US4806769A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Disk exchangeable target mechanism with effective cooling means, for ion implantation system
Assignee: Fujitsu Ltd
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Filing: 1987-05-19
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Granted: 1989-02-21
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Expires: 2007-05-19
Abstract
Abstract An improved disk exchangeable target mechanism for an ion implantation system includes an effective cooling means for preventing thermal damage to a resist and for improving an implantation quality of semiconductor wafers. The target mechanism includes a metal disk on which a semiconductor wafer(s) to be ion-implanted are mounted on a first face thereof, a support including a metal base having the target disk mounted thereon, and a shaft incorporated with the base, and a medium, provided between a second face of the target disk opposite to the first face and the base, for thermally contact therebetween. Preferably, the base of the support is provided with a cavity and the shaft is provided with holes communicating with the cavity, whereby a cooling medium is inserted into the cavity through one hole and is drained from the cavity through another hole. Furthermore, preferably, the target disk is provided with a thermal transportation unit, such as heat pipes, for transporting thermal energy from a portion(s) at which a high temperature is caused by ion implantation energy, to another portion(s) at which the temperature is low.
Inventors
- 👤 Haruhisa Mori
- 👤 Motoo Nakano
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 20:01
CPC Classifications
H; H01; H01J; H01J37/00; H01J37/30; H01J37/317; H01J37/3171
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
154 words
A disk exchangeable target mechanism of an ion implantation system including an exposure chamber into which the disk exchangeable target mechanism is inserted and in which accelerated ion beams are directed onto semiconductor wafers mounted on the disk exchangeable target mechanism, comprising: a metal target disk on which a semiconductor wafer(s) to be ion-implanted is mounted on a first face thereof; a support including a metal base upon which said target disk is mounted, and a shaft incorporated with said base, said support being rotatable in said exposure chamber by a force applied to said shaft during an ion-implantation process, said target disk being detachable from said support when taken out of said exposure chamber, and said metal base being provided with a cavity through which a coolant is passed; and means, provided between a second face of said target disk opposite to said first face and said base, for providing thermal contact therebetween.
Claim 2
Dependent Claim
154 words
A disk exchangeable target mechanism of an ion implantation system including an exposure chamber into which the disk exchangeable target mechanism is inserted and in which accelerated ion beams are directed onto semiconductor wafers mounted on the disk exchangeable target mechanism, comprising: a metal target disk on which a semiconductor wafer(s) to be ion-implanted is mounted on a first face thereof; a support including a metal base upon which said target disk is mounted, and a shaft incorporated with said base, said support being rotatable in said exposure chamber by a force applied to said shaft during an ion-implantation process, said target disk being detachable from said support when taken out of said exposure chamber, and said metal base being provided with a cavity through which a coolant is passed; and means, provided between a second face of said target disk opposite to said first face and said base, for providing thermal contact therebetween.
Claim 3
Dependent Claim
20 words
A disk exchangeable target mechanism according to claim 1, wherein said thermal contacting means maintains uniform thermal contact with metal.
Claim 4
Dependent Claim
19 words
A disk exchangeable target mechanism according to claim 2, wherein said thermal contacting means has a high thermal conductivity.
Claim 5
Dependent Claim
19 words
A disk exchangeable target mechanism according to claim 3, wherein said thermal contacting means is stable in a vacuum.
Claim 6
Dependent Claim
19 words
A disk exchangeable target mechanism according to claim 4, wherein said thermal contacting means comprises a silicon rubber sheet.
Claim 7
Dependent Claim
18 words
A disk exchangeable target mechanism according to claim 4, wherein said thermal contacting means comprises a polyfloraethylene film.
Claim 8
Dependent Claim
51 words
A disk exchangeable target mechanism according to claim 1, wherein said shaft is provided with first and second holes communicating with said cavity, and wherein a cooling medium is inserted into said cavity through the first hole and the inserted cooling medium is drained from said cavity through the second hole.
Claim 9
Dependent Claim
18 words
A disk exchangeable target mechanism according to claim 7, wherein said cooling medium in said holes comprises water.
