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US5102720A Expired / Lapsed US ⏱️ 0.0 years remaining

Co-fired multilayer ceramic tapes that exhibit constrained sintering

Assignee: Cornell Research Foundation Inc
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Filing: 1989-09-22
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Granted: 1992-04-07
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Expires: 2009-09-22
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Abstract

Abstract Shrinkage is substantially reduced or eliminated in the x-y plane during co-firing interposing predominantly ceramic layer between predominantly glass layers in the green multilayer assembly. The ceramic is preferably aluminum nitride.

Inventors

  • 👤 Rishi Raj

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-23 13:54
CPC Classifications
C; C04; C04B; C04B35/00; C04B35/515; C04B35/58; C04B35/581; B; B32; B32B; B32B18/00; C04B35/622; C04B35/64; C04B35/645; H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W99/00; C04B2235/00; C04B2235/65; C04B2235/656; C04B2235/6567; C04B2237/00; C04B2237/30; C04B2237/32; C04B2237/34; C04B2237/341; C04B2237/343; C04B2237/345; C04B2237/346; C04B2237/36; C04B2237/363; C04B2237/365; C04B2237/366; C04B2237/50; C04B2237/68; C04B2237/70; C04B2237/704; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24917; Y10T428/24926; Y10T428/25

Claims Analysis

Total Claims: 24
Claim 1
Independent Claim 121 words
A multilayer green substrate assembly for sintering to provide a multilayer circuit, said multilayer green substrate comprising: (a) at least one layer predominantly containing glass particles held together by an organic binder; (b) at least one layer predominantly containing ceramic particles held together by an organic binder, said ceramic particles being composed of ceramic material which is wetted by the glass without significant dissolution or sintering, being such as to remain rigid at sintering temperatures and being such as to stabilize the substrate against shrinkage in the x-y plane on sintering and to substantially constrain shrinkage on sintering to the z-direction; (c) at least one layer of (a) or (b) or (a) and (b) being printed with a metal conductive pattern.
Claim 2
Dependent Claim 121 words
A multilayer green substrate assembly for sintering to provide a multilayer circuit, said multilayer green substrate comprising: (a) at least one layer predominantly containing glass particles held together by an organic binder; (b) at least one layer predominantly containing ceramic particles held together by an organic binder, said ceramic particles being composed of ceramic material which is wetted by the glass without significant dissolution or sintering, being such as to remain rigid at sintering temperatures and being such as to stabilize the substrate against shrinkage in the x-y plane on sintering and to substantially constrain shrinkage on sintering to the z-direction; (c) at least one layer of (a) or (b) or (a) and (b) being printed with a metal conductive pattern.
Claim 3
Dependent Claim 40 words
The substrate of claim 1 wherein each layer (a) contains on a glass plus ceramic basis at least 60% by volume glass and wherein each layer (b) contains on a glass plus ceramic basis at least 60% by volume ceramic.
Claim 4
Dependent Claim 19 words
The substrate of claim 2 wherein said glass has a sintering temperature ranging from 600° C. to 1500° C.
Claim 5
Dependent Claim 19 words
The substrate of claim 3 wherein said glass has a sintering temperature ranging from 800° C. to 900° C.
Claim 6
Dependent Claim 20 words
The substrate of claim 2 wherein said ceramic is selected from the group consisting of carbides, nitrides, oxides and borides.
Claim 7
Dependent Claim 11 words
The substrate of claim 5 wherein said ceramic is aluminum nitride.
Claim 8
Dependent Claim 14 words
The substrate of claim 4 wherein said ceramic is diamond or poorly crystallized carbon.
Claim 9
Dependent Claim 31 words
The substrate of claim 2 wherein each layer (b) contains on a glass plus ceramic basis from 10% to 30% by volume glass and from 90% to 70% by volume ceramic.
Claim 10
Dependent Claim 92 words
A multilayer substrate for mounting of electronic or opto-electronic components, said substrate comprising (a) at least one layer which has a glass matrix and has a porosity from 0 to 10% by volume and contains from 0 to 60% by volume ceramic; (b) at least one layer which contains at least 60% by volume ceramic particles with the remainder being any combination of porosity and glass; the ceramic of (a) and the ceramic particles of (b) being composed of ceramic material which is wetted by the glass without significant dissolution or sintering.
Claim 11
Dependent Claim 92 words
A multilayer substrate for mounting of electronic or opto-electronic components, said substrate comprising (a) at least one layer which has a glass matrix and has a porosity from 0 to 10% by volume and contains from 0 to 60% by volume ceramic; (b) at least one layer which contains at least 60% by volume ceramic particles with the remainder being any combination of porosity and glass; the ceramic of (a) and the ceramic particles of (b) being composed of ceramic material which is wetted by the glass without significant dissolution or sintering.
