Integrated circuit device

Abstract

Abstract PURPOSE:To easily and accurately realize wire bonding by obliquely arranging the IC for the main wiring direction of the parallel wirings. CONSTITUTION:An IC chip 4 is obliquely arranged with a constant inclination angle to the main wiring direction of the output wiring 12 as the many parallel wirings. Along this oblique line, each bonding pad 21 of chip 4 is provided and simultaneously the end portion of each output wiring 12 is bent at a certain angle and expanded correspondent to 1:1 to each pad 21 and thereby a pad 22 is formed opposing to each pad 21 at almost right angle. Since the chip 4 is arranged with a constant inclination angle beta, the end portion of output wiring 12 can be formed as the pad 22 expanded more than the wiring width. Thereby, wire bonding can be realized easily with high accuracy.

Inventors

• 👤 Akinari Kaneko
• 👤 金子　明成

Bibliographic Details