Forming a pattern on a substrate

Claim 2

A process for forming a metallic pattern on a substrate for the fabrication of thin film structures for multichip packaging which comprises: a. providing on a substrate a dielectric layer; b. defining desired pattern of circuit channels in said dielectric layer; c. depositing metal onto the dielectric layer and in the circuit channels; and then d. micromachining the metal to thereby remove metal from above the dielectric while leaving metal deposited in the circuit channels to thereby provide said metallic pattern on said substrate; wherein said micromachining is single crystal diamond cutting to provide planar metallic pattern in which the flatness is within 1 micron over 1 meter length and the average roughness of the metallic pattern is 0.02 to 0.005 micron.

Claim 3

The process of claim 1 wherein said dielectric layer is a photosensitive polyimide precursor layer.

Claim 4

The process of claim 1 wherein said dielectric layer is a photosensitive epoxy polymer layer.

Claim 5

The process of claim 1 wherein the circuit channels are defined by imagewise exposing the dielectric to actinic light; then developing thereby providing the circuit channels.

Claim 6

The process of claim 4 wherein the dielectric remaining after the developing is cured.

Claim 7

The process of claim 1 wherein the metal includes copper.

Claim 8

The process of claim 1 wherein the circuit channels are at least 10 microns thick.

Claim 9

The process of claim 1 wherein said dielectric layer is a non-photosensitive polyimide precursor layer.

Claim 10

The process of claim 8 wherein the circuit channels are defined by depositing a photosensitive layer on said dielectric layer, imagewise exposing the photosensitive layer to actinic light, developing the photosensitive layer to provide a mask of the desired pattern of circuit channels, and then defining the desired pattern of circuit channels in the dielectric layer using the developed photosensitive layer as the mask.

Claim 11

The process of claim 9 which further includes providing a metal layer intermediate said photosensitive layer and said dielectric, etching said metal layer using the developed photoresist as a mask and then defining the desired pattern of circuit channels in the dielectric layer using both the developed photosensitive layer and etched metal layer as the mask.

Claim 12

The process of claim 1 wherein the metal includes copper.

Claim 13

The process of claim 8 wherein the circuit channels are defined in the dielectric layer by an ablation technique.

Claim 14

The process of claim 12 wherein said ablation technique is reactive ion etching.

Claim 15

The process of claim 13 wherein a layer resistant to reactive ion etching is provided on the dielectric layer over those areas where a circuit pattern is not desired.

Claim 16

The process of claim 14 wherein said layer resistant reactive ion etching is a metal or metal oxide.

Claim 17

The process of claim 1 wherein the circuit channels are at least 10 microns thick.

Claim 18

The process of claim 1 wherein said metallic pattern is about 1 to about 50 microns thick.

Claim 19

The process of claim 1 wherein said metallic pattern is about 5 to about 25 microns thick.

Claim 20

A process for forming a metallic pattern on a substrate for the fabrication of thin film structure for multichip packaging which comprises: a. providing on a substrate a photosensitive layer; b. defining desired pattern of circuit channels in said photosensitive layer; c. depositing metal onto the photosensitive layer and in the circuit channels; d. micromachining the metal to thereby remove metal from above the photosensitive layer while leaving metal deposited in the circuit channels defined by the photosensitive layer; e. removing the remaining photosensitive layer; f. depositing a dielectric layer onto the metal and over the substrate; g. micromachining the dielectric layer down to the level of the metal to remove the dielectric from above the metal while leaving dielectric in the spaces between the metal; wherein said micromachining in steps d. and g. is single crystal diamond cutting to provide planar metallic pattern in which the flatness is within 1 micron over 1 meter length and the average roughness of the metallic pattern is 0.02 to 0.005 micron.

Claim 21

A process for forming a metallic pattern on a substrate for the fabrication of thin film structure for multichip packaging which comprises: a. providing on a substrate a photosensitive layer; b. defining desired pattern of circuit channels in said photosensitive layer; c. depositing metal onto the photosensitive layer and in the circuit channels; d. micromachining the metal to thereby remove metal from above the photosensitive layer while leaving metal deposited in the circuit channels defined by the photosensitive layer; e. removing the remaining photosensitive layer; f. depositing a dielectric layer onto the metal and over the substrate; g. micromachining the dielectric layer down to the level of the metal to remove the dielectric from above the metal while leaving dielectric in the spaces between the metal; wherein said micromachining in steps d. and g. is single crystal diamond cutting to provide planar metallic pattern in which the flatness is within 1 micron over 1 meter length and the average roughness of the metallic pattern is 0.02 to 0.005 micron.

Claim 22

The process of claim 19 wherein said dielectric layer is a polyimide precursor layer.

Claim 23

The process of claim 19 wherein the metal includes copper.

Claim 24

The process of claim 19 wherein the circuit channels are at least 10 microns thick.

Claim 25

The process of claim 19 wherein said metallic pattern is about 1 to about 50 microns thick.

Claim 26

The process of claim 19 wherein said metallic pattern is about 5 to about 25 microns thick.