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US5114556A Expired / Lapsed US ⏱️ 0.0 years remaining

Deposition apparatus and method for enhancing step coverage and planarization on semiconductor wafers

Assignee: Machine Technology Inc
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Filing: 1989-12-27
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Granted: 1992-05-19
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Expires: 2009-12-27
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Abstract

Abstract A layer of a substance such as a metal, non-metal or metal alloy is deposited, preferably by sputtering, onto the surface of a substrate such as a semiconductor wafer. The adatoms of the deposited layer are mobilized by being bombarded with a flux of low energy neutral atoms or molecules at an oblique angle of incidence to enhance step coverage and/or planarization of the semiconductor wafer. The neutral atoms or molecules are formed within the plasma by applying a negative bias potential to a reflector electrode which will attract positive ions from the plasma. The neutral atoms or molecules elastically scatter from the surface of the electrode to bombard the adatoms being deposited during the operation of the sputter source.

Inventors

  • 👤 Lawrence T. Lamont, Jr.

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 20:00
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/225; C23C14/34; C23C14/35; C23C14/352; H; H01; H01J; H01J37/00; H01J37/32; H01J37/32009; H01J37/32321; H01J37/32431; H01J37/32623; H10; H10P; H10P14/00; H10P14/40; H10P14/412; H10P14/60; H10P14/63; H10P14/6326; H10P14/6328; H10P14/6329; H10P14/69; H10P14/692; H10P14/6921; H10P14/69215; H10P14/6938; H10P14/6939; H10P14/69391; H10P14/694; H10P14/6943; H10P14/69433; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056

