Computer signal interconnect apparatus

Claim 1

A logic assembly, comprising: (a) a high density logic board with a plurality of high density electrical transmission lines thereon, the logic board providing an electrical contact point for the transmission lines; (b) a low density interconnect board with a plurality of low density electrical transmission lines thereon, the interconnect board providing an electrical contact point for the transmission lines; (c) an assembly pressure connector positioned between the logic board and the interconnect board comprising: (i) a connector housing with a top layer, middle layer, and bottom layer, the three layers having a plurality of substantially aligned holes; (ii) a plurality of substantially straight interconnecting wires extending through the plurality of substantially aligned holes, at least one end of each of the wires protruding from the connector housing forming a plurality of electrical contact bumps on the outer surface of the top and bottom layers; (iii) means for shifting the middle layer between a first and a second position, in the first position the middle layer being shifted causing misalignment of the plurality of holes in the middle layer with the plurality of holes on the top and bottom layers, the substantially straight interconnect wires being bent and compressed within their elastic range so as to retain their resiliency, in the second position shifting the middle layer to bring the plurality of holes in the middle layer back into substantial alignment with the plurality of holes in the top and bottom layers allowing the bent and compressed interconnect wires to return to their substantially straight condition, the resiliency of the interconnect wires providing a pressure to force the electrical contact bumps against the contact points on both the logic board and interconnect board; and (d) means for maintaining a constant pressure against the interconnect board, the connector, and the logic board, thereby bringing into electrical contact the electrical contact bumps on the bottom surface of the connector housing with the contact points on the logic board, and also bringing into electrical contact the electrical contact bumps on the top surface of the connector housing with the contact points on the interconnect board.

Claim 5

A method for electrically connecting a high density logic board with a low density interconnect board, the logic board having a plurality of high density electrical transmission lines thereon, the logic board providing an electrical contact point for the transmission lines, the low density interconnect board having a plurality of low density electrical transmission lines thereon, the interconnect board providing an electrical contact point for the transmission lines, the method of comprising the steps of: (a) providing an assembly pressure connector with a connector housing, the connector housing having a top layer, middle layer, and bottom layer, the three layers having a plurality of substantially aligned holes and having a plurality of substantially straight interconnecting wires in the plurality of substantially aligned holes; (b) arranging at least one end each of the substantially straight interconnecting wires to protrude from the connector housing forming a plurality of electrical contact bumps on the outer surface of the top and bottom layers; (c) shifting the middle layer to a first position causing misalignment of the plurality of holes in the middle layer with the plurality of holes on the top and bottom layers, the substantially straight interconnect wires being bent and compressed within their elastic range so as to retain their resiliency; (d) inserting the assembly pressure connector between the logic board and interconnect board; and (e) shifting the middle layer to a second position to bring the plurality of holes in the middle layer back into substantial alignment with the plurality of holes in the top and bottom layers, releasing the bent and compressed interconnect wires to return to their substantially straight condition, the resiliency of the interconnect wires providing the pressure to force the electrical contact bumps against the contact points on both the logic board and interconnect board.

Claim 6

A method for electrically connecting a high density logic board with a low density interconnect board, the logic board having a plurality of high density electrical transmission lines thereon, the logic board providing an electrical contact point for the transmission lines, the low density interconnect board having a plurality of low density electrical transmission lines thereon, the interconnect board providing an electrical contact point for the transmission lines, the method of comprising the steps of: (a) providing an assembly pressure connector with a connector housing, the connector housing having a top layer, middle layer, and bottom layer, the three layers having a plurality of substantially aligned holes and having a plurality of substantially straight interconnecting wires in the plurality of substantially aligned holes; (b) arranging at least one end each of the substantially straight interconnecting wires to protrude from the connector housing forming a plurality of electrical contact bumps on the outer surface of the top and bottom layers; (c) shifting the middle layer to a first position causing misalignment of the plurality of holes in the middle layer with the plurality of holes on the top and bottom layers, the substantially straight interconnect wires being bent and compressed within their elastic range so as to retain their resiliency; (d) inserting the assembly pressure connector between the logic board and interconnect board; and (e) shifting the middle layer to a second position to bring the plurality of holes in the middle layer back into substantial alignment with the plurality of holes in the top and bottom layers, releasing the bent and compressed interconnect wires to return to their substantially straight condition, the resiliency of the interconnect wires providing the pressure to force the electrical contact bumps against the contact points on both the logic board and interconnect board.