Patent US5134462A successfully refreshed from Google Patents.
US5134462A
Expired / Lapsed
US
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Flexible film chip carrier having a flexible film substrate and means for maintaining planarity of the substrate
Assignee: Motorola Solutions Inc
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Filing: 1991-07-09
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Granted: 1992-07-28
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Expires: 2011-07-09
Abstract
Abstract A flexible film is made into a substrate (100) having metallization patterns. A semiconductor device (106) is affixed to the substrate, and the assembly is heated to expand the substrate. A cover (110) is attached to the substrate, over the device (106). Upon cooling, the substrate (100) shrinks and becomes taut and planar within the reinforced area. Alternatively, a reinforcing ring (210) can be attached to the substrate (200) either before or after attachment of the semiconductor device (206).
Inventors
- 👤 Bruce J. Freyman
- 👤 Barry M. Miles
- 👤 Jill L. Flaugher
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 01:15
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H10W76/60; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/851; H10W72/874; H10W72/884; H10W74/00; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 27
Claim 1
Independent Claim
71 words
A flexible film chip carrier, comprising: a flexible film substrate having first and second sides, the first side having a metallization pattern; a semiconductor device mechanically attached to the substrate and electrically affixed to the metallization pattern said substrate covering at least an area directly beneath the semiconductor device; a substrate reinforcing means attached to the first side of the substrate about the semiconductor device, for maintaining planarity of the substrate.
Claim 2
Dependent Claim
71 words
A flexible film chip carrier, comprising: a flexible film substrate having first and second sides, the first side having a metallization pattern; a semiconductor device mechanically attached to the substrate and electrically affixed to the metallization pattern said substrate covering at least an area directly beneath the semiconductor device; a substrate reinforcing means attached to the first side of the substrate about the semiconductor device, for maintaining planarity of the substrate.
Claim 3
Dependent Claim
16 words
The flexible film chip carrier of claim 1, wherein the substrate is an unreinforced polymer film.
Claim 4
Dependent Claim
14 words
The flexible film chip carrier of claim 2, wherein the polymer film is polyimide.
Claim 5
Dependent Claim
17 words
The flexible film chip carrier of claim 1, wherein the reinforcing means comprises a rigid closed member.
Claim 6
Dependent Claim
17 words
The flexible film chip carrier of claim 4, wherein the rigid closed member is a glass-filled adhesive.
Claim 7
Dependent Claim
17 words
The flexible film chip carrier of claim 4, wherein the rigid closed member is a mineral-filled adhesive.
Claim 8
Dependent Claim
17 words
The flexible film chip carrier of claim 4, wherein the rigid member is a filled thermoplastic polymer.
Claim 9
Dependent Claim
17 words
The flexible film chip carrier of claim 4, wherein the rigid closed member is a thermoset polymer.
Claim 10
Dependent Claim
21 words
The flexible film chip carrier of claim 4, wherein the rigid closed member is affixed to the substrate with an adhesive.
Claim 11
Dependent Claim
15 words
The flexible film chip carrier of claim 4, wherein the rigid closed member is metal.
Claim 12
Dependent Claim
20 words
The flexible film chip carrier of claim 10, wherein the rigid closed member is affixed to the substrate with solder.
Claim 13
Dependent Claim
16 words
The flexible film chip carrier of claim 4, wherein the rigid closed member is alumina ceramic.
Claim 14
Dependent Claim
30 words
The flexible film chip carrier of claim 4, wherein the volume circumscribed by the rigid closed member is filled with a potting material so as to encapsulate the semiconductor device.
Claim 15
Dependent Claim
39 words
The flexible film chip carrier of claim 1, wherein the reinforcing means comprises a cover having a top wall and supporting peripheral side walls, affixed to the substrate so as to form a sealed package about the semiconductor device.
Claim 16
Dependent Claim
14 words
The flexible film chip carrier of claim 14, wherein the cover is alumina ceramic.
Claim 17
Dependent Claim
14 words
The flexible film chip carrier of claim 15 wherein the polymer film is polyimide.
Claim 18
Dependent Claim
21 words
The flexible film chip carrier of claim 15 wherein the cover is affixed to the substrate with a heat curing adhesive.
Claim 19
Dependent Claim
13 words
The flexible film chip carrier of claim 14, wherein the cover is metal.
Claim 20
Dependent Claim
18 words
The flexible film chip carrier of claim 18, wherein the cover is affixed to the substrate with solder.
Claim 21
Dependent Claim
19 words
The flexible film chip carrier of claim 18, wherein the cover is affixed to the substrate with eutectic bonding.
Claim 22
Dependent Claim
17 words
The flexible film chip carrier of claim 14, wherein the cover is a thermoplastic or thermoset polymer.
Claim 23
Dependent Claim
19 words
The flexible film chip carrier of claim 21 wherein the cover is affixed to the substrate with an adhesive.
Claim 24
Dependent Claim
80 words
A flexible film chip carrier, comprising: a flexible polyimide film substrate having first and second sides, the first side having a metallization pattern; a semiconductor device adhesively bonded directly to the substrate and wire bonded to the metallization pattern; a rigid cover having a top wall and supporting peripheral side walls, adhesively bonded to the first side of the substrate about the semiconductor device and wire bonds while the substrate is expanded by heating, for maintaining planarity of the substrate.
Claim 25
Dependent Claim
80 words
A flexible film chip carrier, comprising: a flexible polyimide film substrate having first and second sides, the first side having a metallization pattern; a semiconductor device adhesively bonded directly to the substrate and wire bonded to the metallization pattern; a rigid cover having a top wall and supporting peripheral side walls, adhesively bonded to the first side of the substrate about the semiconductor device and wire bonds while the substrate is expanded by heating, for maintaining planarity of the substrate.
Claim 26
Dependent Claim
78 words
A flexible film chip carrier prepared by a process comprising: providing a flexible film substrate having first and second sides, the first side having a metallization pattern and a semiconductor device mechanically attached to the substrate and electrically connected to the metallization pattern; expanding the substrate by heating it, and attaching a reinforcing means to the first side of the substrate about the semiconductor device, for maintaining planarity of the substrate, and contracting the substrate by cooling it.
Claim 27
Dependent Claim
78 words
A flexible film chip carrier prepared by a process comprising: providing a flexible film substrate having first and second sides, the first side having a metallization pattern and a semiconductor device mechanically attached to the substrate and electrically connected to the metallization pattern; expanding the substrate by heating it, and attaching a reinforcing means to the first side of the substrate about the semiconductor device, for maintaining planarity of the substrate, and contracting the substrate by cooling it.
References Cited (Backward Citations)
US3072832A
Cited
US3885304A
Cited
US4218701A
Cited
US4855867A
Cited
US4953005A
Cited
US4970579A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-28 | 1996-01-27 | 1996-07-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-28 | 2000-01-27 | 2000-07-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-28 | 2004-01-27 | 2004-07-28 | $7700.00 | Window Closed / Lapsed |