Claims Analysis

Total Claims: 34
Claim 1
Independent Claim 229 words
Apparatus for depositing a layer of a substance on a surface of a substrate, said apparatus comprising means for holding said substrate, depositing means for depositing said substance in the presence of a plasma from a gaseous phase onto said surface of said substrate to form a layer of said substance thereon, creating means for creating neutral atoms or molecules from a portion of said gaseous phase independent of said separate from said depositing means, said creating means comprising an electrode having a reflecting surface for reflecting said neutral atoms or molecules at an angle to the surface of said substrate to mobilize said substance deposited thereon by collision with said neutral atoms or molecules, first means for controlling the operation of said depositing means, and second means for controlling the operation of said creating means, said second means operable for controlling the creation and energy level of said neutral atoms or molecules independently from the depositing of said substance by operation of said first means, said second means controlling said creating means whereby ions from said plasma which form said neutral atoms or molecules have an energy level deficient for effecting sputtering of said electrode, said neutral atoms or molecules having an energy level sufficient to effect mobilization of said layer of said substance while an energy level deficient for effective resputtering of said substance from said substrate.
Claim 2
Dependent Claim 229 words
Apparatus for depositing a layer of a substance on a surface of a substrate, said apparatus comprising means for holding said substrate, depositing means for depositing said substance in the presence of a plasma from a gaseous phase onto said surface of said substrate to form a layer of said substance thereon, creating means for creating neutral atoms or molecules from a portion of said gaseous phase independent of said separate from said depositing means, said creating means comprising an electrode having a reflecting surface for reflecting said neutral atoms or molecules at an angle to the surface of said substrate to mobilize said substance deposited thereon by collision with said neutral atoms or molecules, first means for controlling the operation of said depositing means, and second means for controlling the operation of said creating means, said second means operable for controlling the creation and energy level of said neutral atoms or molecules independently from the depositing of said substance by operation of said first means, said second means controlling said creating means whereby ions from said plasma which form said neutral atoms or molecules have an energy level deficient for effecting sputtering of said electrode, said neutral atoms or molecules having an energy level sufficient to effect mobilization of said layer of said substance while an energy level deficient for effective resputtering of said substance from said substrate.
Claim 3
Dependent Claim 16 words
The apparatus as set forth in claim 1, wherein said depositing means comprises a sputter source.
Claim 4
Dependent Claim 18 words
The apparatus as set forth in claim 1, wherein said portion of said gaseous phase comprise a plasma.
Claim 5
Dependent Claim 26 words
The apparatus as set forth in claim 1, wherein said substance has an atomic mass greater than the atomic mass of said neutral atoms or molecules.
Claim 6
Dependent Claim 33 words
The apparatus as set forth in claim 1, wherein said reflecting surface is arranged such that said neutral atoms or molecules are reflected at an oblique angle to the surface of said substrate.
Claim 7
Dependent Claim 28 words
The apparatus as set forth in claim 1, wherein said creating means is in the shape of an annular ring arranged between said substrate and said depositing means.
Claim 8
Dependent Claim 18 words
The apparatus as set forth in claim 6, wherein said annular ring comprises a plurality of annular segments.
Claim 9
Dependent Claim 15 words
The apparatus as set forth in claim 1, wherein said substrate comprises a semiconductor wafer.
Claim 10
Dependent Claim 34 words
The apparatus as set forth in claim 1, further including magnetic means for creating a magnetic field in operative association with said creating means for increasing the flux of said neutral atoms or molecules.
Claim 11
Dependent Claim 16 words
The apparatus as set forth in claim 9, wherein said magnetic means comprises a magnetic source.
Claim 12
Dependent Claim 39 words
The apparatus as set forth in claim 1, wherein said reflecting surface is arranged such that said neutral atoms or molecules are reflected at an angle of from about 60° to 90 degrees to the surface of said substrate.
Claim 13
Dependent Claim 226 words
Apparatus for depositing a layer of substance on a surface of a substrate, said apparatus comprising means for holding said substrate, means for depositing said substance in the presence of a plasma from a gaseous phase into said surface to form a layer of said substance thereon, creating means comprising an electrode for creating neutral atoms or molecules from a portion of said gaseous phase independent of and separate from said depositing means, said neutral atoms or molecules being reflected from said electrode at an angle to the surface of said substrate in the range of about 60° to 90° degrees to mobilize said substance deposited thereon by collision with said neutral atoms or molecules, first means for controlling the operation of said depositing means, and second means for controlling the operation of said creating means, said second means operable for controlling the creation of said neutral atoms or molecules independently from the depositing of said substance by operation of said first means, said second means controlling said creating means whereby ions from said plasma which form said neutral atoms or molecules have an energy level deficient for effecting sputtering of said electrode, said neutral atoms or molecules having an energy level sufficient to effect mobilization of said layer of said substance while an energy level deficient for effective resputtering of said substance from said substrate.
Claim 14
Dependent Claim 226 words
