US5095357A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Inductive structures for semiconductor integrated circuits
Assignee: Mitsubishi Electric Corp
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Filing: 1990-08-14
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Granted: 1992-03-10
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Expires: 2010-08-14
Abstract
Abstract Inductive structures having low parasitic capacitances for direct integration in semiconductor integrated circuits. In one embodiment, a generally planar spiral winding is disposed on the surface of a substrate. An electrical connection to the internal end of the spiral is made through electrically conducting vias passing through the substrate. The spiral may be spaced from a substrate surface by a plurality of spaced apart electrically conductive posts having a staggered arrangement between adjacent windings of the spiral. A transformer includes two windings disposed on top of each other on a semiconductor substrate and separated by an electrically insulating film. The windings have a common central opening in which a magnetic material is disposed to improve the inductive coupling between the windings. The transformer may include two helical windings, one surrounding another, each formed with vias and electrical conductors, the inner winding being formed in and on a semiconductor substrate and the outer winding being formed on insulating films disposed on the substrate and extending through the films and substrate. A variable inductor includes inductively coupled spiral windings separated by an insulating film and a current control for controlling the current through one of the spirals and, thereby, the effective inductance of the other spiral.
Inventors
- 👤 Naoto Andoh
- 👤 Akira Inoue
- 👤 Yasuharu Nakajima
- 👤 Kazuhiko Nakahara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 23:52
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/20; H01; H01F; H01F17/00; H01F17/0006; H01F17/0033; H01F21/00; H01F21/02; H01F21/08; H01F27/00; H01F27/28; H01F27/2804; H10W; H10W44/00; H10W44/501; H01F2017/004; H01F2017/0046; H01F2017/0086
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
156 words
An inductive structure integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; an electrical conductor disposed in a first spiral on the first surface of the substrate, the spiral including an external end disposed outside the spiral as a first lead and an internal end disposed within the spiral; first and second electrically conducting vias passing through the substrate from the first to the second surface, the first via intersecting and establishing an electrical connection to the internal end of the first spiral, the second via lying outside the spiral; an electrically conducting connector disposed on the second surface of the substrate electrically connecting the first and second vias; and a second lead disposed on the first surface of the substrate outside the first spiral electrically connected to the second via whereby electrical connections to the inductive structure can be made on the first surface of the substrate.
Claim 2
Dependent Claim
156 words
An inductive structure integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; an electrical conductor disposed in a first spiral on the first surface of the substrate, the spiral including an external end disposed outside the spiral as a first lead and an internal end disposed within the spiral; first and second electrically conducting vias passing through the substrate from the first to the second surface, the first via intersecting and establishing an electrical connection to the internal end of the first spiral, the second via lying outside the spiral; an electrically conducting connector disposed on the second surface of the substrate electrically connecting the first and second vias; and a second lead disposed on the first surface of the substrate outside the first spiral electrically connected to the second via whereby electrical connections to the inductive structure can be made on the first surface of the substrate.
Claim 3
Dependent Claim
25 words
The inductive structure of claim 1 wherein the electrically conducting connector disposed on the second surface of the substrate is disposed in a second spiral.
Claim 4
Dependent Claim
25 words
The inductive structure of claim 2 wherein the second spiral, when projected onto the first surface of the substrate, is interleaved with the first spiral.
Claim 5
Dependent Claim
14 words
The inductive structure of claim 1 wherein the substrate is an electrically insulating semiconductor.
Claim 6
Dependent Claim
21 words
The inductive structure of claim 4 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.
Claim 7
Dependent Claim
107 words
An inductive structure integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; an electrical conductor disposed in a spiral spaced from the first surface of the substrate, the spiral including an external end disposed outside the spiral as a first lead and an internal end disposed within the spiral, said first spiral including at least two windings adjacent each other; and a plurality of electrically conducting, spaced apart posts disposed on the first surface of the substrate contacting and supporting the first spiral wherein each post supporting one winding is disposed intermediate two adjacent posts supporting an adjacent winding.
Claim 8
Dependent Claim
107 words
An inductive structure integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; an electrical conductor disposed in a spiral spaced from the first surface of the substrate, the spiral including an external end disposed outside the spiral as a first lead and an internal end disposed within the spiral, said first spiral including at least two windings adjacent each other; and a plurality of electrically conducting, spaced apart posts disposed on the first surface of the substrate contacting and supporting the first spiral wherein each post supporting one winding is disposed intermediate two adjacent posts supporting an adjacent winding.
