Patent US5128281A successfully refreshed from Google Patents.
US5128281A
Expired / Lapsed
US
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Method for polishing semiconductor wafer edges
Assignee: Texas Instruments Inc
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Filing: 1991-06-05
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Granted: 1992-07-07
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Expires: 2011-06-05
Abstract
Abstract A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.
Inventors
- 👤 Lawrence D. Dyer
- 👤 Anthony E. Stephens
- 👤 Frank Allen
- 👤 Keith M. Easton
- 👤 James A. Kennon
- 👤 Jerry B. Medders
- 👤 Frederick O. Meyer, III
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 15:07
CPC Classifications
B; B24; B24B; B24B9/00; B24B9/02; B24B9/06; B24B9/065
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
66 words
A method of polishing edges of a plurality of semiconductor wafers and providing a tapered, polished edge, comprising the steps of: securing a plurality of semiconductor wafers together with clamping plates having shafts mounted thereof, and spacers between adjacent wafers; rotating the wafers around said shafts; engaging the edges of the rotating wafers with a polishing pad; and applying a polishing slurry to the polishing pad.
Claim 2
Independent Claim
66 words
A method of polishing edges of a plurality of semiconductor wafers and providing a tapered, polished edge, comprising the steps of: securing a plurality of semiconductor wafers together with clamping plates having shafts mounted thereof, and spacers between adjacent wafers; rotating the wafers around said shafts; engaging the edges of the rotating wafers with a polishing pad; and applying a polishing slurry to the polishing pad.
Claim 3
Dependent Claim
28 words
The method according to claim 1, including rotating the wafers around said shafts such that the edges of the wafers are rotated through grooves in the polishing pad.
Claim 4
Dependent Claim
17 words
The method according to claim 1, including maintaining the pH of the slurry between 9 and 14.
Claim 5
Dependent Claim
24 words
The method according to claim 1, including the step of rotating the polishing pad in a direction opposite to the rotation of said wafers.
Claim 6
Dependent Claim
18 words
The method according to claim 1 including the step of heating the wafers with heated air during polishing.
Claim 7
Dependent Claim
15 words
The method according to claim 1, wherein the slurry is of hydrated silica gel particles.
Claim 8
Dependent Claim
24 words
The method according to claim 1, wherein the slurry is heated to approximately 50 degrees centigrade and polishing is accomplished in approximately 20 minutes.
References Cited (Backward Citations)
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US4793102A
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Cited
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-07-07 | 1996-01-06 | 1996-07-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-07 | 2000-01-06 | 2000-07-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-07 | 2004-01-06 | 2004-07-07 | $7700.00 | Window Closed / Lapsed |