Rapid-curing adhesive formulation for semiconductor devices

Claim 2

An adhesive formulation suitable for attaching a semiconductor device to a substrate comprising 10 to 40 wt.% cyanate ester vehicle and 60 to 90 wt.% of thermally and/or electrically conductive filler, said cyanate ester vehicle comprising liquid cyanate ester having a viscosity of about 1 to 5 poise at 25° C., about 2 to 6 pph alkylphenol and about 50 to 500 ppm of metal catalyst, said filler comprising particulate material of less than 70 microns; and said adhesive having the capability of being cured in about 5 minutes at 200° C.

Claim 3

An adhesive formulation according to claim 1 wherein said alkylphenol comprises nonylphenol.

Claim 4

An adhesive formulation according to claim 1 wherein said metal curing catalyst comprises a metal carboxylate or acetylacetonate.

Claim 5

An adhesive formulation according to claim 3 wherein said catalyst comprises at least one carboxylate or acetylacetonate of a metal from the group consisting is dissolved in said alkylphenol.

Claim 6

An adhesive formulation according to claim 4 wherein said catalyst comprises one of cobaltous and cobaltic acetylacetonate.

Claim 7

An adhesive formulation according to claim 5 wherein said catalyst comprises cobaltic acetylacetonate.

Claim 8

An adhesive formulation according to claim 1 wherein said filler comprises at least one material from the group consisting of silver, nickel, silicon, alumina and aluminum nitride.

Claim 9

An adhesive formulation according to claim 1 wherein said filler has a maximum particle size of 20 microns.

Claim 10

An adhesive formulation according to claim 1 wherein said adhesive comprises a dispensable material having a viscosity of about 100 to 1000 poise at 25° C.

Claim 11

An adhesive formulation according to claim 1 wherein said adhesive is capable of being cured in about 2 minutes at 100° C.

Claim 12

An adhesive formulation according to claim 1 wherein said filler comprises a material from the group consisting of silver nickel and silicon, said catalyst comprises a compound of a metal from the group consisting of zinc and cobalt and said curing time capability is less than 2.0 minutes at 200° C.

Claim 13

An adhesive formulation according to claim 1 wherein said filler comprises silver flake and said curing time capability is less than 1.5 minutes at 200° C.

Claim 14

An adhesive formulation according to claim 1 wherein said filler comprises nickel having a maximum particle size of about 20 microns.

Claim 15

A bonded semiconductor assembly comprising a semiconductor bonded to a substrate with an adhesive formulation comprising 10 to 40 wt.% cyanate ester vehicle and 60 to 90 wt.% of thermally and/or electrically conductive filler, said cyanate ester vehicle comprising liquid cyanate ester having a viscosity of about 1 to 5 poise at 25° C., about 2 to 6 pph alkylphenol and about 50 to 500 ppm of metal catalyst, said filler comprising particulate material of less than 70 microns; and said adhesive having the capability of being cured in about 5 minutes at 200° C.

Claim 16

A bonded semiconductor assembly comprising a semiconductor bonded to a substrate with an adhesive formulation comprising 10 to 40 wt.% cyanate ester vehicle and 60 to 90 wt.% of thermally and/or electrically conductive filler, said cyanate ester vehicle comprising liquid cyanate ester having a viscosity of about 1 to 5 poise at 25° C., about 2 to 6 pph alkylphenol and about 50 to 500 ppm of metal catalyst, said filler comprising particulate material of less than 70 microns; and said adhesive having the capability of being cured in about 5 minutes at 200° C.

Claim 17

A bonded semiconductor assembly according to claim 14 wherein said alkylphenol comprises nonylphenol, said metal curing catalyst comprises a metal carboxylate or acetylacetonate, and said filler comprises at least one material from the group consisting of silver, nickel, silicon, alumina and aluminum nitride.

Claim 18

A bonded semiconductor assembly according to a claim 14 wherein said adhesive formulation has a viscosity of about 100 to 1000 poise at 25° C. and a maximum curing time capability of 2.0 minutes, said filler has a maximum particle size of 20 microns and comprises one of the group consisting of silicon, silver, and nickel, and the metal curing catalyst comprises one of the zinc, cobaltic and cobaltous acetylacetonate.

Claim 19

An adhesive formulation suitable for attaching a semiconductor device to a substrate comprising 10 to 40 wt.% cyanate ester vehicle and 60 to 90 wt.% of thermally and/or electrically conductive filler, said adhesive formulation having a viscosity of about 100 to 1000 poise at 25° C., said cyanate ester vehicle comprising liquid cyanate ester having a viscosity of about 1 to 5 poise at 25° C., about 2 to 6 pph alkylphenol and about 50 to 500 ppm of metal catalyst, said filler comprising particulate material of less than 70 microns; and said adhesive having the capability of being cured in about 5 minutes at 200° C.

Claim 20

An adhesive formulation suitable for attaching a semiconductor device to a substrate comprising 10 to 40 wt.% cyanate ester vehicle and 60 to 90 wt.% of thermally and/or electrically conductive filler, said adhesive formulation having a viscosity of about 100 to 1000 poise at 25° C., said cyanate ester vehicle comprising liquid cyanate ester having a viscosity of about 1 to 5 poise at 25° C., about 2 to 6 pph alkylphenol and about 50 to 500 ppm of metal catalyst, said filler comprising particulate material of less than 70 microns; and said adhesive having the capability of being cured in about 5 minutes at 200° C.