Electric circuit arrangement and method of making the same

Claim 1

A method of making an electric circuit arrangement, comprising the steps of providing an electrically insulating circuit board having opposite major surfaces and holes extending intermediate said surfaces and electrically conductive circuit strips on both of said major surfaces; mounting on one of said major surfaces a semiconductor unit having exposed electrical terminals; electrically connecting said terminals with respective ones of said strips using bond wires; mounting surround means defining a chamber around said mounted semiconductor unit on said one major surface; depositing a protective covering of polymerizable material into said surround means of sufficient quantity so as to encapsulate said semiconductor unit and said bond wires and form a meniscus above said semiconductor unit; mounting on said one major surface a plurality of discrete electrical components having conductive leads which extend through said respective ones of said holes to said other major surface and to respective circuit strips thereof; and soldering said leads at said other major surface to the respectively associated circuit strips by contacting said leads with a surgedeposition soldering bath.

Claim 2

A method of making an electric circuit arrangement, comprising the steps of providing an electrically insulating circuit board having opposite major surfaces and holes extending intermediate said surfaces and electrically conductive circuit strips on both of said major surfaces; mounting on one of said major surfaces a semiconductor unit having exposed electrical terminals; electrically connecting said terminals with respective ones of said strips using bond wires; mounting surround means defining a chamber around said mounted semiconductor unit on said one major surface; depositing a protective covering of polymerizable material into said surround means of sufficient quantity so as to encapsulate said semiconductor unit and said bond wires and form a meniscus above said semiconductor unit; mounting on said one major surface a plurality of discrete electrical components having conductive leads which extend through said respective ones of said holes to said other major surface and to respective circuit strips thereof; and soldering said leads at said other major surface to the respectively associated circuit strips by contacting said leads with a surgedeposition soldering bath.

Claim 3

A method of making an electric circuit arrangement, comprising the steps of providing an electrically insulating circuit board having opposite major surfaces and holes extending intermediate said surfaces and electrically conductive circuit strips on one of said major surfaces; applying a coating of an anti-solder lacquer substance which is nonwettable by liquid solder on a portion of said circuit strips on said one major surface; mounting on another portion of said one major surface which has not been applied with said anti-solder lacquer a semiconductor unit having exposed electrical terminals; electrically connecting said terminals with respective ones of said strips using bond wires; mounting surround means defining a chamber around said mounted semiconductor unit on said portion of said one major surface which has been applied with said anti-solder lacquer; depositing a protective covering of polymerizable material into said surround means of sufficient quantity so as to encapsulate said semiconductor unit and said bond wires and form a meniscus above said semiconductor unit; mounting on the other of said major surfaces a plurality of discrete electrical components having conductive leads which extend through said respective ones of said holes to said one major surface and to respective circuit strips thereof; and soldering said leads at said one major surface to the respectively associated circuit strips by contacting said leads with a surge-deposition soldering bath, whereby contact between the solder and said semi-conductor unit is prevented by an air pocket formed by said meniscus as well as by said protective covering of polymerizable material itself.

Claim 4

A method of making an electric circuit arrangement, comprising the steps of providing an electrically insulating circuit board having opposite major surfaces and holes extending intermediate said surfaces and electrically conductive circuit strips on one of said major surfaces; applying a coating of an anti-solder lacquer substance which is nonwettable by liquid solder on a portion of said circuit strips on said one major surface; mounting on another portion of said one major surface which has not been applied with said anti-solder lacquer a semiconductor unit having exposed electrical terminals; electrically connecting said terminals with respective ones of said strips using bond wires; mounting surround means defining a chamber around said mounted semiconductor unit on said portion of said one major surface which has been applied with said anti-solder lacquer; depositing a protective covering of polymerizable material into said surround means of sufficient quantity so as to encapsulate said semiconductor unit and said bond wires and form a meniscus above said semiconductor unit; mounting on the other of said major surfaces a plurality of discrete electrical components having conductive leads which extend through said respective ones of said holes to said one major surface and to respective circuit strips thereof; and soldering said leads at said one major surface to the respectively associated circuit strips by contacting said leads with a surge-deposition soldering bath, whereby contact between the solder and said semi-conductor unit is prevented by an air pocket formed by said meniscus as well as by said protective covering of polymerizable material itself.