Actively cooled effusion cell for chemical vapor deposition

Claim 1

A vapor deposition reactor, said vapor deposition reactor comprising: a reaction chamber, said reaction chamber having walls thereabout to confine reactants therein; means for inputting reactants and coolant into said reaction chamber; means for venting reactants from said reaction chamber; means for transporting at least one substrate about said reaction chamber for the purpose of deposition of reactants on said at least one substrate; at least one effuser, said effuser being in close proximity to said substrate for depositing said reactants thereon in a laminar flow condition preventing recirculation of spent reactants, said effuser including means for cooling an output side being in close proximity to said substrate, heat from said substrate in close proximity to said effuser being removed from said output side to prevent pre-action of reactants to be deposited; and at least one means for heating said substrate selectively in an area to receive deposition, said at least one means for heating being positioned before an effuser, the area of said substrate only being heated immediately adjacent to said effuser whereby heat is only applied to the area, a remaining area of said substrate not being heated by said means for heating.