Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same

Claim 1

An electronic circuit cooling module for cooling an array of integrated circuit chips mounted on a substrate, comprising: a first section having a plurality of channels formed therein, the channels being disposed so as to create a multichannel flow path essentially parallel to the substrate when said module is assembled; a first flow distributor connected to the first section and disposed at a first end of the channels, the first flow distributor comprising inlet means for supplying a coolant to a first plurality of the channels; and, a second flow distributor connected to the first section and disposed at a second end of the channels, the second flow distributor comprising redistribution means for receiving the coolant from the first plurality of the channels and for redistributing the coolant to a second plurality of the channels, wherein the coolant provided to the second plurality of the channels will flow in a direction opposite that of the coolant provided to the first plurality of the channels, wherein the first section has a plurality of blind holes formed therein, the holes being disposed between the channels, and further comprising a plurality of pistons disposed at least partially in the holes; and, wherein each of said pistons comprises: a first cylindrical section; a second tapered section disposed at a first end of the first section; and a third tapered section disposed at a second end of the first section; and a chip contacting crown disposed on a free end of said third tapered section opposite said first cylindrical section, said crown having a radius of curvature approximating that of a surface of an integrated circuit chip with which the chip contacting crown is to make contact.