Claim 12
Dependent Claim 8 words
The substrate of claim 9 which is self-supporting.
Claim 13
Dependent Claim 22 words
The substrate of claim 9 which is built on a monolithic ceramic substrate of ceramic selected from carbides, nitrides, oxides and borides.
Claim 14
Dependent Claim 24 words
The substrate of claim 9 wherein at least one of (a) or (b) or (a) and (b) is printed with a metal conductive pattern.
Claim 15
Dependent Claim 30 words
The substrate of claim 9 wherein the layer (a) has a low dielectric constant and the layer (b) has either a low or high dielectric constant or is a resistor.
Claim 16
Dependent Claim 12 words
The substrate of claim 13 wherein the layer (b) has electro-optic properties.
Claim 17
Dependent Claim 102 words
A multilayer green substrate assembly for fabrication of multilayer packages with metal circuits, said multilayer green substrate comprising: (a) at least one layer predominantly containing glass particles held together by an organic binder; (b) at least one layer predominantly containing ceramic particles held together by an organic binder, said ceramic particles being composed of ceramic material which is wetted by the glass without significant dissolution or sintering, being such as to remain rigid at sintering temperatures and being such as to stabilize the substrate against shrinkage in the x-y plane on sintering and to substantially constrain shrinkage on sintering to the z-direction.
Claim 18
Dependent Claim 102 words
A multilayer green substrate assembly for fabrication of multilayer packages with metal circuits, said multilayer green substrate comprising: (a) at least one layer predominantly containing glass particles held together by an organic binder; (b) at least one layer predominantly containing ceramic particles held together by an organic binder, said ceramic particles being composed of ceramic material which is wetted by the glass without significant dissolution or sintering, being such as to remain rigid at sintering temperatures and being such as to stabilize the substrate against shrinkage in the x-y plane on sintering and to substantially constrain shrinkage on sintering to the z-direction.
Claim 19
Dependent Claim 52 words
The assembly of claim 15 which consists of a three layer structure where the outer layers are layers (a) which contain on a glass plus ceramic basis at least 60% by volume glass and a middle layer (b) which contains on a glass plus ceramic basis at least 60% by volume ceramic.
Claim 20
Dependent Claim 84 words
In the method for producing a self standing substrate for a multilayer circuit which method comprises the steps of tape casting, screen printing, stacking, laminating, and removing organic binder to provide a green multilayer assembly comprising glass and ceramic which is composed of material which is wetted by the glass without significant dissolution or sintering, and co-firing, the improvements comprising co-firing under a pressure applied in the z-direction and with shrinkage essentially only in the z-direction and essentially no shrinkage in the x-y plane.
Claim 21
Dependent Claim 84 words
In the method for producing a self standing substrate for a multilayer circuit which method comprises the steps of tape casting, screen printing, stacking, laminating, and removing organic binder to provide a green multilayer assembly comprising glass and ceramic which is composed of material which is wetted by the glass without significant dissolution or sintering, and co-firing, the improvements comprising co-firing under a pressure applied in the z-direction and with shrinkage essentially only in the z-direction and essentially no shrinkage in the x-y plane.
Claim 22
Dependent Claim 44 words
The method of claim 17 wherein the co-firing is carried out with the green multi-layer assembly built on a monolithic ceramic substrate thereby to provide greater reliability by the elimination of delamination and interface defects that otherwise result from shrinkage in the x-y plane.
Claim 23
Dependent Claim 39 words
The method of claim 18 wherein co-firing is carried out under a pressure applied in the z-direction in the range of 3 to 30 psi thereby to prevent warping and improve adhesion between layers and said monolithic ceramic substrate.
Claim 24
Dependent Claim 38 words
The method of claim 17 where co-firing is carried out under a pressure applied in the z-direction in the range of 3 to 30 psi thereby to improve adhesion between layers and to reduce the possibility of warping.

References Cited (Backward Citations)

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USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1995-04-07 1995-10-07 1996-04-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1999-04-07 1999-10-07 2000-04-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2003-04-07 2003-10-07 2004-04-07 $7700.00 Window Closed / Lapsed

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