Treatment of a polyimide surface to improve the adhesion of metal deposited thereon

Claim 3

The method of claim 1 wherein the adhesion-promoting compound is characterized by a structure selected from the group consisting of ##STR4## and salts or hydrates threof; wherein R is selected from the group consisting of hydrogen; alkyl groups containing about 1 to about 10 carbon atoms; aromatic groups containing about 1 to about 20 carbon atoms; sulfonic groups; acyl groups; and amide groups; wherein Y and Z are individually selected from the group consisting of hydrogen; alkyl groups having about 1 to about 20 carbon atoms; aromatic groups containing about 1 to about 20 carbon atoms; acyl groups; and amide groups; or Y and Z together form at least one heterocyclic carbon-containing ring with said nitrogen; or Z and R together form at least one heterocyclic carbon-containing ring with said moiety; and wherein Y 1 is selected from the group consisting of alkylidene groups having about 1 to about 20 carbon atoms and cycloalkylidene groups containing about 1 to about 20 carbon atoms.

Claim 4

The method of claim 2 wherein the metal is copper.

Claim 5

The method of claim 2 wherein the adhesion promoting compound is selected from the group consisting of O,N-dimethylhydroxylamine hydrochloride, acetone oxime, 2-pyridine aldoxime, N-hydroxyphthalimide, and 1-hydroxybenzotriazole.H 2 O.

Claim 6

The method of claim 2 wherein the adhesion-promoting compound is selected from the group consisting of hydroxylamine and salts of hydroxylamine.

Claim 7

The method of claim 2 wherein the polyimide contains a filler.

Claim 8

The method of claim 6 wherein the filler is selected from the group consisting of silica, glass, and mica.

Claim 9

The method of claim 1 in which the adhesion-promoting compound is incorporated into a non-aggressive liquid which does not discolor, weaken, or cause other deleterious effects to the bulk of the polyimide substrate, the concentration of said compound being in the range of from 0.5 M to about 4.OM.

Claim 10

The method of claim 8 wherein the polyimide surface is immersed in the non-aggressive liquid for about 10 minutes to about 60 minutes.

Claim 11

The method of claim 9 wherein the liquid is selected from the group consisting of water; mixtures of methanol and pyridine; mixtures of methanol and methylene chloride; and mixtures of methanol and dimethylformamide.

Claim 12

The method according to claim 10 wherein the liquid comprises from about 5 to about 95 volume percent pyridine, methylene chloride or dimethylformamide, the balance being methanol.

Claim 13

The method of claim 11 wherein the liquid comprises from about 5 to about 50 volume percent dimethylformamide, the balance being methanol.

Claim 14

The method of claim 1 wherein the polyimide surface is pretreated prior to treatment with the adhesion promoting compound, said pretreatment comprising the steps of (a) treating the surface with an etching compound for the polyimide; (b) treating the surface with a basic solution; and (c) treating the surface with a solution comprising an alcohol and an etching compound for the polyimide.

Claim 15

The method of claim 13 wherein the polyimide contains a filler.

Claim 16

The method of claim 13 wherein the etching compound of step (a) is selected from the group consisting of sulfuric acid and dimethylformamide.

Claim 17

The method of claim 15 wherein the basic solution of step (b) comprises a compound selected from the group consisting of sodium hydroxide, potassium hydroxide, tetramethylammonium hydroxide, and mixtures thereof, each of which may be dissolved in a solvent selected from the group consisting of water, methanol, ethanol, and mixtures thereof.

Claim 18

The method of claim 13 wherein the metal is copper.

Claim 19

In a method for the plating of metal on the surface of a polyimide substrate, the improvement which comprises treatment of the surface with an adhesion-promoting compound containing therein an >NO-- moiety prior to application of the metal layer by electroless deposition, said deposition followed by electroplating of more of the metal on the electroless-plated surface.

Claim 20

In a method for the plating of metal on the surface of a polyimide substrate, the improvement which comprises treatment of the surface with an adhesion-promoting compound containing therein an >NO-- moiety prior to application of the metal layer by electroless deposition, said deposition followed by electroplating of more of the metal on the electroless-plated surface.

Claim 21

The method of claim 18 in which the adhesion-promoting compound is incorporated into a non-aggressive liquid which does not discolor, weaken, or cause other deleterious effects to the bulk of the polyimide substrate.

Claim 22

The method of claim 19 wherein the liquid is selected from the group consisting of water; mixtures of methanol and pyridine; mixtures of methanol and methylene chloride; and mixtures of methanol and dimethylformamide.

Claim 23

The method of claim 20 wherein the metal is copper.

Claim 24

The method of claim 18 wherein the polyimide surface having the electrolessly-deposited metal layer thereon is heat-treated at a temperature of from about 60° C. to about 170° C. for about 5 minutes to about 120 minutes, prior to the electroplating of more of the metal.

Claim 25

The method of claim 22 wherein the polyimide surface is heat-treated after the electroplating of more of the metal, at a temperature of from about 80° C. to about 120° C. for about 12 hours to about 20 hours.

Claim 26

The method of claim 18 wherein the polyimide surface is heat-treated after the electroplating of more of the metal, at a temperature of from about 80° C. to about 120° C. for about 12 hours to about 20 hours.