Patent US5156732A successfully refreshed from Google Patents.
US5156732A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Polyimide substrate and method of manufacturing a printed wiring board using the substrate
Assignee: Sumitomo Metal Mining Co Ltd
•
Filing: 1992-03-31
•
Granted: 1992-10-20
•
Expires: 2012-03-31
Abstract
Abstract Disclosed is a method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of 120° C. or higher thereby to modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer. Also disclosed is a method of preparing a printed wiring board having the copper-polyimide substrate, comprising a first step of etching the surface of a polyimide resin substrate, a second step of applying a catalyst to the substrate followed by electroless plating thereof to give a copper-polyimide substrate, and a third step of forming a circuit on the thus prepared copper-polyimide substrate; which is characterized in that a hydrophilic denatured layer is formed on the surface of the polyimide resin by the etching of the first-step treatment, and the substrate is heat-treated at a temperature of 120° C. or higher after the copper-plating treatment of the second step or before the circuit-forming treatment of the third step to be effected by plating a conductive metal on the surface of the substrate by the use of a free cyan or cyan compound, whereby the hydrophilic denatured layer is modified into a heat-resistant copper-diffusion preventing layer. The metal plating layer has an excellent adhesion strength capable of withstanding thermal shocks. The substrate can be used for producing electronic parts having high reliability with stable operationability.
Inventors
- 👤 Shuichi Ogasawara
- 👤 Hideki Kato
- 👤 Daizo Tomioka
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 09:22
CPC Classifications
C; C08; C08J; C08J7/00; C08J7/12; C08J7/14; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/22; C23C18/31; C23C18/38; C23C18/40; H; H05; H05K; H05K3/00; H05K3/38; H05K3/381; C08J2379/00; C08J2379/04; C08J2379/08; H05K1/00; H05K1/02; H05K1/03; H05K1/0393; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2203/00; H05K2203/07; H05K2203/0779; H05K2203/0783; H05K2203/11; H05K2203/1105
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
87 words
A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of at least 120° C. in a vacuum atmosphere to thereby modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer.
Claim 2
Independent Claim
87 words
A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of at least 120° C. in a vacuum atmosphere to thereby modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer.
Claim 3
Dependent Claim
23 words
The method of preparing a copper-polyimide substrate as claimed in claim 1, in which the electroless copper-plating is followed by an electrolytic copper-plating.
Claim 4
Dependent Claim
39 words
The method of preparing a copper-polyimide substrate as claimed in claim 1, in which the etching treatment to be applied to the surface of a polyimide resin for forming a hydrophilic denatured layer thereon is effected with sulfuric acid.
Claim 5
Dependent Claim
31 words
The method of preparing a copper-polyimide substrate as claimed in claim 3, in which the etching treatment is effected with sulfuric acid having a concentration of 30% by weight or more.
Claim 6
Dependent Claim
62 words
The method of preparing a copper-polyimide substrate as claimed in claim 1, in which the etching treatment to be applied to the surface of a polyimide resin for forming a hydrophilic denatured layer thereon is effected by a two-stage process comprising a first-step etching to be effected with a diamine and a second-step etching to be effected with a uaternary ammonium hydroxide.
Claim 7
Dependent Claim
60 words
The method of preparing a copper-polyimide substrate as claimed in claim 5, in which the diamine to be employed in the first-step etching applied to the surface of a polyimide resin is a compound of a general formula H 2 N(CH 2 ) n NH 2 (where n represents an integer of form 2 to 6) or a hydrate thereof.
Claim 8
Dependent Claim
120 words
The method of preparing a copper-polyimide substrate as claimed in claim 5, in which the quaternary ammonium hydroxide to be employed in the second-step etching applied to the surface of a polyimide resin is a compound of a general formula: ##STR4## where R 1 and R 2 independently represent an alkyl group having from 1 to 4 carbon atoms; R 3 represents an alkyl group having from 1 to 18 carbon atoms; R 4 is selected from the group consisting of an alkyl group having from 1 to 18 carbon atoms, an alkenyl group having from 1 to 18 carbon atoms, a benzyl group, and an alkylbenzyl group in which the alkyl moiety has from 1 to 18 carbon atoms.
Claim 9
Dependent Claim
39 words
The method of preparing a copper-polyimide substrate as claimed in claim 1, in which the heat-treatment of the substrate is effected within a period of time of initiating decomposition of the chemical structure of the polyimide resin as heat-treated.
Claim 10
Independent Claim
140 words
A method of preparing a printed wiring board having a copper-polyimide substrate, comprising a first step of etching the surface of a polyimide resin substrate, a second step of applying a catalyst to the substrate followed by electroless plating thereof to give a copper-polyimide substrate, and a third step of forming a circuit on the thus prepared copper-polyimide substrate; wherein a hydrophilic denatured layer is formed on the surface of the polyimide resin by the etching step, and including heat treating the substrate at a temperature of at least 120° C. in a vacuum atmosphere before the third step is effected by plating of a conductive metal on the surface of the substrate by the use of at least one of free cyan and a cyan compound, whereby the hydrophilic denatured layer is modified into a heat-resistant copper-diffusion preventing layer.
