US4664935A
Expired / Lapsed
US
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Thin film deposition apparatus and method
Assignee: ULTRATECH ACQUISITION SUB Inc
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Filing: 1985-09-24
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Granted: 1987-05-12
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Expires: 2005-09-24
Abstract
Abstract Apparatus and method for the deposition of a thin metal film on a surface of a workpiece as the workpiece is positioned adjacent to a deposition source and as the workpiece and deposition source rotate relative to each other about a first axis. The workpiece can also be moved relative to the deposition source about a second axis as the workpiece and the deposition source rotate relative to each other about the first axis. The distance between the workpiece and the deposition source can be adjusted.
Inventors
- 👤 Thomas L. Strahl
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-30 11:53
CPC Classifications
C; C23; C23C; C23C14/00; C23C14/22; C23C14/225; C23C14/04; C23C14/046; C23C14/34
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
143 words
Apparatus for applying a thin film by sputtering to a film-receiving surface of a workpiece comprising: means defining a process chamber; a deposition source in the process chamber at a first location therein, said deposition source having an emission surface disposed in a veritcal plane; sputtering means for sputtering film forming material from said emission surface; and means at a second location in the process chamber for mounting a workpiece having a film-receiving surface disposed in a vertical plane for rotation relative to the deposition source, the emission surface and said film-receiving surface being at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted by said mounting means.
Claim 2
Dependent Claim
143 words
Apparatus for applying a thin film by sputtering to a film-receiving surface of a workpiece comprising: means defining a process chamber; a deposition source in the process chamber at a first location therein, said deposition source having an emission surface disposed in a veritcal plane; sputtering means for sputtering film forming material from said emission surface; and means at a second location in the process chamber for mounting a workpiece having a film-receiving surface disposed in a vertical plane for rotation relative to the deposition source, the emission surface and said film-receiving surface being at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted by said mounting means.
Claim 3
Dependent Claim
14 words
Apparatus as set forth in claim 1, wherein the angle is approximately 30 degrees.
Claim 4
Dependent Claim
20 words
Apparatus as set forth in claim 1, wherein the distance between the mounting means and the deposition source is adjustable.
Claim 5
Dependent Claim
29 words
Apparatus as set forth in claim 1, wherein the distance between the mounting means and the deposition source is adjustable as the workpiece rotates relative to the deposition source.
Claim 6
Dependent Claim
28 words
Apparatus as set forth in claim 1, wherein said mounting means has means for moving the workpiece toward and away from the deposition source along a predetermined path.
Claim 7
Dependent Claim
12 words
Apparatus as set forth in claim 5, wherein said path is rectilinear.
Claim 8
Dependent Claim
38 words
Apparatus as set forth in claim 1, wherein said workpiece mounting means includes a first shaft for rotatably mounting the workpiece at said second location, and including a drive means coupled with the shaft for rotating the same.
Claim 9
Dependent Claim
54 words
Apparatus as set forth in claim 7, wherein is included a second shaft coupled to said drive means for mounting the drive means for rotation about an axis generally perpendicular to the axis of the first shaft, and drive structure coupled with the second shaft for rotating the same relative to the deposition source.
Claim 10
Independent Claim
148 words
A method for applying a thin film by sputtering to a film-receiving surface of a workpiece comprising: providing a deposition source in a process chamber with the source having an emission surface arranged in a vertical plane; mounting a workpiece in the process chamber in spaced relationship to the deposition source, said workpiece having a film-receiving surface arranged in a vertical plane; energizing said deposition source for sputtering film forming material from said emission surface; rotating said workpiece relative to the deposition source as the deposition source is energized; and maintaining the emission surface and the film-receiving surface are at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted within the process chamber.
Claim 11
Independent Claim
148 words
A method for applying a thin film by sputtering to a film-receiving surface of a workpiece comprising: providing a deposition source in a process chamber with the source having an emission surface arranged in a vertical plane; mounting a workpiece in the process chamber in spaced relationship to the deposition source, said workpiece having a film-receiving surface arranged in a vertical plane; energizing said deposition source for sputtering film forming material from said emission surface; rotating said workpiece relative to the deposition source as the deposition source is energized; and maintaining the emission surface and the film-receiving surface are at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted within the process chamber.
