Patent US5848074A successfully refreshed from Google Patents.
Patent US5155370A successfully refreshed from Google Patents.
US5155370A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Device for detecting the relative position of first and second objects
Assignee: Canon Inc
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Filing: 1992-01-16
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Granted: 1992-10-13
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Expires: 2012-01-16
Abstract
Abstract A device, usable in proximity exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, is disclosed. The device includes a light source for projecting light to the first and second objects; a light detecting system for detecting light from one of the first and second objects illuminated by the light source; and a position detecting system for detecting the relative position of the first and second objects, on the basis of the detection by the light detecting system; wherein the light from the light source has a spectrum whose full width of half maximum is between λ 2 /200000 nm and 60 nm, where λ is the wavelength of the light.
Inventors
- 👤 Hiroshi Osawa
- 👤 Masakazu Matsugu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 16:09
CPC Classifications
G; G03; G03F; G03F9/00; G03F9/70
Claims Analysis
Total Claims: 49
Claim 1
Independent Claim
148 words
A device, usable in proximity lithography exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, said device comprising: light source means for projecting light to illuminate the first and second objects; light detecting means for detecting light from one of the first and second objects illuminated by said light source means; and position detecting means for detecting the relative position of the first and second objects, on the basis of the detection by said light detecting means; wherein the light from said light source means with which the first and second objects are illuminated has a spectrum whose full width of half maximum is between λ 2 /200000 nm and 60 nm, where λ is the wavelength of the light.
Claim 2
Independent Claim
148 words
A device, usable in proximity lithography exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, said device comprising: light source means for projecting light to illuminate the first and second objects; light detecting means for detecting light from one of the first and second objects illuminated by said light source means; and position detecting means for detecting the relative position of the first and second objects, on the basis of the detection by said light detecting means; wherein the light from said light source means with which the first and second objects are illuminated has a spectrum whose full width of half maximum is between λ 2 /200000 nm and 60 nm, where λ is the wavelength of the light.
Claim 3
Dependent Claim
57 words
A device according to claim 1, wherein said light source means comprises a laser and wherein said device further comprises light source drive control means for controlling a drive current applied to said laser to control the half width of the spectrum of the projected light to a range between λ 2 /200000 nm and 60 nm.
Claim 4
Dependent Claim
16 words
A device according to claim 1, wherein said light source means comprises a super luminescent diode.
Claim 5
Independent Claim
134 words
A device, usable in proximity lithography exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, said device comprising: light source means comprising a super luminescent diode for projecting light to illuminate the first and second objects; light detecting means for detecting light from one of the first and second objects illuminated by said light source means; and position detecting means for detecting the relative position of the first and second objects, on the basis of the detection by said light detecting means; wherein said super luminescent diode produces light of such a wavelength effective to reduce coherency of the light detected by said light detecting means.
Claim 6
Independent Claim
134 words
A device, usable in proximity lithography exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, said device comprising: light source means comprising a super luminescent diode for projecting light to illuminate the first and second objects; light detecting means for detecting light from one of the first and second objects illuminated by said light source means; and position detecting means for detecting the relative position of the first and second objects, on the basis of the detection by said light detecting means; wherein said super luminescent diode produces light of such a wavelength effective to reduce coherency of the light detected by said light detecting means.
Claim 7
Independent Claim
145 words
A device, usable in proximity lithography exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, said device comprising: light source means for projecting light to illuminate the first and second objects; light detecting means for detecting light from one of the first and second objects, illuminated by said light source means; and position detecting means for detecting the relative position of the first and second objects, on the basis of the detection by said light detecting means; wherein the light source means comprises a single mode laser and drive control means for controlling a drive current applied to said laser for maintaining the drive current no greater than a threshold for initiation of single mode laser emission.
Claim 8
Independent Claim
145 words
A device, usable in proximity lithography exposure wherein a first object having a pattern and a second object to which the pattern is to be transferred are disposed close to each other, for detecting the relative position of the first and second objects, said device comprising: light source means for projecting light to illuminate the first and second objects; light detecting means for detecting light from one of the first and second objects, illuminated by said light source means; and position detecting means for detecting the relative position of the first and second objects, on the basis of the detection by said light detecting means; wherein the light source means comprises a single mode laser and drive control means for controlling a drive current applied to said laser for maintaining the drive current no greater than a threshold for initiation of single mode laser emission.
