Low-force, high-density gel connector

Claim 2

A connector for electrically interconnecting the conductive pads of a component to the conductive pads of a circuit wherein said pads are arranged in a given planar array, the connector including a thin flexible insulating film having an array of conductive pads on each surface thereof compatible with the pads in said planar array, means electrically joining the pads of the top surface to the pads of the bottom surface of said film, a conductive gel contact disposed on each film pad extending out from the film surface and operable upon compression in an axial sense transverse to the film surface to interconnect the component and circuit pads through the film pads and said means.

Claim 3

The connector of claim 1 wherein the said gel contacts each extend outwardly of the film in an axial thickness equal to or substantially greater than the thickness of said film.

Claim 4

The connector of claim 1 wherein the said gel contacts engage the pads on said film throughout an area of contact appreciable relative to the area of the pad disposed on the surface of said film.

Claim 5

The connector of claim 1 wherein said means electrically joining the pads of the top surface to the pads of the bottom surface of said film is comprised of a hole and a plating through said hole.

Claim 6

The connector of claim 4 wherein the said gel contacts extend within the said hole.

Claim 7

An assembly for interconnecting the conductive pads of a component to the conductive pads of a circuit wherein said pads are on given centers, in arrays defining high density interconnection patterns, the said assembly comprising a housing receiving a component including means to mount the said component on the said circuit with the said conductive pads of component and circuit aligned on the given centers, a connector formed of a film having on each side surface thereof conductive pads in an array on said given centers aligned with the pads of the component and the circuit, holes in said film including a plating interconnecting the conductive pads on one side portion of said film to those on the other side portion and a contact gel on each conductive pad extending in said holes with the said contact gel further extending out from the surface of the said film to facilitate compression thereof, said means to mount said component operating to receive said connector between said component and said circuit and compress the said component against the said connector and the said circuit to effect a deformation of the contact gel and interconnect the component and circuit pads through the said contact gel and the conductive pads of said film.

Claim 8

An assembly for interconnecting the conductive pads of a component to the conductive pads of a circuit wherein said pads are on given centers, in arrays defining high density interconnection patterns, the said assembly comprising a housing receiving a component including means to mount the said component on the said circuit with the said conductive pads of component and circuit aligned on the given centers, a connector formed of a film having on each side surface thereof conductive pads in an array on said given centers aligned with the pads of the component and the circuit, holes in said film including a plating interconnecting the conductive pads on one side portion of said film to those on the other side portion and a contact gel on each conductive pad extending in said holes with the said contact gel further extending out from the surface of the said film to facilitate compression thereof, said means to mount said component operating to receive said connector between said component and said circuit and compress the said component against the said connector and the said circuit to effect a deformation of the contact gel and interconnect the component and circuit pads through the said contact gel and the conductive pads of said film.

Claim 9

The assembly of claim 6 wherein the said contact gel has a thickness substantially greater than the thickness of said film to accommodate non-planarity of the said connector and circuit pads through axial deformation of the gel material.

Claim 10

The assembly of claim 6 wherein the said film has a thickness of on the order of 0.003 to 0.005 inches and the said gel has a thickness of on the order of 0.005 to 0.010 inches.

Claim 11

The assembly of claim 6 wherein the said gel is comprised of two bodies of material, separately deposited and cured on opposite side surfaces of said film.

Claim 12

The assembly of claim 6 wherein the said gel is comprised of a material deposited in an uncured state on each side surface of the said film.

Claim 13

The assembly of claim 6 wherein the said contact gel is characterized as having been deposited by silkscreening, stenciling or the like.