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Patent US5148595A successfully refreshed from Google Patents.
US5148595A
Expired / Lapsed
US
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Method of making laminated electrostatic printhead
Assignee: Nippon Steel Corp
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Filing: 1991-04-04
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Granted: 1992-09-22
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Expires: 2011-04-04
Abstract
Abstract In a printhead for an electrostatic printer, the printhead styli are formed on a monolithic substrate, such as a printed circuit board material. Each stylus has its own driver circuit incorporated into one or more integrated circuit die which are mounted directly on the monolithic substrate, and electrically connected to traces formed on the printed circuit board. The styli are the ends of the traces as formed on the edge of the substrate. The integrated circuit die are connected to the traces by wire bonding or TAB bonding. The printhead is implemented in monoscan, biscan, triscan, and various other configurations. To fabricate the printhead, the printed circuit board material is ground to a precise thickness and conductive traces are photolithographically etched in copper foil laminated thereto. Using adhesives, the printhead is laminated together including supporting side plates, and in some embodiments multiple substrates, which are laminated together directed or by spacers therebetween.
Inventors
- 👤 David E. Doggett
- 👤 Brian J. Dahlquist
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-25 11:10
CPC Classifications
B; B41; B41J; B41J2/00; B41J2/385; B41J2/39; B41J2/395; H; H05; H05K; H05K3/00; H05K3/0011; H05K3/02; H05K3/022; H05K3/22; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49144
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
66 words
A method for making a high resolution electrostatic printhead without multiplexing comprising the steps of: providing a substrate material narrow in width; grinding the material to a particular thickness; laminating a copper foil layer to at least one surface of the material; etching the copper foil layer to form conductive traces; and attaching integrated circuit die to the material so as to electrically contact the traces.
Claim 2
Independent Claim
66 words
A method for making a high resolution electrostatic printhead without multiplexing comprising the steps of: providing a substrate material narrow in width; grinding the material to a particular thickness; laminating a copper foil layer to at least one surface of the material; etching the copper foil layer to form conductive traces; and attaching integrated circuit die to the material so as to electrically contact the traces.
Claim 3
Dependent Claim
17 words
The method of claim 1, wherein the step of grinding is prior to the step of laminating.
Claim 4
Dependent Claim
17 words
The method of claim 1, wherein the step of laminating is prior to the step of grinding.
Claim 5
Dependent Claim
23 words
The method of claim 1, further comprising the step of laminating a second copper foil layer to the other surface of the material.
Claim 6
Dependent Claim
18 words
The method of claim 1, wherein the step of grinding includes holding the material to a flat plate.
Claim 7
Dependent Claim
16 words
The method of claim 1 wherein the step of grinding is after the step of etching.
Claim 8
Dependent Claim
20 words
The method of claim 4, further comprising the step of etching the second copper foil layer to form traces therein.
Claim 9
Dependent Claim
22 words
The method of claim 1, wherein the step of laminating comprises adhering the copper foil layer to the material with an epoxy.
Claim 10
Dependent Claim
22 words
The method of claim 1, further comprising the step of laminating a support plate to at least one side of the material.
Claim 11
Dependent Claim
17 words
The method of claim 9, wherein the step of laminating is prior to the step of etching.
Claim 12
Dependent Claim
30 words
The method of claim 1, further comprising the steps, after the step of attaching, of: temporarily mounting the material on a support; and testing the integrated circuit die and traces.
Claim 13
Dependent Claim
13 words
The method of claim 1, wherein the material is printed circuit board material.
Claim 14
Dependent Claim
53 words
The method of claim 1, wherein the step of etching comprises etching two sets of juxtaposed conductive traces, and further comprising the steps of: cutting the substrate material into two portions, one set of conductive traces being on each portion; and fastening together the two portions stacked one-on-another to form a biscan printhead.
Claim 15
Dependent Claim
24 words
The method of claim 13, further comprising the steps of aligning the two portions, prior to the step of fastening, by a transparent reticle.
Claim 16
Dependent Claim
59 words
The method of claim 1, further comprising the steps, after the step of grinding, of: laminating two spaced-apart support plates to one surface of the material; then cutting the material into two portions, the cut being between the two support plates thereby forming two half printheads; and then fastening together the two half-heads to form a high resolution printhead.
Claim 17
Dependent Claim
22 words
The method of claim 1, wherein in the step of providing, the width of the material is less than about 6 inches.
Claim 18
Dependent Claim
23 words
The method of claim 6, wherein in the step of etching, 200 conductive traces are formed per inch of length of the material.
Claim 19
Independent Claim
99 words
A method of making a high resolution electrostatic printhead without multiplexing comprising the steps of: providing printed circuit board material narrow in width; holding the material to a flat plate; grinding the material to a particular thickness while being held on the flat plate; laminating a copper foil layer to both sides of the material; etching traces by photolithography in the copper foil layer on at least one side of the material; attaching integrated circuit die to the material so as to electrically connect the integrated circuit die to the traces; and laminating a support plate to the material.
Claim 20
Independent Claim
99 words
A method of making a high resolution electrostatic printhead without multiplexing comprising the steps of: providing printed circuit board material narrow in width; holding the material to a flat plate; grinding the material to a particular thickness while being held on the flat plate; laminating a copper foil layer to both sides of the material; etching traces by photolithography in the copper foil layer on at least one side of the material; attaching integrated circuit die to the material so as to electrically connect the integrated circuit die to the traces; and laminating a support plate to the material.
Claim 21
Dependent Claim
28 words
The method of claim 18, further comprising the step of embedding the integrated circuit die in a protective material after the step of attaching the integrated circuit die.
Claim 22
Dependent Claim
48 words
The method of claim 18, wherein the step of laminating a support plate comprises the steps of: forming a groove in the support plate; providing a fixture having a boss; holding the material in the fixture; and inserting the boss in the groove while laminating the support plate.
Claim 23
Dependent Claim
19 words
The method of claim 18, further comprising the step of forming a contour on an edge of the material.
Claim 24
Independent Claim
68 words
A method of forming an electrostatic printhead comprising the steps of: providing first and second substrates; laminating a copper foil layer to at least one surface of each substrate; etching each copper foil layer to form conductive traces; attaching integrated circuit die to the material so as to electrically connect the traces; and attaching together the first and second substrates by a spacer having a particular thickness therebetween.
Claim 25
Independent Claim
68 words
A method of forming an electrostatic printhead comprising the steps of: providing first and second substrates; laminating a copper foil layer to at least one surface of each substrate; etching each copper foil layer to form conductive traces; attaching integrated circuit die to the material so as to electrically connect the traces; and attaching together the first and second substrates by a spacer having a particular thickness therebetween.
Claim 26
Independent Claim
78 words
A method of making a high resolution non-multiplexed electrostatic printhead comprising the steps of: providing a substrate material narrow in width; forming the material to a particular thickness; then forming the conductive traces on the material; then laminating two s-aced-apart support plates to one surface of the material; then cutting the material into two portions, the cut being between the two support plates thereby forming two half printheads; and then fastening together the two half-heads into one printhead.
Claim 27
Independent Claim
78 words
A method of making a high resolution non-multiplexed electrostatic printhead comprising the steps of: providing a substrate material narrow in width; forming the material to a particular thickness; then forming the conductive traces on the material; then laminating two s-aced-apart support plates to one surface of the material; then cutting the material into two portions, the cut being between the two support plates thereby forming two half printheads; and then fastening together the two half-heads into one printhead.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-22 | 1996-03-23 | 1996-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-22 | 2000-03-23 | 2000-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-22 | 2004-03-23 | 2004-09-22 | $7700.00 | Window Closed / Lapsed |