US5146303A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Compact, thermally efficient focal plane array and testing and repair thereof
Assignee: Lockheed Martin Corp
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Filing: 1990-04-05
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Granted: 1992-09-08
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Expires: 2010-04-05
Abstract
Abstract In a focal plane array sensor hybrid, a focal plane array fabricated in a chip of one semiconductor material and a read out circuit fabricated in one or more chips of a different semiconductor material are connected by a high density interconnect structure in which a layer of dielectric material is bonded to the chips and has interconnecting conductors disposed thereon and extending through via holes therein into ohmic contact with appropriate contact pads of the chips. Inclusion of a flexible portion in the high density interconnect structure enables the readout and the focal plane array chips to be disposed in different planes to provide a compact structure. Focal plane array sensor hybrid testing and repair are both facilitated by this structure.
Inventors
- 👤 William P. Kornrumpf
- 👤 Walter M. Marcinkiewicz
- 👤 William E. Davern
- 👤 Herbert C. Zieger
- 👤 Jonathan R. Miles
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:21
CPC Classifications
H; H10; H10F; H10F77/00; H10F77/60; H10F39/00; H10F39/10; H10F39/12; H10W; H10W90/00; H10W72/00; H10W72/50; H10W72/90; H10W72/931; H10W72/932; H10W90/701; H10W90/751; H10W90/753; H10W90/754
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
156 words
A focal plane array sensor hybrid comprising: a focal plane array incorporated in a first chip having a major surface, an optically active portion on said major surface of said first chip, and contact pads on said major surface of said first chip; a readout circuit comprising a second chip having a major surface and contact pads on said major surface of said second chip; and a high density interconnection structure comprising: a layer of dielectric material bonded to at least portions of said major surfaces of said first and second chips, a set of interconnecting conductors disposed on said layer of dielectric material and connected between the contact pads of said first and second chips, said first and second chips being disposed in nonparallel planes, a flexible portion disposed between said first and second chips, and a window in said layer of dielectric material in alignment with said optically active portion of said first chip.
Claim 2
Dependent Claim
156 words
A focal plane array sensor hybrid comprising: a focal plane array incorporated in a first chip having a major surface, an optically active portion on said major surface of said first chip, and contact pads on said major surface of said first chip; a readout circuit comprising a second chip having a major surface and contact pads on said major surface of said second chip; and a high density interconnection structure comprising: a layer of dielectric material bonded to at least portions of said major surfaces of said first and second chips, a set of interconnecting conductors disposed on said layer of dielectric material and connected between the contact pads of said first and second chips, said first and second chips being disposed in nonparallel planes, a flexible portion disposed between said first and second chips, and a window in said layer of dielectric material in alignment with said optically active portion of said first chip.
Claim 3
Dependent Claim
20 words
The focal plane array sensor hybrid recited in claim 1 wherein: said first chip is mounted in a cryogenic dewar.
Claim 4
Dependent Claim
29 words
The focal plane array sensor hybrid recited in claim 2 wherein: said layer of dielectric material is discontinuous at least one location disposed between said first and second chips.
Claim 5
Dependent Claim
25 words
The focal plane array sensor hybrid recited in claim 2 wherein: said layer of dielectric material extends from said first chip to said second chip.
Claim 6
Dependent Claim
63 words
The focal plane array sensor hybrid recited in claim 2 wherein: said first chip is mounted on an end of a coolant expander; said second chip is disposed along a side of said expander; and said flexible portion of said high density interconnection structure bends from parallel to the plane of said first chip to parallel to the plane of said second chip.
Claim 7
Dependent Claim
47 words
The focal plane array sensor hybrid recited in claim 2 wherein: said first chip is mounted on an end of a coolant expander; said second chip is spaced from said first chip; and said flexible portion of said high density interconnection structure is configured to withstand vibration.
Claim 8
Dependent Claim
32 words
The focal plane array sensor hybrid recited in claim 1 wherein: said high density interconnection structure includes contact tabs for connection to electrical components external to said focal plane array sensor hybrid.
Claim 9
Dependent Claim
18 words
The focal plane array sensor hybrid recited in claim 7 wherein: said contact tabs comprise an edge connector.
Claim 10
Dependent Claim
18 words
The focal plane array sensor hybrid recited in claim 7 wherein: said contact tabs comprise projecting connection tabs.
Claim 11
Dependent Claim
29 words
The focal plane array sensor hybrid recited in claim 1 wherein: said layer of dielectric material is discontinuous at least one location disposed between said first and second chips.
Claim 12
Dependent Claim
20 words
The focal plane array sensor hybrid recited in claim 1 wherein: said focal plane array is a two dimensional array.
Claim 13
Dependent Claim
19 words
The focal plane array sensor hybrid recited in claim 11 wherein: said readout circuit comprises a plurality of chips.
Claim 14
Dependent Claim
32 words
The focal plane array sensor hybrid recited in claim 12 wherein: portions of said high density interconnection structure which include conductors therein extend beyond at least two sides of said first chip.
Claim 15
Dependent Claim
27 words
The focal plane array sensor hybrid recited in claim 12 wherein: said high density interconnection structure includes a flexible portion disposed between said first and second chips.
Claim 16
Dependent Claim
21 words
The focal plane array sensor hybrid recited in claim 14 wherein: said first and second chips are disposed in non-parallel planes.
Claim 17
Dependent Claim
20 words
The focal plane array sensor hybrid recited in claim 15 wherein: said first chip is mounted in a cryogenic dewar.
Claim 18
Dependent Claim
29 words
The focal plane array sensor hybrid recited in claim 15 wherein: said layer of dielectric material is discontinuous at least one location disposed between said first and second chips.
Claim 19
Dependent Claim
35 words
The focal plane array sensor hybrid recited in claim 16 wherein: said first chip is mounted on an end of a coolant expander; and said second chip is disposed along a side of said expander.
Claim 20
Dependent Claim
47 words
The focal plane array sensor hybrid recited in claim 16 wherein: said first chip is mounted on an end of a coolant expander; said second chip is spaced from said first chip; and said flexible portion of said high density interconnection structure is configured to withstand vibration.
Claim 21
Dependent Claim
20 words
The focal plane array sensor hybrid recited in claim 10 wherein: said first chip is mounted in a cryogenic dewar.
Claim 22
Dependent Claim
25 words
The focal plane array sensor hybrid recited in claim 20 wherein: said layer of dielectric material extends from said first chip to said second chip.
Claim 23
Dependent Claim
63 words
The focal plane array sensor hybrid recited in claim 20 wherein: said first chip is mounted on an end of a coolant expander; said second chip is disposed along a side of said expander; and said flexible portion of said high density interconnection structure bends from parallel to the plane of said first chip to parallel to the plane of said second chip.
Claim 24
Dependent Claim
47 words
The focal plane array sensor hybrid recited in claim 20 wherein: said first chip is mounted on an end of a coolant expander; said second chip is spaced from said first chip; and said flexible portion of said high density interconnection structure is configured to withstand vibration.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-09-08 | 1996-03-09 | 1996-09-08 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-09-08 | 2000-03-09 | 2000-09-08 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-09-08 | 2004-03-09 | 2004-09-08 | $7700.00 | Window Closed / Lapsed |