises a first straight portion directly intersecting a second straight portion at an angle to form said angled lead; and downsetting said integrated circuit chip so that said angled leads provide an unidirectional twist and said integrated circuit rotates with equal deflection applied to each of the individual leads and so that said angled leads retain adequate length and flexibility to provide significant strain relief under applied stress.

Claim 2

A method of downsetting an integrated circuit chip/electrical interconnection combination so as to reduce the stress applied to the electrical interconnection during downsetting comprising the steps of: providing an integrated circuit chip; providing an electrical interconnection comprising a plurality of individual tape leads for electrically connecting a plurality of bonding sites onto a rectangular shaped integrated circuit chip to a plurality of external electrical connections wherein each of said individual leads is constructed and arranged in non-perpendicular position with respect to an associated side of the rectangular shaped integrated circuit and so that each of said individual leads have the same degree of non-perpendicularity, and so that all of said leads are angled clockwise, or all of the leads are angled counterclockwise, around the integrated circuit; wherein said lead comprises a first straight portion directly intersecting a second straight portion at an angle to form said angled lead; and downsetting said integrated circuit chip so that said angled leads provide an unidirectional twist and said integrated circuit rotates with equal deflection applied to each of the individual leads and so that said angled leads retain adequate length and flexibility to provide significant strain relief under applied stress.

Claim 3

A method of using a plurality of electrically conductive tape leads, each of said leads having a bonding end and essentially an identical oblique angle adjacent their bonding ends and essentially identical distances between and apex of their oblique angle and their bonding ends, and wherein said lead comprises a first straight portion directly intersecting a second straight portion at an angle to form said angled lead, comprising the steps of: bonding each of said leads adjacent said bonding end directly to an associated side of a rectangular shaped integrated circuit chip so that all of said leads are angled clockwise, or the leads are all angled counterclockwise, around said integrated circuit chip and so that the stress applied to said leads upon downsetting or operating of the integrated circuit is balanced between each lead around said chip.

Claim 4

A method of using a plurality of electrically conductive tape leads, each of said leads having a bonding end and essentially an identical oblique angle adjacent their bonding ends and essentially identical distances between and apex of their oblique angle and their bonding ends, and wherein said lead comprises a first straight portion directly intersecting a second straight portion at an angle to form said angled lead, comprising the steps of: bonding each of said leads adjacent said bonding end directly to an associated side of a rectangular shaped integrated circuit chip so that all of said leads are angled clockwise, or the leads are all angled counterclockwise, around said integrated circuit chip and so that the stress applied to said leads upon downsetting or operating of the integrated circuit is balanced between each lead around said chip.