Claim 12
Dependent Claim
22 words
A method as set forth in claim 9, wherein the rotating step includes rotating the workpiece as the deposition source remains stationary.
Claim 13
Dependent Claim
15 words
A method as set forth in claim 9, wherein the angle is approximately 30 degrees.
Claim 14
Dependent Claim
24 words
A method as set forth in claim 9, wherein is included the step of adjusting the distance between the workpiece and the deposition source.
Claim 15
Dependent Claim
33 words
A method as set forth in claim 9, wherein is included the step of adjusting the distance between the workpiece and the deposition source as the workpiece rotates relative to the deposition source.
Claim 16
Dependent Claim
39 words
A method as set forth in claim 9, wherein is included the step of rotating the workpiece about a first axis relative to the deposition source, and rotating the workpiece about a second axis perpendicular to the first axis.
Claim 17
Dependent Claim
30 words
A method as set forth in claim 14, wherein said step of rotating the workpiece about the second axis includes rocking the workpiece back and forth about said second axis.
Claim 18
Dependent Claim
166 words
Apparatus for applying a thin film by sputtering to an irregular film-receiving surface of a workpiece to provide step coverage thereof, said apparatus comprising: means defining a process chamber; a deposition source in the process chamber at a first location therein, said source having an emission surface disposed in a vertical plane; sputtering means for sputtering film forming material from said emission surface; and means at a second location in the process chamber for mounting a workpiece having an irregular film-receiving surface disposed in a vertical plane for rotation relative to the deposition source, the emission surface and said film-receiving surface being at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted by said mounting means, whereby step coverage of said irregular film-receiving surface by said film forming material is enhanced.
Claim 19
Dependent Claim
166 words
Apparatus for applying a thin film by sputtering to an irregular film-receiving surface of a workpiece to provide step coverage thereof, said apparatus comprising: means defining a process chamber; a deposition source in the process chamber at a first location therein, said source having an emission surface disposed in a vertical plane; sputtering means for sputtering film forming material from said emission surface; and means at a second location in the process chamber for mounting a workpiece having an irregular film-receiving surface disposed in a vertical plane for rotation relative to the deposition source, the emission surface and said film-receiving surface being at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted by said mounting means, whereby step coverage of said irregular film-receiving surface by said film forming material is enhanced.
Claim 20
Independent Claim
175 words
A method for applying a thin film by sputtering to an irregular film-receiving surface of a workpiece to provide step coverage thereof, said method comprising the steps of: providing a deposition source in a process chamber with the source having an emission surface arranged in a vertical plane; mounting a workpiece in the process chamber in spaced relationship to the deposition source, said workpiece having an irregular film-receiving surface arranged in a vertical plane; energizing said deposition source for sputtering film forming material from said emission surface; rotating said workpiece relative to the deposition source as the deposition source is energized; and maintaining the emission surface and the film-receiving surface are at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted within the process chamber, whereby step coverage of said irregular film-receiving surface by said film forming material is enhanced.
Claim 21
Independent Claim
175 words
A method for applying a thin film by sputtering to an irregular film-receiving surface of a workpiece to provide step coverage thereof, said method comprising the steps of: providing a deposition source in a process chamber with the source having an emission surface arranged in a vertical plane; mounting a workpiece in the process chamber in spaced relationship to the deposition source, said workpiece having an irregular film-receiving surface arranged in a vertical plane; energizing said deposition source for sputtering film forming material from said emission surface; rotating said workpiece relative to the deposition source as the deposition source is energized; and maintaining the emission surface and the film-receiving surface are at an angle in the range of about 10 to 45 degrees, said angle defined between an imaginary line perpendicular to the emission surface of the deposition source and an imaginary line perpendicular to the film-receiving surface of the workpiece when the workpiece is mounted within the process chamber, whereby step coverage of said irregular film-receiving surface by said film forming material is enhanced.
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| 3.5 Years (Year 4) | 1990-05-11 | 1990-11-10 | 1991-05-12 | $2000.00 | Window Closed / Lapsed |
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