Patent US5147982A successfully refreshed from Google Patents.
US5147982A
Expired / Lapsed
US
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Encapsulation of electronic modules
Assignee: STMicroelectronics SA
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Filing: 1991-04-10
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Granted: 1992-09-15
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Expires: 2011-04-10
Abstract
Abstract The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
Inventors
- 👤 Francis Steffen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:06
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W42/00; H10W42/60; H10W70/00; H10W70/60; H10W70/699; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
68 words
A micromodule for the encapsulation of integrated circuits, comprising a punched metal grid, a strip of perforated dielectric screen transferred to the punched grid, the perforations of the screen covering conductive zones of the punched grid without covering interstices between these zones, an integrated circuit chip being placed in a perforation of the screen and being electrically connected to conductive zones located in other perforations of the strip.
Claim 2
Dependent Claim
68 words
A micromodule for the encapsulation of integrated circuits, comprising a punched metal grid, a strip of perforated dielectric screen transferred to the punched grid, the perforations of the screen covering conductive zones of the punched grid without covering interstices between these zones, an integrated circuit chip being placed in a perforation of the screen and being electrically connected to conductive zones located in other perforations of the strip.
Claim 3
Dependent Claim
30 words
A micromodule according to claim 1, comprising an transferred ring surrounding the chip and its connections, and a protecting material filling the space demarcated by the ring and the screen.
Claim 4
Dependent Claim
50 words
An encapsulation for an integrated circuit, comprising a prepunched metal conductive grid, a strip of preperforated dielectric screen attached to the grid, an integrated circuit chip positioned in a perforation of the stip, and electrical connections between the chip and zones of the grid located in perforations of the strip.
Claim 5
Dependent Claim
50 words
An encapsulation for an integrated circuit, comprising a prepunched metal conductive grid, a strip of preperforated dielectric screen attached to the grid, an integrated circuit chip positioned in a perforation of the stip, and electrical connections between the chip and zones of the grid located in perforations of the strip.
Claim 6
Dependent Claim
45 words
An encapsulation according to claim 3 wherein the perforations of the strip and punched slots of the grid are located such that the strip covers and blocks all interstices between the conductive metal of the grid in a region in which a chip is positioned.
Claim 7
Dependent Claim
25 words
An encapsulation according to claim 3 or 4 further comprising a protecting material covering the chip and the connections in the perforations of the strip.
Claim 8
Dependent Claim
25 words
An encapsulation according to claim 5 further comprising a protecting ring surrounding the chip and its connections, this ring being filled with the protecting material.
Claim 9
Dependent Claim
18 words
An encapsulation according to claim 6 wherein said protecting ring comprises a ring-shaped protuberance integrated into the strip.
Claim 10
Dependent Claim
19 words
An encapsulation according to claim 4, 5, or 6 wherein the protecting material is a thermoplastic or thermosetting resin.
Claim 11
Dependent Claim
122 words
An encapsulation according to claim 1 or 3, wherein the grid has a conductive central zone 12, on which is positioned the integrated circuit chip, and peripheral conductive zones 14, surrounding this central zone, said zones being separated from one another by interstices 16; said strip perforations including a central perforation 22, surrounding said integrated circuit chip, and peripheral perforations 24, for access to connection terminals on the peripheral conductive zones 14; said central perforation 22, and central zone 12, being positioned relative to each other with the central perforation 22, on top of the central zone 12, without comming on top of an interstice 16 of the punch grid; and said central hole 22 being smaller than the central zone 12.
Claim 12
Dependent Claim
19 words
An encapsulation according to claim 9 wherein each peripheral perforation 24, faces an end of a conductive zone 14.
Claim 13
Dependent Claim
27 words
An encapsulation according to claim 9 wherein all the interstices of the said grid are covered by said strip in the region of the chip and connections.
Claim 14
Dependent Claim
47 words
An encapsulation according to claim 3 wherein a side of the grid opposite to a side adjacent to the strip, has contact surfaces providing access to the integrated circuit from an exterior of the encapsulation, whereby said encapsulation is particularly applicable for incorporation into a chip card.
Claim 15
Dependent Claim
39 words
An encapsulation according to claim 6 wherein said ring surrounds a plurality of chips and connecting wires to said chips, and wherein an upper edge of said ring extends beyond a height of the chips and said connecting wires.
References Cited (Backward Citations)
US4933744A
Cited
US4820658A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-15 | 1996-03-16 | 1996-09-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-15 | 2000-03-16 | 2000-09-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-15 | 2004-03-16 | 2004-09-15 | $7700.00 | Window Closed / Lapsed |