Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
188 words
A semiconductor laser device comprising: an InP substrate of a first conductivity type; a first InP current blocking layer of a second conductivity type opposite said first conductivity type disposed on said substrate; an InP buried layer of said first conductivity type disposed on said substrate, surrounded by said first current blocking layer, and having the same thickness as said first current blocking layer; a ridge including a double heterojunction structure comprising a first InP cladding layer of said first conductivity type, an InGaAsP active layer, and a second InP cladding layer of said second conductivity type, said first cladding layer, said active layer, and said second cladding layer being substantially planar and stacked in the named order on said InP buried layer, said ridge and InP buried layer each having a width, said widths being substantially the same; a second InP current blocking layer of said first conductivity type disposed on said first InP current blocking layer surrounding said ridge; and a contact layer of said second conductivity type disposed opposite and in contact with said second InP current blocking layer and said second InP cladding layer.
Claim 2
Dependent Claim
188 words
A semiconductor laser device comprising: an InP substrate of a first conductivity type; a first InP current blocking layer of a second conductivity type opposite said first conductivity type disposed on said substrate; an InP buried layer of said first conductivity type disposed on said substrate, surrounded by said first current blocking layer, and having the same thickness as said first current blocking layer; a ridge including a double heterojunction structure comprising a first InP cladding layer of said first conductivity type, an InGaAsP active layer, and a second InP cladding layer of said second conductivity type, said first cladding layer, said active layer, and said second cladding layer being substantially planar and stacked in the named order on said InP buried layer, said ridge and InP buried layer each having a width, said widths being substantially the same; a second InP current blocking layer of said first conductivity type disposed on said first InP current blocking layer surrounding said ridge; and a contact layer of said second conductivity type disposed opposite and in contact with said second InP current blocking layer and said second InP cladding layer.
Claim 3
Dependent Claim
51 words
A semiconductor laser device according to claim 1 wherein said first InP current blocking layer and said InP buried layer surrounded by said first InP current blocking layer are disposed on said InP substrate of said first conductivity type with an InP buffer layer of said first conductivity type disposed therebetween.
Claim 4
Dependent Claim
201 words
A semiconductor laser device comprising: an InP substrate of a first conductivity type; a first InP current blocking layer of a second conductivity type opposite said first conductivity type disposed on said substrate; an InP buried layer of said first conductivity type disposed on said substrate, surrounded by said first current blocking layer, and having the same thickness as said first current blocking layer; a ridge including a double heterojunction structure comprising a first InP cladding layer of said first conductivity type, an InGaAsP active layer, and a second InP cladding layer of said second conductivity type, said first cladding layer, said active layer, and said second cladding layer being substantially planar and stacked in the named order on said InP buried layer, said ridge and InP buried layer each having a width, said widths being substantially the same; a second InP current blocking layer of said first conductivity type disposed on said first InP current blocking layer surrounding said ridge; a contact layer of said second conductivity type disposed opposite and in contact with said second InP current blocking layer and said second InP cladding layer; and a diffraction grating layer of InGaAsP disposed in said second InP cladding layer.
Claim 5
Dependent Claim
201 words
A semiconductor laser device comprising: an InP substrate of a first conductivity type; a first InP current blocking layer of a second conductivity type opposite said first conductivity type disposed on said substrate; an InP buried layer of said first conductivity type disposed on said substrate, surrounded by said first current blocking layer, and having the same thickness as said first current blocking layer; a ridge including a double heterojunction structure comprising a first InP cladding layer of said first conductivity type, an InGaAsP active layer, and a second InP cladding layer of said second conductivity type, said first cladding layer, said active layer, and said second cladding layer being substantially planar and stacked in the named order on said InP buried layer, said ridge and InP buried layer each having a width, said widths being substantially the same; a second InP current blocking layer of said first conductivity type disposed on said first InP current blocking layer surrounding said ridge; a contact layer of said second conductivity type disposed opposite and in contact with said second InP current blocking layer and said second InP cladding layer; and a diffraction grating layer of InGaAsP disposed in said second InP cladding layer.
Claim 6
Dependent Claim
51 words
A semiconductor laser device according to claim 3 wherein said first InP current blocking layer and said InP buried layer surrounded by said first InP current blocking layer are disposed on said InP substrate of said first conductivity type with an InP buffer layer of said first conductivity type disposed therebetween.