Apparatus for depositing a layer of substance on a surface of a substrate, said apparatus comprising means for holding said substrate, means for depositing said substance in the presence of a plasma from a gaseous phase into said surface to form a layer of said substance thereon, creating means comprising an electrode for creating neutral atoms or molecules from a portion of said gaseous phase independent of and separate from said depositing means, said neutral atoms or molecules being reflected from said electrode at an angle to the surface of said substrate in the range of about 60° to 90° degrees to mobilize said substance deposited thereon by collision with said neutral atoms or molecules, first means for controlling the operation of said depositing means, and second means for controlling the operation of said creating means, said second means operable for controlling the creation of said neutral atoms or molecules independently from the depositing of said substance by operation of said first means, said second means controlling said creating means whereby ions from said plasma which form said neutral atoms or molecules have an energy level deficient for effecting sputtering of said electrode, said neutral atoms or molecules having an energy level sufficient to effect mobilization of said layer of said substance while an energy level deficient for effective resputtering of said substance from said substrate.
Claim 15
Dependent Claim 15 words
The apparatus as set forth in claim 12, wherein said means comprises a sputter source.
Claim 16
Dependent Claim 18 words
The apparatus as set forth in claim 12, wherein said portion of said gaseous phase comprises a plasma.
Claim 17
Dependent Claim 26 words
The apparatus as set forth in claim 12, wherein said substance has an atomic mass greater than the atomic mass of said neutral atoms or molecules.
Claim 18
Dependent Claim 34 words
The apparatus as set forth in claim 12 further including magnetic means for creating a magnetic field in operative association with said depositing means for increasing the flux of said neutral atoms or molecules
Claim 19
Dependent Claim 16 words
The apparatus as set forth in claim 16, wherein said magnetic means comprises a magnetic source.
Claim 20
Dependent Claim 15 words
The apparatus as set forth in claim 12, wherein said substrate comprises a semiconductor wafer.
Claim 21
Independent Claim 196 words
A method for depositing a layer of substance on a surface of a substrate, said method comprising providing a source of said substance to be deposited, depositing said substance originating from said source in the presence of a plasma from a gaseous phase onto said surface of said substrate to form a layer of said substance thereon, controlling the depositing of said substance originating from said source, creating neutral atoms or molecules from a portion of said gaseous phase from an electrode independent of and separate from said source of said substance, reflecting said neutral atoms or molecules from said electrode at an angle to the surface of said substrate, and controlling the creating and energy level of said neutral atoms or molecules from said electrode independent of controlling the deposition of said substance, said being such that ions from said plasma which form said neutral atoms or molecules have an energy level deficient for effective sputtering of said electrode, said neutral atoms or molecules having an energy level sufficient to mobilize said substance by collision with said neutral atoms or molecules while an energy level deficient for effective resputtering of said substance from said substrate.
Claim 22
Independent Claim 196 words
A method for depositing a layer of substance on a surface of a substrate, said method comprising providing a source of said substance to be deposited, depositing said substance originating from said source in the presence of a plasma from a gaseous phase onto said surface of said substrate to form a layer of said substance thereon, controlling the depositing of said substance originating from said source, creating neutral atoms or molecules from a portion of said gaseous phase from an electrode independent of and separate from said source of said substance, reflecting said neutral atoms or molecules from said electrode at an angle to the surface of said substrate, and controlling the creating and energy level of said neutral atoms or molecules from said electrode independent of controlling the deposition of said substance, said being such that ions from said plasma which form said neutral atoms or molecules have an energy level deficient for effective sputtering of said electrode, said neutral atoms or molecules having an energy level sufficient to mobilize said substance by collision with said neutral atoms or molecules while an energy level deficient for effective resputtering of said substance from said substrate.
Claim 23
Dependent Claim 13 words
The method as set forth in claim 19, wherein said depositing comprises sputtering.
Claim 24
Dependent Claim 15 words
The method as set forth in claim 19, wherein said gaseous phase comprise a plasma.
Claim 25
Dependent Claim 26 words
The method as set forth in claim 19, wherein said substance has an atomic mass greater than the atomic mass of said neutral atoms or molecules.
Claim 26
Dependent Claim 26 words
The method as set forth in claim 19, wherein said neutral atoms or molecules are reflected at an oblique angle to the surface of said substrate.
Claim 27
Dependent Claim 16 words
The method as set forth in claim 19, wherein said depositing, reflecting and creating occur concurrently.
Claim 28
Dependent Claim 22 words
The method as set forth in claim 19, wherein said depositing includes depositing said substance on a surface of a semiconductor wafer.
Claim 29
Dependent Claim 23 words
The method as set forth in claim 19, further including rotating said substrate about an axis normal to said surface of said substrate.
Claim 30
Dependent Claim 27 words
The method as set forth in claim 19, further including maintaining said surface of said substrate in a vertical orientation during said depositing of said substance thereon.
Claim 31
Dependent Claim 23 words
The method as set forth in claim 19, wherein said substance is selected from the group consisting of metals, non-metals and metal alloys.
Claim 32
Dependent Claim 27 words
The method as set forth in claim 19, wherein said neutral atoms or molecules are created from positively charged ions from said portion of said gaseous phase.
Claim 33
Dependent Claim 27 words
The method as set forth in claim 19, further including providing a magnetic field during said creating to increase the flux of said neutral atoms or molecules.
Claim 34
Dependent Claim 32 words
The method as set forth in claim 19, wherein said neutral atoms or molecules are reflected at an angle of from about 60° to 90 degrees to the surface of said substrate.

References Cited (Backward Citations)

US4604180A Cited
US4595482A Cited
US4627904A Cited
US4664935A Cited
US4717462A Cited
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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-05-19 1995-11-18 1996-05-19 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-05-19 1999-11-18 2000-05-19 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-05-19 2003-11-18 2004-05-19 $7700.00 Window Closed / Lapsed

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