Claim 9
Dependent Claim
104 words
The inductive structure of claim 6 including first and second electrically conducting vias passing through the substrate from the first to the second surface, the first via intersecting and establishing an electrical connection to the internal end of the spiral; the second via lying outside the spiral; an electrically conducting connector disposed on the second surface of the substrate electrically connecting the first and second vias; and a second lead disposed on the first surface of the substrate outside the spiral electrically connected to the second via whereby electrical connections to the inductive structure can be made on the first surface of the substrate.
Claim 10
Dependent Claim
14 words
The inductive structure of claim 6 wherein the substrate is an electrically insulating semiconductor.
Claim 11
Dependent Claim
21 words
The inductive structure of claim 8 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.
Claim 12
Dependent Claim
138 words
A transformer integrable with a semiconductor integrated circuit comprising: an electrically insulating semiconductor substrate having a first surface; a first electrical conductor disposed on the first surface of the substrate comprising a first winding having a first pair of leads; a first electrically insulating film disposed on the first electrical conductor; a second electrical conductor disposed on the electrically insulating film comprising a second winding having a second pair of leads, the first and second windings and the electrically insulating film including a common central opening wherein the pairs of leads of the first and second windings are oriented in different directions to minimize the coupling between the respective pairs of leads; and a magnetic material disposed on the surface of the substrate in the common central opening increasing the inductive coupling between the first and second windings.
Claim 13
Dependent Claim
138 words
A transformer integrable with a semiconductor integrated circuit comprising: an electrically insulating semiconductor substrate having a first surface; a first electrical conductor disposed on the first surface of the substrate comprising a first winding having a first pair of leads; a first electrically insulating film disposed on the first electrical conductor; a second electrical conductor disposed on the electrically insulating film comprising a second winding having a second pair of leads, the first and second windings and the electrically insulating film including a common central opening wherein the pairs of leads of the first and second windings are oriented in different directions to minimize the coupling between the respective pairs of leads; and a magnetic material disposed on the surface of the substrate in the common central opening increasing the inductive coupling between the first and second windings.
Claim 14
Dependent Claim
13 words
The transformer of claim 10 wherein the magnetic material is a ferrite body.
Claim 15
Dependent Claim
20 words
The transformer of claim 10 wherein the electrically insulating film is chosen from the group consisting of SiN and SiON.
Claim 16
Dependent Claim
20 words
The transformer of claim 10 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.
Claim 17
Dependent Claim
70 words
The transformer of claim 10 including a second electrically insulating film disposed on the second electrical conductor and a third electrical conductor disposed on the second electrically insulating film opposite the second electrical conductor comprising a third winding and a third pair of leads, the second electrically insulating film and the third electrical conductor having respective central openings aligned with the common central opening of the first and second windings.
Claim 18
Dependent Claim
244 words
A transformer integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; a plurality of first electrically conducting vias passing through the substrate from the first to the second surface; at least one first and second electrical conductor respectively disposed on the first and second surfaces of the substrate, each of the first and second conductors electrically connecting two vias to form a first helical winding comprising the first and second electrical conductors and the first vias; first and second electrically conducting leads disposed on at least one of the first and second surfaces of the substrate respectively electrically connected to one of the first vias; first and second electrically insulating films disposed on the first and second surfaces of the substrate, respectively, at least partially covering the first and second electrical conductors and first and second leads; a plurality of second electrically conducting vias passing through the first and second electrically insulating films and the electrically insulating substrate; at least one third and fourth electrical conductor respectively disposed on the first and second electrically insulating films, each of the third and fourth conductors electrically connecting two of the second vias to form a second helical winding comprising the third and fourth electrical conductors and the second vias; and third and fourth electrically conducting leads disposed on at least one of the first and second electrically insulating films respectively electrically connected to one of the second vias.
Claim 19
Dependent Claim
244 words
A transformer integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; a plurality of first electrically conducting vias passing through the substrate from the first to the second surface; at least one first and second electrical conductor respectively disposed on the first and second surfaces of the substrate, each of the first and second conductors electrically connecting two vias to form a first helical winding comprising the first and second electrical conductors and the first vias; first and second electrically conducting leads disposed on at least one of the first and second surfaces of the substrate respectively electrically connected to one of the first vias; first and second electrically insulating films disposed on the first and second surfaces of the substrate, respectively, at least partially covering the first and second electrical conductors and first and second leads; a plurality of second electrically conducting vias passing through the first and second electrically insulating films and the electrically insulating substrate; at least one third and fourth electrical conductor respectively disposed on the first and second electrically insulating films, each of the third and fourth conductors electrically connecting two of the second vias to form a second helical winding comprising the third and fourth electrical conductors and the second vias; and third and fourth electrically conducting leads disposed on at least one of the first and second electrically insulating films respectively electrically connected to one of the second vias.
