Method of manufacturing multilayer circuit board

Claim 1

A method of manufacturing a multilayer circuit board comprising the steps of: providing a substrate, forming a plurality of portions of a first thick film conductor layer on said substrate with a predetermined pattern, forming a thick film resistor to be connected to the portions of said first conductor layer by forming and firing a thick film, forming an insulating layer of a photosensitive polyimide resin over said first conductor layer and said resistor, providing through holes in said insulating layer by applying patterning thereto with a mask so that said first conductor layer may be partially exposed, forming a second conductor layer on said insulating layer by applying plating onto said insulating layer and by etching said plated layer with a predetermined pattern, wherein said step of forming said second conductor layer further comprises the steps of: forming a first plating layer on the whole surface of said sbustrate by applying electroless plating, said first plating layer being in contact with portions of the first conductor layer, forming a second plating layer on the whole surface of said first plating layer by applying electroplating, and etching said first plated layer and said second plated layer with a predetermined pattern.

Claim 2

A method of manufacturing a multilayer circuit board comprising the steps of: providing a substrate, forming a plurality of portions of a first thick film conductor layer on said substrate with a predetermined pattern, forming a thick film resistor to be connected to the portions of said first conductor layer by forming and firing a thick film, forming an insulating layer of a photosensitive polyimide resin over said first conductor layer and said resistor, providing through holes in said insulating layer by applying patterning thereto with a mask so that said first conductor layer may be partially exposed, forming a second conductor layer on said insulating layer by applying plating onto said insulating layer and by etching said plated layer with a predetermined pattern, wherein said step of forming said second conductor layer further comprises the steps of: forming a first plating layer on the whole surface of said sbustrate by applying electroless plating, said first plating layer being in contact with portions of the first conductor layer, forming a second plating layer on the whole surface of said first plating layer by applying electroplating, and etching said first plated layer and said second plated layer with a predetermined pattern.