US5088006A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Liquid film interface cooling system for semiconductor wafer processing
Assignee: International Business Machines Corp
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Filing: 1991-04-25
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Granted: 1992-02-11
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Expires: 2011-04-25
Abstract
Abstract A semiconductor wafer, liquid interface clamping and cooling system 80 includes a chuck 10 having clamping section 12 with a top surface 16 with three clamping/cooling circuit grooves machined therein for providing a liquid interface between a wafer under test and the top surface 16. A bottom surface 64 of the clamping section has a double spiral cooling circuit machined therein for providing backside cooling. A source vessel 110 maintained at atmospheric pressure provides fluid to the top surface clamping/cooling circuits and a collection vessel 112 maintained at house vacuum pressure collects the fluid. A set of processor controlled valves 114, 118, 128, 130, 132, 141, 142 144, 158 and 164 control the fluid in a preprogrammed sequence. A chiller system 82 and pump 90 provide temperature regulated fluid flow to the clamping section 12 bottom surface 64.
Inventors
- 👤 Santiago E. del Puerto
- 👤 Paul M. Gaschke
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 00:49
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/70; H10P72/78
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
159 words
A cooling system for a substrate comprising: a chuck having a top and a bottom, said top having a liquid interface cooling circuit means adapted to provide a liquid interface between said chuck and the substrate, said liquid interface cooling circuit means having an input means and an output means; a source vessel connected to said input means for providing a first liquid to said liquid interface cooling circuit means, said source vessel maintaining said first liquid at atmospheric pressure; and, a collection vessel connected to said output means for collecting said first liquid, said collection vessel maintaining collected fluid below atmospheric pressure to thereby cause liquid to flow from said source vessel through said liquid interface cooling circuit means and into said collection vessel, wherein said liquid interface is adapted to provide both a clamping force to the substrate in order to clamp the substrate to said chuck and a cooling interface in order to cool the substrate.
Claim 2
Dependent Claim
159 words
A cooling system for a substrate comprising: a chuck having a top and a bottom, said top having a liquid interface cooling circuit means adapted to provide a liquid interface between said chuck and the substrate, said liquid interface cooling circuit means having an input means and an output means; a source vessel connected to said input means for providing a first liquid to said liquid interface cooling circuit means, said source vessel maintaining said first liquid at atmospheric pressure; and, a collection vessel connected to said output means for collecting said first liquid, said collection vessel maintaining collected fluid below atmospheric pressure to thereby cause liquid to flow from said source vessel through said liquid interface cooling circuit means and into said collection vessel, wherein said liquid interface is adapted to provide both a clamping force to the substrate in order to clamp the substrate to said chuck and a cooling interface in order to cool the substrate.
Claim 3
Dependent Claim
40 words
A cooling system for a substrate according to claim 1, further comprising: said bottom having a backside cooling circuit means for transferring heat away from said top; pump means for pumping a second liquid through said backside cooling circuit means.
Claim 4
Dependent Claim
22 words
A cooling system for a substrate according to claim 2, further comprising: chiller/heater means for regulating the temperature of said second liquid.
Claim 5
Dependent Claim
42 words
A cooling system for a substrate according to claim 1, further comprising: first valve means connected between said source vessel and said liquid interface cooling circuit means, for controlling the flow of said first liquid to said liquid interface cooling circuit means.
Claim 6
Dependent Claim
39 words
A cooling system for a substrate according to claim 1, further comprising: second valve means connected between said liquid interface cooling circuit means and said collection vessel for controlling the flow of said first liquid to said collection vessel.
Claim 7
Dependent Claim
48 words
A cooling system for a substrate according to claim 4, further comprising: third valve means connected between said first valve means and said liquid interface cooling circuit means, for providing to said first circuit either: a) said first liquid; b) gas at room atmosphere; or, c) pressurized gas.
Claim 8
Dependent Claim
42 words
A cooling system for a substrate according to claim 1, further comprising: sealing means disposed in said top for providing a vacuum seal around said liquid interface cooling circuit means, and, connection means for connecting said sealing means to said collection vessel.