Claim 11
Independent Claim
140 words
A method of preparing a printed wiring board having a copper-polyimide substrate, comprising a first step of etching the surface of a polyimide resin substrate, a second step of applying a catalyst to the substrate followed by electroless plating thereof to give a copper-polyimide substrate, and a third step of forming a circuit on the thus prepared copper-polyimide substrate; wherein a hydrophilic denatured layer is formed on the surface of the polyimide resin by the etching step, and including heat treating the substrate at a temperature of at least 120° C. in a vacuum atmosphere before the third step is effected by plating of a conductive metal on the surface of the substrate by the use of at least one of free cyan and a cyan compound, whereby the hydrophilic denatured layer is modified into a heat-resistant copper-diffusion preventing layer.
Claim 12
Dependent Claim
32 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 9, in which the electroless copper-plating is followed by an electrolytic copper-plating in the second step.
Claim 13
Dependent Claim
44 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 9, in which the etching treatment to be applied to the surface of a polyimide resin for forming a hydrophilic denatured layer thereon is effected with sulfuric acid.
Claim 14
Dependent Claim
36 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 11, in which the etching treatment is effected with sulfuric acid having a concentration of 30% by weight or more.
Claim 15
Dependent Claim
67 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 9, in which the etching treatment to be applied to the surface of a polyimide resin for forming a hydrophilic denatured layer thereon is effected by a two-stage process comprising a first-step etching to be effected with a diamine and a second-step etching to be effected with a quaternary ammonium hydroxide.
Claim 16
Dependent Claim
65 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 13, in which the diamine to be employed in the first-step etching applied to the surface of a polyimide resin is a compound of a general formula H 2 N(CH 2 ) n NH 2 (where n represents an integer of from 2 to 6) or a hydrate thereof.
Claim 17
Dependent Claim
125 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 13, in which the quaternary ammonium hydroxide to be employed in the second-step etching applied to the surface of a polyimide resin is a compound of a general formula: ##STR5## where R 1 and R 2 independently represent an alkyl group having from 1 to 4 carbon atoms; R 3 represents an alkyl group having from 1 to 18 carbon atoms; R 4 is selected from the group consisting of an alkyl group having from 1 to 18 carbon atoms, an alkenyl group having from 1 to 18 carbon atoms, a benzyl group, and an alkylbenzyl group in which the alkyl moiety has from 1 to 18 carbon atoms.
Claim 18
Dependent Claim
44 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 9, in which the heat-treatment of the substrate is effected within a period of time of initiating decomposition of the chemical structure of the polyimide resin as heat-treated.
Claim 19
Dependent Claim
30 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 9, in which the printed wiring board is a tape automated bonding (TAB) tape.
Claim 20
Dependent Claim
29 words
The method of preparing a printed wiring board having a copper-polyimide substrate as claimed in claim 9, in which the printed wiring board is a flexible printed circuit (FPC).
Claim 21
Independent Claim
91 words
A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of at least 250° C. in air or in an inert gas atmosphere to thereby modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer.
Claim 22
Independent Claim
91 words
A method of preparing a copper-polyimide substrate comprising applying an electroless copper plating to the surface of a polyimide resin, wherein the surface of a polyimide resin is first etched so as to form a hydrophilic denatured layer on the surface of the said polyimide resin and, after a catalyst is imparted to the substrate, the substrate is copper-plated and thereafter heat-treated at a temperature of at least 250° C. in air or in an inert gas atmosphere to thereby modify the hydrophilic denatured layer to a heat-resistant copper-diffusion preventing layer.
Claim 23
Independent Claim
142 words
A method of preparting a printed wiring board having a copper-polyimide substrate, comprising a first step of etching the surface of a polyimide resin substrate, a second of applying a catalyst to the substrate followed by electroless plating thereof to give a copper-polyimide substrate, and a third step of forming a circuit on the thus prepared copper-polyimide substrate; wherein a hydrophilic denatured layer is formed on the surface of the polyimide resin by the etching step, and including heat treating the substrate at a temperature of at least 250° C. in air or an inert gas atmosphere before the third step is effected by plating of a conductive metal on the surface of the substrate by the use of at least one of free cyan and a cyan compound, whereby the hydrophilic denatured layer is modified into a heat-resistant copper-diffusion preventing layer.
Claim 24
Independent Claim
142 words
A method of preparting a printed wiring board having a copper-polyimide substrate, comprising a first step of etching the surface of a polyimide resin substrate, a second of applying a catalyst to the substrate followed by electroless plating thereof to give a copper-polyimide substrate, and a third step of forming a circuit on the thus prepared copper-polyimide substrate; wherein a hydrophilic denatured layer is formed on the surface of the polyimide resin by the etching step, and including heat treating the substrate at a temperature of at least 250° C. in air or an inert gas atmosphere before the third step is effected by plating of a conductive metal on the surface of the substrate by the use of at least one of free cyan and a cyan compound, whereby the hydrophilic denatured layer is modified into a heat-resistant copper-diffusion preventing layer.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-20 | 1996-04-20 | 1996-10-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-20 | 2000-04-20 | 2000-10-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-20 | 2004-04-20 | 2004-10-20 | $7700.00 | Window Closed / Lapsed |