US5128231A
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Negative photoresist composition comprising a photosensitizer of a polyhalogen compound
Assignee: Oki Electric Industry Co Ltd
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Filing: 1991-11-29
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Granted: 1992-07-07
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Expires: 2011-11-29
Abstract
Abstract A photoresist composition is disclosed. The photoresist composition comprises a base resin, a photosensitizer, and a solvent. The base resin comprises polyhydroxystyrene represented by the following structural formula (I): <IMAGE> (I) (wherein k is a positive integer). The photosensitizer comprises a polyhalogen compound(s). The photoresist composition of the present invention has dry etching resistance characteristics comparable to those of conventional positive novolak photoresist compositions and can form a resist pattern with a high resolution and vertical sidewall profiles. This makes microprocessing possible.
Inventors
- 👤 Toshio Itoh
- 👤 Miwa Sakata
- 👤 Yoshio Yamashita
- 👤 Takateru Asano
- 👤 Yuuzi Kosuga
- 👤 Hiroshi Umehara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 05:23
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/004; G03F7/038; Y; Y10; Y10S; Y10S430/00; Y10S430/1053; Y10S430/1055; Y10S430/106; Y10S430/114; Y10S430/12; Y10S430/124; Y10S430/126; Y10S430/146
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
42 words
A negative photoresist composition consisting essentially of: a base resin, a photosensitizer, and a solvent; said base resin comprising a polyhydroxystyrene represented by the following structural formula (I): ##STR16## wherein k is a positive integer; and said photosensitizer comprising a polyhalogen compound(s).
Claim 2
Dependent Claim
42 words
A negative photoresist composition consisting essentially of: a base resin, a photosensitizer, and a solvent; said base resin comprising a polyhydroxystyrene represented by the following structural formula (I): ##STR16## wherein k is a positive integer; and said photosensitizer comprising a polyhalogen compound(s).
Claim 3
Dependent Claim
22 words
A negative photoresist composition as claimed in claim 1, wherein said base resin has a weight-average molecular weight of 1,000 to 100,000.
Claim 4
Dependent Claim
32 words
A negative photoresist composition as claimed in claim 1, wherein said photosensitizer is sensitive to at least one member selected from the group consisting of deep ultraviolet radiation, X-rays, and electron beams.
Claim 5
Dependent Claim
88 words
A negative photoresist composition as claimed in claim 1, wherein said photosensitizer comprises at least one polyhalogen compound selected from the group consisting of dichloroalkanes and trichloroalkanes represented by the following general formula (II): R.sup.1 --CH.sub.3-l Cl.sub.l (II) wherein R 1 stands for an alkyl group; and l is 2 or 3, and polybromoalkanes and polyiodoalkanes represented by the following general formula (III): C.sub.m H.sub.2m+2-n X.sup.1.sub.n (III) wherein X 1 stands for bromine or iodine; and m and n are integers, provided that they satisfy the formula: 1≦n≦2m+2.
Claim 6
Dependent Claim
166 words
A negative photoresist composition as claimed in claim 1, wherein said photosensitizer comprises at least one polyhalogen compound selected from the group consisting of α-haloester compounds, α-halocarboxylic acid compounds, α-haloketone compounds, α-haloaldehyde compounds, α-haloamide compounds, N-alkylhaloamide compounds, and N,N-dialkylhaloamide compounds all represented by the following general formula (IV): ##STR17## wherein X 2 stands for chlorine, bromine, or iodine; p is an integer of 1 to 3; and Y stands for an alkoxyl group (--OR 1 ) in the case of said α-haloester compounds, for a hydroxyl group (--OH) in the case of said α-halocarboxylic acids, for an alkyl or aryl group (--R 2 ) in the case of the α-haloketone compounds, for hydrogen in the case of said α-haloaldehyde compounds, for an amino group (--NH 2 ) in the case of said α-haloamide compounds, for a primary amine residue (--NHR 1 ) in the case of said N-alkylhaloamide compounds, or for a secondary amine residue (--N 2 R 1 ) in the case of N,N-dialkylhaloamide compounds.
Claim 7
Dependent Claim
87 words
A negative photoresist composition as claimed in claim 1, herein said photosensitizer comprises at least one polyhalogen compound selected from the group consisting of compounds represented by the following general formula (V): Ar--CH.sub.3-p X.sup.2.sub.p).sub.q (V) wherein p is an integer of 1 to 3; q is an integer of 1 or more; x 2 stands for chlorine, bromine, or iodine; and Ar stands for a phenyl group, a naphthyl group, a benzen sulfonyl group, an aminopyridine residue, an s-triazine residue, a furan residue, or a thiophene residue.
Claim 8
Dependent Claim
47 words
A negative photoresist composition as claimed in claim 1, wherein the content of said polyhalogen compound(s) as said photosensitizer based on the total amount of said polyhalogen compound(s) and said polyhydroxystyrene as said base resin is in the range of 1 mol % to 50 mol %.
Claim 9
Dependent Claim
32 words
A negative photoresist composition as claimed in claim 1, wherein said solvent is at least one compound selected from the group consisting of an ester of acetic acid, ethers, lactones, and amides.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1995-07-07 | 1996-01-06 | 1996-07-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-07-07 | 2000-01-06 | 2000-07-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-07-07 | 2004-01-06 | 2004-07-07 | $7700.00 | Window Closed / Lapsed |