Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
211 words
A semiconductor device having an internal circuit including a memory device, and an input protection device for protecting said internal circuit, both said internal circuit and said input protection device being formed on one semiconductor substrate; wherein said input protection device comprises: source and drain impurity regions formed only of high concentration impurity regions, spaced apart from each other in a surface of said semiconductor substrate; a first insulator film formed on the surface of said semiconductor substrate between said source and drain impurity regions; a first electrode formed on said first insulator film; a second insulator film formed on said first electrode; a second electrode formed on said second insulator film; one region of said source and drain impurity regions of said input protection device being electrically connected to an interconnection for supplying an electrical signal to said internal circuit; the other region of said source and drain impurity regions of said input protection device and said semiconductor substrate being connected to a ground terminal; one of said first and second electrodes of said input protection device being connected by a conducting material to the ground terminal; and the other of said first and second electrodes being connected by a conducting material to said interconnection for supplying an electrical signal.
Claim 2
Dependent Claim
211 words
A semiconductor device having an internal circuit including a memory device, and an input protection device for protecting said internal circuit, both said internal circuit and said input protection device being formed on one semiconductor substrate; wherein said input protection device comprises: source and drain impurity regions formed only of high concentration impurity regions, spaced apart from each other in a surface of said semiconductor substrate; a first insulator film formed on the surface of said semiconductor substrate between said source and drain impurity regions; a first electrode formed on said first insulator film; a second insulator film formed on said first electrode; a second electrode formed on said second insulator film; one region of said source and drain impurity regions of said input protection device being electrically connected to an interconnection for supplying an electrical signal to said internal circuit; the other region of said source and drain impurity regions of said input protection device and said semiconductor substrate being connected to a ground terminal; one of said first and second electrodes of said input protection device being connected by a conducting material to the ground terminal; and the other of said first and second electrodes being connected by a conducting material to said interconnection for supplying an electrical signal.
Claim 3
Dependent Claim
14 words
The semiconductor device of claim 1, wherein said internal circuit further comprises a transistor.
Claim 4
Dependent Claim
13 words
The semiconductor device of claim 2, wherein said transistor has an LDD structure.
Claim 5
Dependent Claim
82 words
The semiconductor device of claim 1, wherein said memory device comprises: source and drain impurity regions formed only of high concentration impurity regions, spaced apart from each other in a surface of said semiconductor substrate; a first insulator film formed on the surface of said semiconductor substrate between said source and drain impurity regions; a first electrode formed on said first insulator film; a second insulator film formed on said first electrode; and a second electrode formed on said second insulator film.
Claim 6
Dependent Claim
30 words
The semiconductor device of claim 1, wherein said first electrode is connected to the ground terminal and said second electrode is connected to said interconnection for supplying an electrical signal.
Claim 7
Dependent Claim
183 words
A semiconductor device having an internal circuit including a memory device, and an input protection device for protecting said internal circuit, both said internal circuit and said input protection device being formed on one semiconductor substrate; wherein said input protection device comprises: source and drain impurity regions formed only of high concentration impurity regions, spaced apart from each other in a surface of said semiconductor substrate; a first insulator film formed on the surface of said semiconductor substrate between said source and drain impurity regions; a first electrode formed on said first insulator film; a second insulator film formed on said first electrode; a second electrode formed on said second insulator film; one region of said source and drain impurity regions of said input protection device being electrically connected to an interconnection for supplying an electrical signal to said internal circuit; the other region of said source and drain impurity regions of said input protection device and said semiconductor substrate being connected to a ground terminal; and said first and second electrodes of said input protection device being connected to the ground terminal.
Claim 8
Dependent Claim
183 words
A semiconductor device having an internal circuit including a memory device, and an input protection device for protecting said internal circuit, both said internal circuit and said input protection device being formed on one semiconductor substrate; wherein said input protection device comprises: source and drain impurity regions formed only of high concentration impurity regions, spaced apart from each other in a surface of said semiconductor substrate; a first insulator film formed on the surface of said semiconductor substrate between said source and drain impurity regions; a first electrode formed on said first insulator film; a second insulator film formed on said first electrode; a second electrode formed on said second insulator film; one region of said source and drain impurity regions of said input protection device being electrically connected to an interconnection for supplying an electrical signal to said internal circuit; the other region of said source and drain impurity regions of said input protection device and said semiconductor substrate being connected to a ground terminal; and said first and second electrodes of said input protection device being connected to the ground terminal.