US5152857A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for preparing a substrate for semiconductor devices
Assignee: Shin-Etsu Handotai Co Ltd
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Filing: 1991-03-21
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Granted: 1992-10-06
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Expires: 2011-03-21
Abstract
Abstract In a method for preparing a substrate for semiconductor device, the substrate is prepared either by directly bonding a bonding wafer to a base wafer or by bonding the bonding wafer to the base wafer with an oxide film formed on at least the bonding surface of the bonding wafer or the bonding surface of the base wafer to make finished semiconductor devices with an SOI structure. Prior to the bonding operation, the bonding wafer and the base wafer are subjected to the steps of (1) making the diameter of the bonding wafer smaller than the diameter of the base wafer, (2) setting the beveling width of the back side (bonding side) of the bonding wafer at 50 microns or less, and (3) beveling the front side of said base wafer so that the bonding surface of the base wafer is equal in size to the bonding surface of the bonding wafer. When the bonding wafer, which has been bonded to the base wafer, is subjected to polishing into a thin film, the peripheral portions of the bonding wafer form a smooth surface of the base wafer. This prevents the peripheral portions from chipping off.
Inventors
- 👤 Tatsuo Ito
- 👤 Atsuo Uchiyama
- 👤 Masao Fukami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 21:02
CPC Classifications
H; H10; H10P; H10P52/00; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10W; H10W10/00; H10W10/10; H10W10/181; Y; Y10; Y10S; Y10S148/00; Y10S148/012; Y10S148/135; Y10T; Y10T156/00; Y10T156/10; Y10T156/1052; Y10T156/1062; Y10T156/1064
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
149 words
A method for preparing a substrate for semiconductor devices, comprising: providing a circular bonding wafer and a circular base wafer, with the diameter of the bonding wafer being smaller than the diameter of the base wafer; beveling the peripheral edge of a first side of said bonding wafer to have a beveled width of 50 micron or less, wherein the beveled width is the width of the bevel at the respective side of the wafer, the beveled edge of said bonding wafer surrounding a bonding surface on said first side thereof; beveling the peripheral edge of a first side of said base wafer to surround a bonding surface that is equal in size to the bonding surface of said bonding wafer prior to bonding said bonding wafer to said base wafer, and directly bonding said bonding surface of said bonding wafer to said bonding surface of said base wafer.
Claim 2
Independent Claim
149 words
A method for preparing a substrate for semiconductor devices, comprising: providing a circular bonding wafer and a circular base wafer, with the diameter of the bonding wafer being smaller than the diameter of the base wafer; beveling the peripheral edge of a first side of said bonding wafer to have a beveled width of 50 micron or less, wherein the beveled width is the width of the bevel at the respective side of the wafer, the beveled edge of said bonding wafer surrounding a bonding surface on said first side thereof; beveling the peripheral edge of a first side of said base wafer to surround a bonding surface that is equal in size to the bonding surface of said bonding wafer prior to bonding said bonding wafer to said base wafer, and directly bonding said bonding surface of said bonding wafer to said bonding surface of said base wafer.
Claim 3
Independent Claim
174 words
A method for preparing a substrate for semiconductor devices, comprising: providing a circular bonding wafer and a circular base wafer with the diameter of the bonding wafer being smaller than the diameter of the base wafer; beveling the peripheral edge of a first side of said bonding wafer to have a beveled width of 50 micron or less, wherein the beveled width is the width of the bevel at the respective side of the wafer, the beveled edge of said bonding wafer surrounding a bonding surface on said first said thereof; beveling the peripheral edge of a first said of said base wafer to have a bonding surface that is equal in size to the bonding surface of said bonding wafer prior to bonding said bonding wafer to said base wafer; forming an oxide layer on at least one of said bonding surfaces; and bonding said bonding surface of said bonding wafer to said bonding surface of said base wafer with said oxide layer therebetween to make a semiconductor device with an SOI structure.
Claim 4
Independent Claim
174 words
A method for preparing a substrate for semiconductor devices, comprising: providing a circular bonding wafer and a circular base wafer with the diameter of the bonding wafer being smaller than the diameter of the base wafer; beveling the peripheral edge of a first side of said bonding wafer to have a beveled width of 50 micron or less, wherein the beveled width is the width of the bevel at the respective side of the wafer, the beveled edge of said bonding wafer surrounding a bonding surface on said first said thereof; beveling the peripheral edge of a first said of said base wafer to have a bonding surface that is equal in size to the bonding surface of said bonding wafer prior to bonding said bonding wafer to said base wafer; forming an oxide layer on at least one of said bonding surfaces; and bonding said bonding surface of said bonding wafer to said bonding surface of said base wafer with said oxide layer therebetween to make a semiconductor device with an SOI structure.
Claim 5
Independent Claim
164 words
A method for preparing a substrate for semiconductor devices, comprising: beveling a peripheral edge of a first side of a bonding wafer to have a beveled width of 50 microns or less, the beveled edge of said first side of said bonding wafer surrounding a bonding surface; beveling a peripheral edge of a first side of a base wafer having transverse dimensions greater than the respective transverse dimensions of said bonding wafer with the beveled edge of said first side of said base wafer surrounding a bonding surface that is equal in size to the bonding surface of said bonding wafer; the beveled widths of said wafers being the widths of the bevels at the edges of the respective sides of said bonding and base wafers; providing an oxide layer on at least one of said bonding surfaces; and bonding said bonding surfaces of said bonding and base wafers together with said oxide layer therebetween, to form a semiconductor device with an SOI structure.
Claim 6
Independent Claim
164 words
A method for preparing a substrate for semiconductor devices, comprising: beveling a peripheral edge of a first side of a bonding wafer to have a beveled width of 50 microns or less, the beveled edge of said first side of said bonding wafer surrounding a bonding surface; beveling a peripheral edge of a first side of a base wafer having transverse dimensions greater than the respective transverse dimensions of said bonding wafer with the beveled edge of said first side of said base wafer surrounding a bonding surface that is equal in size to the bonding surface of said bonding wafer; the beveled widths of said wafers being the widths of the bevels at the edges of the respective sides of said bonding and base wafers; providing an oxide layer on at least one of said bonding surfaces; and bonding said bonding surfaces of said bonding and base wafers together with said oxide layer therebetween, to form a semiconductor device with an SOI structure.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-10-06 | 1996-04-06 | 1996-10-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-10-06 | 2000-04-06 | 2000-10-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-10-06 | 2004-04-06 | 2004-10-06 | $7700.00 | Window Closed / Lapsed |