Claim 9
Independent Claim
56 words
A method of optically detecting a position of a substrate having a mark formed thereof, said method comprising the steps of: directing a radiation beam from a super-luminescent diode to the substrate; and detecting a light image formed by the radiation beam from the substrate and corresponding to the position of the mark of the substrate.
Claim 10
Independent Claim
56 words
A method of optically detecting a position of a substrate having a mark formed thereof, said method comprising the steps of: directing a radiation beam from a super-luminescent diode to the substrate; and detecting a light image formed by the radiation beam from the substrate and corresponding to the position of the mark of the substrate.
Claim 11
Dependent Claim
13 words
A method according to claim 6, wherein the mark comprises a zone plate.
Claim 12
Independent Claim
53 words
A method of optically detecting a position of a substrate having a mark formed thereon, said method comprising the steps of: directing a multi-mode laser beam to the substrate; and detecting a light image formed by the laser beam from the substrate and corresponding to the position of the mark of the substrate.
Claim 13
Independent Claim
53 words
A method of optically detecting a position of a substrate having a mark formed thereon, said method comprising the steps of: directing a multi-mode laser beam to the substrate; and detecting a light image formed by the laser beam from the substrate and corresponding to the position of the mark of the substrate.
Claim 14
Dependent Claim
13 words
A method according to claim 8, wherein the mark comprises a zone plate.
Claim 15
Dependent Claim
25 words
A method according to claim 8, wherein said directing step comprises driving a single-mode semiconductor laser with a predetermined drive current to cause multi-mode oscillation.
Claim 16
Dependent Claim
119 words
In a method usable with a first substrate having a first mark and a second substrate having a second mark and being spaced from the first substrate by a predetermined gap, for detecting a positional relationship between the first and second substrates by using the first and second marks, the improvement comprising the steps of: irradiating the first and second substrates with light having a spectral half width in a range of λ 2 /200,000 nm to 60 nm, where λ is a center wavelength of the light; and detecting first and second light images corresponding to the positions of the first and second marks being formed by light beams reflected from the irradiated first and second substrate, respectively.
Claim 17
Dependent Claim
119 words
In a method usable with a first substrate having a first mark and a second substrate having a second mark and being spaced from the first substrate by a predetermined gap, for detecting a positional relationship between the first and second substrates by using the first and second marks, the improvement comprising the steps of: irradiating the first and second substrates with light having a spectral half width in a range of λ 2 /200,000 nm to 60 nm, where λ is a center wavelength of the light; and detecting first and second light images corresponding to the positions of the first and second marks being formed by light beams reflected from the irradiated first and second substrate, respectively.
Claim 18
Dependent Claim
17 words
A method according to claim 11, wherein the first and second marks each comprise a zone plate.
Claim 19
Dependent Claim
16 words
A method according to claim 12, further comprising supplying the irradiating light from a super-luminescent diode.
Claim 20
Dependent Claim
17 words
A method according to claim 12, further comprising supplying the irradiating light from a multi-mode oscillation laser.
Claim 21
Dependent Claim
124 words
In a method usable with a first substrate having a first zone plate and a second substrate having a second zone plate and being spaced from the first substrate by a predetermined gap, for detecting a positional deviation between the first and second substrates by using the first and second zone plates, the improvement comprising the steps of: irradiating the second substrates through the first substrate, with light having a spectral half width in a range of λ 2 /200,000 nm to 60 nm, where λ is a center wavelength of the light; and detecting a light image corresponding to the positional deviation between the first and second substrates being formed by light reflectively and transmissively modulated by the second and first substrates, respectively.
Claim 22
Dependent Claim
124 words
In a method usable with a first substrate having a first zone plate and a second substrate having a second zone plate and being spaced from the first substrate by a predetermined gap, for detecting a positional deviation between the first and second substrates by using the first and second zone plates, the improvement comprising the steps of: irradiating the second substrates through the first substrate, with light having a spectral half width in a range of λ 2 /200,000 nm to 60 nm, where λ is a center wavelength of the light; and detecting a light image corresponding to the positional deviation between the first and second substrates being formed by light reflectively and transmissively modulated by the second and first substrates, respectively.
