Patent US5153706A successfully refreshed from Google Patents.
US5153706A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frames for use in plastic mold type semiconductor devices
Assignee: Toshiba Corp
•
Filing: 1991-03-28
•
Granted: 1992-10-06
•
Expires: 2011-03-28
Abstract
Abstract In a lead frame for use in a plastic mold type semiconductor device having a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame and for supporting the die pad, a plurality of leads whose inner ends of the leads are disposed around the die pad and the leads have inner leads portions which are portions to be sealed in a mold, metal plated region applied only to cover the inner lead and opposite end portions of the the die pad respectively confronting the inner leads, but the tie bar is not plated.
Inventors
- 👤 Isao Baba
- 👤 Satoshi Takeuchi
- 👤 Kazunori Hayashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 10:28
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/456; H10W70/457; H10W70/411; H10W70/451; H10W74/00; H10W90/00; H10W90/811; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/90; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 2
Claim 1
Independent Claim
114 words
A lead frame for use in a plastic mold type semiconductor device comprising: a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame, and for supporting said die pad, a plurality of leads, inner ends of the leads being disposed around said die pad, said leads having inner leads, which are portions to be sealed in a mold, and a metal plated region applied on the lead frame, said metal plated region being applied only to cover said inner leads and opposite end portions of the said die pad respectively confronting the inner leads, and not to cover said tie bar.
Claim 2
Dependent Claim
114 words
A lead frame for use in a plastic mold type semiconductor device comprising: a frame, a die pad on which a semiconductor element is mounted, a tie bar for connecting the die pad to said frame, and for supporting said die pad, a plurality of leads, inner ends of the leads being disposed around said die pad, said leads having inner leads, which are portions to be sealed in a mold, and a metal plated region applied on the lead frame, said metal plated region being applied only to cover said inner leads and opposite end portions of the said die pad respectively confronting the inner leads, and not to cover said tie bar.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-06 | 1996-04-06 | 1996-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-06 | 2000-04-06 | 2000-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-06 | 2004-04-06 | 2004-10-06 | $7700.00 | Window Closed / Lapsed |