Patent US1894173A successfully refreshed from Google Patents.
US5126571A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor manufacturing apparatus
Assignee: Individual
•
Filing: 1990-12-14
•
Granted: 1992-06-30
•
Expires: 2010-12-14
Abstract
Abstract A semiconductor manufacturing apparatus for manufacturing a semiconductor device by treating a semiconductor wafer, comprising a vacuum implanting room, a wafer holder for installing the semiconductor wafer in the implanting room, nozzles provided in the wafer holder for evaporating a liquid refrigerant, and a compressor for supplying the liquid refrigerant to the nozzles through wall of the implanting room. As the refrigerant is compressed into the nozzles in a liquid state and evaporated in the vacuum implanting room, the semiconductor manufacturing apparatus is neither frozen nor frosted by the moisture in the ambient air.
Inventors
- 👤 Katsuhiko Sakai
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 05:55
CPC Classifications
H; H10; H10P; H10P95/00; H10P72/00; H10P72/04; H10P72/0431; H10P72/0432; H01; H01J; H01J37/00; H01J37/30; H01J37/317; H01J37/3171; H01J2237/00; H01J2237/20; H01J2237/2001
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
149 words
A semiconductor manufacturing apparatus for manufacturing a semiconductor device by treating at least one semiconductor wafer, the apparatus comprising: an implanting room for implanting an ion beam to the semiconductor wafer, said implanting room being exhausted by an exhauster, a wafer holder means disposed in the implanting room and having a hollow portion therein for accommodating the at least one semiconductor wafer in the implanting room, a nozzle means connected to the wafer holder means for discharging a liquid refrigerant into the hollow portion so as to evaporate the liquid refrigerant, a first pipe means for supplying the liquid refrigerant to the nozzle means, a second pipe means for exhausting the evaporated refrigerant out of the implanting room, and a compressor means disposed outside of the implanting room for compressing the liquid refrigerant in the first pipe means so as to discharge the liquid refrigerant from the nozzle means.
Claim 2
Dependent Claim
149 words
A semiconductor manufacturing apparatus for manufacturing a semiconductor device by treating at least one semiconductor wafer, the apparatus comprising: an implanting room for implanting an ion beam to the semiconductor wafer, said implanting room being exhausted by an exhauster, a wafer holder means disposed in the implanting room and having a hollow portion therein for accommodating the at least one semiconductor wafer in the implanting room, a nozzle means connected to the wafer holder means for discharging a liquid refrigerant into the hollow portion so as to evaporate the liquid refrigerant, a first pipe means for supplying the liquid refrigerant to the nozzle means, a second pipe means for exhausting the evaporated refrigerant out of the implanting room, and a compressor means disposed outside of the implanting room for compressing the liquid refrigerant in the first pipe means so as to discharge the liquid refrigerant from the nozzle means.
Claim 3
Dependent Claim
24 words
A semiconductor manufacturing apparatus as defined in claim 1, further comprising: a heat exchanger means for cooling the liquid refrigerant from the compressor means.
Claim 4
Dependent Claim
56 words
A semiconductor manufacturing apparatus as defined in claim 1, wherein said compressor means controls a volume of the liquid refrigerant supplied to the nozzle means by detecting a temperature of the wafer holder means so as to adjust the temperature of the wafer holder means so as to adjust the temperature of the wafer holder means.
Claim 5
Dependent Claim
22 words
A semiconductor manufacturing apparatus as defined in claim 1, wherein said first pipe means is disposed inside of said second pipe means.
Claim 6
Dependent Claim
37 words
A semiconductor manufacturing apparatus as defined in claim 1, wherein said wafer holder means is shaped as a circular plate, and wherein the at least one semiconductor wafer is accommodated at a circumference of the circular plate.
Claim 7
Dependent Claim
19 words
A semiconductor manufacturing apparatus as defined in claim 5, wherein said wafer holder means turns around said nozzle means.
Claim 8
Dependent Claim
25 words
A semiconductor manufacturing apparatus as defined in claim 5, wherein a plurality of said nozzle means are arranged along the circumference of the circular plate.
Claim 9
Dependent Claim
20 words
A semiconductor manufacturing apparatus as defined in claim 5, further comprising: a motor means for rotating said wafer holder means.
Claim 10
Dependent Claim
32 words
A semiconductor manufacturing apparatus as defined in claim 1, further comprising: a plurality of fins provided in said wafer holder means, said fins being cooled by evaporated refrigerant from said nozzle means.
Claim 11
Dependent Claim
28 words
A semiconductor manufacturing apparatus as defined in claim 1, further comprising: a heat exchanger arranged in the implanting room and connected to the first and second pipe means.
Claim 12
Dependent Claim
22 words
A semiconductor manufacturing apparatus as defined in claim 1, wherein said compressor means liquifies the refrigerant exhausted from the second pipe means.
References Cited (Backward Citations)
JPS5372297A
Cited
US4453080A
Cited
US4599516A
Cited
US4458746A
Cited
US4537244A
Cited
US4806769A
Cited
JPS6313442A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-06-30 | 1995-12-30 | 1996-06-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-06-30 | 1999-12-30 | 2000-06-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-06-30 | 2003-12-30 | 2004-06-30 | $7700.00 | Window Closed / Lapsed |