Claim 23
Dependent Claim
16 words
A method according to claim 15, further comprising supplying the irradiating light from a super-luminescent diode.
Claim 24
Dependent Claim
17 words
A method according to claim 15, further comprising supplying the irradiating light from a multi-mode oscillation laser.
Claim 25
Dependent Claim
83 words
In a semiconductor device manufacturing method wherein the position of a wafer having an alignment mark is detected optically and, after adjustment of the position of the wafer, a circuit pattern is printed on the wafer, the improvement comprising the steps of: illuminating the alignment mark with light from a super-luminescent diode to form a light image of the alignment mark with light reflected by the alignment mark; and detecting the position of the wafer on the basis of the formed light image.
Claim 26
Dependent Claim
83 words
In a semiconductor device manufacturing method wherein the position of a wafer having an alignment mark is detected optically and, after adjustment of the position of the wafer, a circuit pattern is printed on the wafer, the improvement comprising the steps of: illuminating the alignment mark with light from a super-luminescent diode to form a light image of the alignment mark with light reflected by the alignment mark; and detecting the position of the wafer on the basis of the formed light image.
Claim 27
Dependent Claim
15 words
A method according to claim 18, wherein the alignment mark has a zone plate pattern.
Claim 28
Dependent Claim
82 words
In a semiconductor device manufacturing method wherein the position of a wafer having an alignment mark is detected optically and, after adjustment of the position of the wafer, a circuit pattern is printed on the wafer, the improvement comprising the steps of: illuminating the alignment mark with a multi-mode laser beam to form a light image of the alignment mark with light reflected by the alignment mark; and detecting the position of the wafer on the basis of the formed light image.
Claim 29
Dependent Claim
82 words
In a semiconductor device manufacturing method wherein the position of a wafer having an alignment mark is detected optically and, after adjustment of the position of the wafer, a circuit pattern is printed on the wafer, the improvement comprising the steps of: illuminating the alignment mark with a multi-mode laser beam to form a light image of the alignment mark with light reflected by the alignment mark; and detecting the position of the wafer on the basis of the formed light image.
Claim 30
Dependent Claim
15 words
A method according to claim 20, wherein the alignment mark has a zone plate pattern.
Claim 31
Dependent Claim
28 words
A method according to claim 20, further comprising generating the laser beam by driving a single-mode semiconductor laser with a predetermined drive current to cause multi-mode laser oscillation.
Claim 32
Dependent Claim
146 words
In a semiconductor device manufacturing method usable with a mask having an alignment pattern and a circuit pattern and a wafer having an alignment mark and disposed close to the mask, wherein a positional deviation of the wafer with respect to the mask is detected and, after adjustment of the position of the wafer, the circuit pattern of the mask is printed on the wafer, the improvement comprising the steps of: irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form first and second light images with light from the alignment pattern and the alignment mark; and detecting the positional deviation of the wafer on the basis of the formed first and second light images.
Claim 33
Dependent Claim
146 words
In a semiconductor device manufacturing method usable with a mask having an alignment pattern and a circuit pattern and a wafer having an alignment mark and disposed close to the mask, wherein a positional deviation of the wafer with respect to the mask is detected and, after adjustment of the position of the wafer, the circuit pattern of the mask is printed on the wafer, the improvement comprising the steps of: irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form first and second light images with light from the alignment pattern and the alignment mark; and detecting the positional deviation of the wafer on the basis of the formed first and second light images.
Claim 34
Dependent Claim
21 words
A method according to claim 23, wherein each of the alignment pattern and the alignment mark has a zone plate pattern.
Claim 35
Dependent Claim
23 words
A method according to claim 23, wherein the light irradiating the alignment pattern and the alignment mark is supplied from a super-luminescent diode.
Claim 36
Dependent Claim
18 words
A method according to claim 23, wherein said irradiating step comprises supplying light from a multi-mode oscillating laser.
Claim 37
Dependent Claim
154 words
In a semiconductor device manufacturing method usable with a mask having an alignment pattern with an optical power and a circuit pattern and a wafer having an alignment mark with an optical power and disposed close to the mask, wherein a positional deviation of the wafer with respect to the mask is detected and, after adjustment of the position of the wafer, the circuit pattern of the mask is printed on the wafer, the improvement comprising the steps of: irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form a light image with light influenced by the optical powers of the alignment pattern and the alignment mark; and detecting the positional deviation of the wafer on the basis of the formed light image.