Claim 20
Dependent Claim
15 words
The transformer of claim 15 wherein the electrically insulating substrate is an electrically insulating semiconductor.
Claim 21
Dependent Claim
20 words
The transformer of claim 15 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.
Claim 22
Dependent Claim
15 words
The transformer of claim 15 wherein the second helical winding surrounds the first helical winding.
Claim 23
Dependent Claim
26 words
The transformer of claim 15 including a magnetic material disposed within the first helical winding increasing the inductive coupling between the first and second helical windings.
Claim 24
Dependent Claim
13 words
The transformer of claim 19 wherein the magnetic material is a ferrite body.
Claim 25
Dependent Claim
134 words
A two terminal variable inductance element integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; a first electrical conductor disposed in a first spiral on the first surface of the substrate; means for producing and controlling a variable electrical current flow through the first conductor; an electrically insulating film disposed on the first surface and the first spiral; and a second electrical conductor having first and second terminals, disposed in a second spiral on the electrically insulating film, and inductively coupled to the first spiral, the first and second terminals of the second electrical conductor constituting the terminals of the two terminal variable inductance element whereby the inductance between the first and second terminals is controlled by the electrical current flow through the first electrical conductor.
Claim 26
Dependent Claim
134 words
A two terminal variable inductance element integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; a first electrical conductor disposed in a first spiral on the first surface of the substrate; means for producing and controlling a variable electrical current flow through the first conductor; an electrically insulating film disposed on the first surface and the first spiral; and a second electrical conductor having first and second terminals, disposed in a second spiral on the electrically insulating film, and inductively coupled to the first spiral, the first and second terminals of the second electrical conductor constituting the terminals of the two terminal variable inductance element whereby the inductance between the first and second terminals is controlled by the electrical current flow through the first electrical conductor.
Claim 27
Dependent Claim
15 words
The variable inductance element of claim 21 wherein the substrate is an electrically insulating semiconductor.
Claim 28
Dependent Claim
22 words
The variable inductance element of claim 22 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.
Claim 29
Dependent Claim
154 words
A variable inductance element integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; an electrical conductor disposed in a first spiral on the first surface of the substrate; an electrically insulating film disposed on the first surface and the first spiral; a second electrical conductor disposed in a second spiral on the electrically insulating film and inductively coupled to the first spiral, each of the first and second spirals having respective first and second ends; an electrically conducting first via penetrating the electrically insulating film electrically connecting the first end of the first spiral to the first end of the second spiral; and an electrically conducting ground plane disposed on the second surface of the substrate and a second electrically conducting via passing through the substrate from the first to the second surface electrically connecting the second end of the first spiral to the ground plane.
Claim 30
Dependent Claim
154 words
A variable inductance element integrable with a semiconductor integrated circuit comprising: an electrically insulating substrate having opposed first and second surfaces; an electrical conductor disposed in a first spiral on the first surface of the substrate; an electrically insulating film disposed on the first surface and the first spiral; a second electrical conductor disposed in a second spiral on the electrically insulating film and inductively coupled to the first spiral, each of the first and second spirals having respective first and second ends; an electrically conducting first via penetrating the electrically insulating film electrically connecting the first end of the first spiral to the first end of the second spiral; and an electrically conducting ground plane disposed on the second surface of the substrate and a second electrically conducting via passing through the substrate from the first to the second surface electrically connecting the second end of the first spiral to the ground plane.
Claim 31
Dependent Claim
15 words
The variable inductance element of claim 24 wherein the substrate is an electrically insulating semiconductor.
Claim 32
Dependent Claim
22 words
The variable inductance element of claim 25 wherein the substrate is chosen from the group consisting of gallium arsenide and indium phosphide.
Claim 33
Dependent Claim
46 words
The variable inductance element of claim 24 including means for controlling the flow of current through the second spiral serially connected to the first end of the second spiral and an electrical termination connected between the second end of the first spiral and the ground plane.
Claim 34
Dependent Claim
24 words
The variable inductance element of claim 27 wherein the means for controlling is selected from the group consisting of an attenuator and an amplifier.
References Cited (Backward Citations)
US3881244A
Cited
JPS60136156A
Cited
US4833513A
Cited
JPS61248545A
Cited
JPS61294850A
Cited
JPS62244160A
Cited
US4785345A
Cited
JPS63140560A
Cited
JPS63250165A
Cited
JPH0267752A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-03-10 | 1995-09-09 | 1996-03-10 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-03-10 | 1999-09-09 | 2000-03-10 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-03-10 | 2003-09-09 | 2004-03-10 | $7700.00 | Window Closed / Lapsed |