Claim 9
Dependent Claim
29 words
A cooling system for a substrate according to claim 7, further comprising: fourth valve means connected between said sealing means and said collection vessel for controlling said vacuum seal
Claim 10
Dependent Claim
297 words
A cooling system for a substrate comprising: a chuck having a top and a bottom, side top having a liquid interface cooling circuit means adapted to provide a liquid interface between said chuck and the substrate, and said liquid interface cooling circuit means having a first input means and a first output means; a source vessel connected to said first input means for providing a first liquid to said liquid interface cooling circuit means, said source vessel being maintained at atmospheric pressure; a collection vessel connected to said first output means for collecting said first liquid, said collection vessel being maintained below atmospheric pressure to thereby cause liquid to flow from said source vessel through said liquid interface cooling circuit means and into said collection vessel; first valve means connected between said source vessel and said liquid interface cooling circuit means, for controlling the flow of said first liquid to said liquid interface cooling circuit means; second valve means connected between said liquid interface cooling circuit means and said collection vessel for controlling the flow of said first liquid to said collection vessel; third valve means connected between said first valve means and said liquid interface cooling circuit means, for providing either said first liquid, gas at room atmosphere, or pressurized gas to said first circuit; sealing means disposed in said top for providing a vacuum seal around said liquid interface cooling circuit means; connection means for connecting said sealing means to said collection vessel; and, fourth valve means connected between said sealing means and said collection vessel for controlling said vacuum seal, wherein said liquid interface is adapted to provide both a clamping force to the substrate in order to clamp the substrate to said chuck and a cooling interface in order to cool the substrate.
Claim 11
Dependent Claim
297 words
A cooling system for a substrate comprising: a chuck having a top and a bottom, side top having a liquid interface cooling circuit means adapted to provide a liquid interface between said chuck and the substrate, and said liquid interface cooling circuit means having a first input means and a first output means; a source vessel connected to said first input means for providing a first liquid to said liquid interface cooling circuit means, said source vessel being maintained at atmospheric pressure; a collection vessel connected to said first output means for collecting said first liquid, said collection vessel being maintained below atmospheric pressure to thereby cause liquid to flow from said source vessel through said liquid interface cooling circuit means and into said collection vessel; first valve means connected between said source vessel and said liquid interface cooling circuit means, for controlling the flow of said first liquid to said liquid interface cooling circuit means; second valve means connected between said liquid interface cooling circuit means and said collection vessel for controlling the flow of said first liquid to said collection vessel; third valve means connected between said first valve means and said liquid interface cooling circuit means, for providing either said first liquid, gas at room atmosphere, or pressurized gas to said first circuit; sealing means disposed in said top for providing a vacuum seal around said liquid interface cooling circuit means; connection means for connecting said sealing means to said collection vessel; and, fourth valve means connected between said sealing means and said collection vessel for controlling said vacuum seal, wherein said liquid interface is adapted to provide both a clamping force to the substrate in order to clamp the substrate to said chuck and a cooling interface in order to cool the substrate.
Claim 12
Dependent Claim
41 words
A cooling system for a substrate according to claim 9, wherein said valve means are responsive to electrical signals, and further comprising: processor means responsive to a predetermined programmed control sequence for providing said electrical signals for controlling said valve means.
Claim 13
Dependent Claim
35 words
A cooling system for a substrate according to claims 1, 2, 3, 4, 5, 6, 7, or 8, wherein said liquid interface cooling circuit means is comprised of a plurality of liquid interface cooling circuits.
Claim 14
Dependent Claim
29 words
A cooling system for a substrate according to claims 9 or 10, wherein said liquid interface cooling circuit means is comprised of a plurality of liquid interface cooling circuits.
References Cited (Backward Citations)
US4019098A
Cited
US4559580A
Cited
US4920574A
Cited
US4750086A
Cited
US4897762A
Cited
US4942497A
Cited
US4918928A
Cited
US4969168A
Cited
US4956746A
Cited
US4967832A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1995-02-10 | 1995-08-12 | 1996-02-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1999-02-10 | 1999-08-12 | 2000-02-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2003-02-10 | 2003-08-12 | 2004-02-11 | $7700.00 | Window Closed / Lapsed |