Claim 38
Dependent Claim
154 words
In a semiconductor device manufacturing method usable with a mask having an alignment pattern with an optical power and a circuit pattern and a wafer having an alignment mark with an optical power and disposed close to the mask, wherein a positional deviation of the wafer with respect to the mask is detected and, after adjustment of the position of the wafer, the circuit pattern of the mask is printed on the wafer, the improvement comprising the steps of: irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form a light image with light influenced by the optical powers of the alignment pattern and the alignment mark; and detecting the positional deviation of the wafer on the basis of the formed light image.
Claim 39
Dependent Claim
21 words
A method according to claim 27, wherein each of the alignment pattern and the alignment mark has a zone plate pattern.
Claim 40
Dependent Claim
17 words
A method according to claim 27, wherein said irradiating step comprises supplying light from a super-luminescent diode.
Claim 41
Dependent Claim
18 words
A method according to claim 27, wherein said irradiating step comprises supplying light from a multi-mode oscillating laser.
Claim 42
Dependent Claim
162 words
A proximity type exposure apparatus usable with a mask having a circuit pattern and an alignment pattern with an optical power and a wafer having an alignment mark with an optical power, for exposing the wafer to the circuit pattern of the mask with radiation, said apparatus comprising: irradiating means for irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form a light image with light influenced by the optical powers of the alignment pattern and the alignment mark; and detecting means having a detection surface, for detecting the light image on the detection surface to produce a signal corresponding to a positional deviation between the mask and the wafer; and aligning means responsive to the signal from said detecting means to align the mask and the wafer with each other.
Claim 43
Dependent Claim
162 words
A proximity type exposure apparatus usable with a mask having a circuit pattern and an alignment pattern with an optical power and a wafer having an alignment mark with an optical power, for exposing the wafer to the circuit pattern of the mask with radiation, said apparatus comprising: irradiating means for irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form a light image with light influenced by the optical powers of the alignment pattern and the alignment mark; and detecting means having a detection surface, for detecting the light image on the detection surface to produce a signal corresponding to a positional deviation between the mask and the wafer; and aligning means responsive to the signal from said detecting means to align the mask and the wafer with each other.
Claim 44
Dependent Claim
19 words
An apparatus according to claim 31, wherein said irradiating means comprises a super-luminescent diode for providing the irradiating light.
Claim 45
Dependent Claim
19 words
An apparatus according to claim 31, wherein said irradiating means comprises a multi-mode oscillating laser for providing the light.
Claim 46
Dependent Claim
156 words
A proximity type exposure apparatus usable with a mask having a circuit pattern and an alignment pattern and a wafer having an alignment mark, for exposing the wafer to the circuit pattern of the mask with radiation, said apparatus comprising: irradiating means for irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form first and second light images with light from the alignment pattern and the alignment mark; and detecting means having a detection surface, for detecting the first and second light images on the detection surface to produce a signal corresponding to a positional deviation between the mask and the wafer; and aligning means responsive to the signal from said detecting means to bring the mask and the wafer into alignment with each other.
Claim 47
Dependent Claim
156 words
A proximity type exposure apparatus usable with a mask having a circuit pattern and an alignment pattern and a wafer having an alignment mark, for exposing the wafer to the circuit pattern of the mask with radiation, said apparatus comprising: irradiating means for irradiating the alignment pattern of the mask and the alignment mark of the wafer with light having a center wavelength λ and a half width of a wavelength spectrum which is between λ 2 /200000 nm and 60 nm, to form first and second light images with light from the alignment pattern and the alignment mark; and detecting means having a detection surface, for detecting the first and second light images on the detection surface to produce a signal corresponding to a positional deviation between the mask and the wafer; and aligning means responsive to the signal from said detecting means to bring the mask and the wafer into alignment with each other.
Claim 48
Dependent Claim
19 words
An apparatus according to claim 34, wherein said irradiating means comprises a super-luminescent diode for providing the irradiating light.
Claim 49
Dependent Claim
20 words
An apparatus according to claim 34, wherein said irradiating means comprises a multi-mode oscillating laser for providing the irradiating light.
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