Claim 10
Dependent Claim
48 words
A disk exchangeable target mechanism according to claim 1, wherein said target disk is provided with thermal transportation means for transporting thermal energy from a first portion(s) at which a high temperature is caused by ion implantation energy to a second portion(s) at which a temperature is low.
Claim 11
Dependent Claim
17 words
A disk exchangeable target mechanism according to claim 9, wherein said thermal transportation means comprises heat pipes.
Claim 12
Dependent Claim
22 words
A disk exchangeable target mechanism according to claim 10, wherein said heat pipe contain a cooling medium having a low boiling temperature.
Claim 13
Dependent Claim
26 words
A disk exchangeable target mechanism according to claim 11, wherein said heat pipes are provided radially with respect to a rotation center of said target disk.
Claim 14
Dependent Claim
17 words
A disk exchangeable target mechanism according to claim 12, wherein said cooling medium is a hydrocarbon fluoride.
Claim 15
Dependent Claim
15 words
A disk exchangeable target mechanism according to claim 12, wherein said cooling medium is ethanol.
Claim 16
Dependent Claim
48 words
A disk exchangeable target mechanism according to claim 7, wherein said target disk is provided with thermal transportation means for transporting thermal energy at a first portion(s) at which a high temperature is caused by ion implantation energy to a second portion(s) at which the temperature is low.
Claim 17
Dependent Claim
18 words
A disk exchangeable target mechanism according to claim 15, wherein said thermal transportation means comprises a heat pipe(s).
Claim 18
Dependent Claim
179 words
A disk exchangeable target mechanism for an ion implantation system, the ion implantation system including an exposure chamber into which the disk exchangeable target mechanism is inserted and in which accelerated ion beams are directed onto semiconductor wafers mounted on the disk exchangeable target mechanism, said disk exchangeable target mechanism comprising: a rotatable support including a disk-shaped metal base having a coolant fluid cavity therein, and a shaft extending axially through the center of the base; a metal target disk, on which semiconductor wafers to be ion implanted are mounted on a first face thereof, including a central opening and quick release mounting means, said target disk being detachably mounted with said quick release mounting means on said support, the central opening cooperating with the shaft of said support and a first face of said support adjoining a second face of said metal target disk; and thermal contact means, provided between the second face of said metal target disk and the first face of said support, for providing good thermal conductivity between said metal target disk and said support.
Claim 19
Dependent Claim
179 words
A disk exchangeable target mechanism for an ion implantation system, the ion implantation system including an exposure chamber into which the disk exchangeable target mechanism is inserted and in which accelerated ion beams are directed onto semiconductor wafers mounted on the disk exchangeable target mechanism, said disk exchangeable target mechanism comprising: a rotatable support including a disk-shaped metal base having a coolant fluid cavity therein, and a shaft extending axially through the center of the base; a metal target disk, on which semiconductor wafers to be ion implanted are mounted on a first face thereof, including a central opening and quick release mounting means, said target disk being detachably mounted with said quick release mounting means on said support, the central opening cooperating with the shaft of said support and a first face of said support adjoining a second face of said metal target disk; and thermal contact means, provided between the second face of said metal target disk and the first face of said support, for providing good thermal conductivity between said metal target disk and said support.
Claim 20
Dependent Claim
52 words
A disk exchangeable target mechanism according to claim 17, wherein said metal target disk further includes fluid filled heat pipes formed therein, said heat pipes being sealed and independent of each other, said heat pipes transferring thermal energy from high temperature portions of said metal target disk to low temperature portions thereof.
Claim 21
Dependent Claim
35 words
A disk exchangeable target mechanism according to claim 18, wherein said heat pipes are arranged radially with respect a rotational center of said target disk and contain a cooling medium having a low boiling temperature.
Claim 22
Dependent Claim
39 words
A disk exchangeable target mechanism according to claim 17, wherein said shaft is provided with central openings which communicate with the cooling fluid cavity in said base and supply and drain a cooling medium to and from the cavity
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1992-02-21 | 1992-08-22 | 1993-02-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1996-02-21 | 1996-08-22 | 1997-02-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2000-02-21 | 2000-08-22 | 2001-02-21 | $7700.00 | Window Closed / Lapsed |